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onsemi CSPESD304G
- Part No.:
- CSPESD304G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
CSPESD304G.pdf
- Description:
- TVS DIODE 15VC 5CSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,932
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Product details
Overview
CSPESD304 from onsemi is a quad-channel ESD protection diode array in a 5-bump WLCSP package (0.96 mm × 1.33 mm), rated for ±15 kV IEC 61000−4−2 contact discharge and ±30 kV HBM ESD suppression, with 22–32 pF diode capacitance and 5.5 V reverse breakdown voltage - deployed for I/O port and keypad protection in wireless handsets and portable electronics.
For engineers reviewing the CSPESD304 datasheet, pinout, applications, or equivalent options, key selection considerations include channel count, clamping voltage (+15 V / −8 V under 8 kV HBM), low-capacitance signal integrity preservation, GND-referenced bidirectional protection architecture, and WLCSP5 footprint compatibility with high-density portable PCB layouts.
Technical Context
The CSPESD304 implements four independent, GND-referenced bidirectional ESD protection diodes in a monolithic silicon structure. Each channel features a low-leakage (≤100 nA at 3.3 V) PN junction with 5.5 V nominal reverse breakdown and tight clamping performance (+15 V / −8 V at 8 kV HBM pulse).
Its 5-bump WLCSP5 package delivers ultra-low parasitic inductance and 22–32 pF capacitance per channel at 2.5 V reverse bias - enabling effective high-speed transient suppression without signal distortion on USB, audio, or button interface lines in space-constrained portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±15 kV contact discharge - meets Level 4 immunity for handheld device interfaces |
| ESD Rating (HBM) | ±30 kV - exceeds MIL−STD−883 Method 3015 requirement for robust handling |
| Clamping Voltage (8 kV HBM) | +15 V / −8 V - limits transient overvoltage to safe levels for 3.3 V logic I/O |
| Diode Capacitance | 22–32 pF at 2.5 V reverse bias - preserves signal integrity on high-speed data lines |
| Reverse Breakdown Voltage | 5.5 V min - ensures reliable turn-on before damage threshold of protected ICs |
| Leakage Current | ≤100 nA at 3.3 V - avoids DC loading on sensitive analog or digital inputs |
| Operating Temp Range | −40°C to +85°C - supports full industrial temperature operation in portable devices |
Pinout & Package
Package: WLCSP5 (Chip Scale Package), 0.96 mm × 1.33 mm footprint, 5 solder bumps, lead-free, RoHS compliant. Case number 567AY.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD_1 | Channel 1 anode - connects to protected I/O line (e.g., keypad scan line) |
| A3 | ESD_2 | Channel 2 anode - connects to second protected I/O line (e.g., audio jack sense) |
| B2 | GND | Common cathode reference - must be low-inductance connection to system ground plane |
| C1 | ESD_3 | Channel 3 anode - connects to third protected I/O line (e.g., USB D+) |
| C3 | ESD_4 | Channel 4 anode - connects to fourth protected I/O line (e.g., USB D−) |
Key Features
| Feature | Design Value |
|---|---|
| Quad-channel integration | Four independent ESD paths in single 0.96 mm × 1.33 mm WLCSP - reduces board area vs. discrete diodes |
| Low diode capacitance | 22–32 pF per channel - enables use on 10+ Mbps data lines (e.g., USB 1.1, I²C) without signal degradation |
| GND-referenced clamping | Bidirectional conduction relative to common ground - simplifies layout and eliminates need for dual-rail supply |
| Ultra-low package inductance | WLCSP5 bump geometry minimizes LPKG - critical for sub-nanosecond ESD pulse energy dissipation |
| Pb-free & RoHS compliance | SnAgCu solder balls with OSP finish - meets global environmental regulations and lead-free reflow requirements (260°C peak) |
Applications
| Wireless Handsets | Handheld PCs / PDAs |
|---|---|
Use Scenario: ESD protection for exposed tactile buttons, side keys, and SIM card slot contacts subject to direct human touch. IC Role / Device Role: Transient voltage suppressor placed between each button trace and system GND. Use Value: Prevents latch-up or gate oxide damage in baseband processor GPIOs during ±15 kV contact discharge events. | Use Scenario: Protection of touchscreen controller I²C bus lines (SDA/SCL) and stylus detection inputs. IC Role / Device Role: Low-capacitance clamp on bidirectional data lines operating up to 400 kHz. Use Value: Maintains signal rise/fall times while limiting transients to <±8 V - preserving timing margins and noise immunity. |
| Notebook Keypad & Trackpad | MP3 Player Audio Jack |
Use Scenario: Shielding mechanical keyboard matrix scan lines and trackpad capacitive sensing electrodes from ESD. IC Role / Device Role: Four-channel array covering row/column scan lines and two trackpad sense channels. Use Value: Enables compact routing beneath thin bezels using 0.96 mm × 1.33 mm footprint - no additional decoupling needed. | Use Scenario: Protecting stereo headphone jack tip/ring/sleeve contacts and microphone input from user-handling ESD. IC Role / Device Role: Bidirectional clamp on unbalanced analog audio paths referenced to system GND. Use Value: 22–32 pF capacitance avoids bass roll-off below 20 Hz and preserves SNR >95 dB in line-out path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DRYR | 4-channel, 12 pF typical capacitance, 5.5 V breakdown, ±12 kV IEC, ±30 kV HBM | Lower capacitance suits USB 2.0/HS interfaces; lower IEC rating may require system-level margin analysis | Preferred when <15 pF per channel is mandatory for >480 Mbps signaling |
| ESD5V3U4-2/TR | 4-channel, 35 pF typical capacitance, 5.3 V breakdown, ±15 kV IEC, ±30 kV HBM, SOT-353 package | Larger 2.1 mm × 1.25 mm footprint; higher capacitance limits use to low-speed lines only | Selected when WLCSP assembly capability is unavailable and board space permits larger package |
Compared with TPD4E001DRYR and ESD5V3U4-2/TR, the CSPESD304 offers optimal balance of ultra-compact size (0.96 mm × 1.33 mm), verified ±15 kV IEC compliance, and 22–32 pF capacitance - making it ideal for high-density portable designs where both footprint and ESD margin are constrained.
Availability
CSPESD304 is available at Aetrix Electronics and suitable for wireless handsets, notebook keypad systems, and MP3 player audio interfaces requiring stable component supply across high-volume consumer electronics production cycles.
Supply support for CSPESD304 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power, analog, sensor, and logic solutions for automotive, industrial, cloud, medical, and portable applications.
The CSPESD304 belongs to onsemi's OptiGuard® ESD protection portfolio, engineered specifically for miniaturized, battery-powered consumer electronics demanding high ESD immunity in chip-scale form factors.
FAQ
What is the maximum clamping voltage of the CSPESD304 during ESD events?
The CSPESD304 clamps positive transients to +15 V and negative transients to −8 V under 8 kV HBM ESD stress (MIL−STD−883 Method 3015). This performance is measured with current sourced into the device while referenced to GND, ensuring protected downstream ICs see limited overvoltage. The CSPESD304 maintains this clamping behavior across its full operating temperature range of −40°C to +85°C.
Does the CSPESD304 support bidirectional signal lines like USB D+ and D−?
Yes, the CSPESD304 supports bidirectional signal lines including USB D+ and D−. Its four GND-referenced diodes operate symmetrically - conducting during both positive and negative ESD transients - making it suitable for differential, open-drain, or push-pull interfaces. Each channel exhibits matched forward and reverse clamping characteristics, and its 22–32 pF capacitance ensures minimal impact on signal integrity for USB 1.1 and I²C applications.
What is the recommended PCB pad layout for the CSPESD304 WLCSP5 package?
The CSPESD304 requires non-solder-mask-defined (NSMD) round pads of 0.240 mm diameter, with a 0.290 mm solder mask opening and 0.300 mm laser-cut stencil aperture. Solder paste should be no-clean type with 50/50 flux ratio, and the board finish must be OSP (e.g., Entek Cu Plus 106A). Coplanarity tolerance is ±20 µm, and peak reflow temperature must not exceed 260°C for lead-free processes - all specified in the official CSPESD304 mechanical drawing (Case 567AY).
Is the CSPESD304 RoHS compliant and lead-free?
Yes, the CSPESD304 is fully RoHS compliant and lead-free. It uses SnAgCu solder balls and conforms to JEDEC J-STD-020 moisture sensitivity level (MSL) 1. The device carries the "+" orientation mark indicating Pb-free construction, and its packaging (3500 units per tape-and-reel) complies with onsemi's Pb-free strategy documentation. All materials and plating meet EU RoHS Directive 2011/65/EU and China RoHS requirements.
How does the CSPESD304 compare to discrete ESD diodes in terms of board space and performance?
The CSPESD304 replaces four discrete ESD diodes in a combined 0.96 mm × 1.33 mm area - less than half the footprint of even the smallest SOT-553 quad arrays. Its monolithic WLCSP5 structure provides matched channel parameters, lower interconnect inductance, and tighter capacitance distribution (22–32 pF) versus discrete solutions. Unlike discrete placements, the CSPESD304 eliminates routing skew and ground loop variations, improving consistency of ESD response across all four channels.
CSPESD304G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
CSPESD304G FAQ
1.How can I place an order for CSPESD304G through Aetrix?
Please submit a Request for Quotation (RFQ) for CSPESD304G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSPESD304G reliable?
The price and inventory of CSPESD304G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSPESD304G is usually 5 days.
3.What payment methods are accepted for CSPESD304G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSPESD304G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSPESD304G?
CSPESD304G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSPESD304G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSPESD304G?
For technical support, including CSPESD304G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSPESD304G requirements.
6.How does Aetrix verify that CSPESD304G is sourced from the original manufacturer or authorized distributors?
All CSPESD304G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSPESD304G meets industry standards.
7.What is the process for return or replacement of CSPESD304G?
All CSPESD304G units undergo pre-shipment inspection (PSI). If there is an issue with CSPESD304G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSPESD304G part is unused and in its original packaging.
Return procedure for CSPESD304G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSPESD304G Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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