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Diodes Incorporated D3V3F4U10LP-7
- Part No.:
- D3V3F4U10LP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
D3V3F4U10LP-7.pdf
- Description:
- TVS DIODE 3.3VWM 5VC U-DFN2510
- Quantity:
- Payment:
- Shipping:
Inventory:104,990
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Product details
Overview
D3V3F4U10LP from Diodes Incorporated is a 4-channel ultra-low-capacitance TVS diode array designed for ESD protection of high-speed differential I/O lines. It features 0.5 pF typical channel input capacitance, 5.5 V minimum reverse breakdown voltage, and 5 V clamping voltage at 16 A TLP, making it suitable for USB 3.0/3.1, SATA, and DisplayPort interface protection.
For engineers reviewing the D3V3F4U10LP datasheet, D3V3F4U10LP pinout, D3V3F4U10LP application, or D3V3F4U10LP equivalent, key selection criteria include sub-1 pF channel capacitance, ±12 kV IEC61000-4-2 contact/air ESD rating, low dynamic resistance (0.25 Ω), and U-DFN2510-10 package compatibility with high-density PCB layouts.
Technical Context
This device implements four independent bidirectional TVS diodes in a single monolithic silicon die, each configured between an I/O line and VSS. Its low 0.25 Ω TLP dynamic resistance ensures minimal voltage overshoot during fast ESD transients, while the 3.3 V reverse working voltage aligns with 3.3 V logic rail systems.
The clamping behavior is characterized under both 8/20 µs lightning surge (5 A, 3.5 V VC) and TLP conditions (16 A, 5 V VC), confirming robust dual-threat protection. The U-DFN2510-10 package supports thermal dissipation up to 350 mW with RθJA = 360 °C/W on standard FR-4 layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 4 independent bidirectional ESD protection paths |
| Reverse Working Voltage (VRWM) | 3.3 V - matches standard 3.3 V I/O supply rails without leakage risk |
| Breakdown Voltage (VBR min) | 5.5 V - ensures reliable conduction only above normal signal swing |
| Clamping Voltage (VC @ 16A TLP) | 5 V - limits transient overvoltage to safe levels for 3.3 V transceivers |
| Channel Input Capacitance (CI/O) | 0.5 pF typical - preserves signal integrity up to 10 Gbps (e.g., USB 3.1 Gen 2) |
| ESD Rating (IEC61000-4-2) | ±12 kV contact / ±12 kV air - exceeds industrial immunity requirements |
| TLP Dynamic Resistance (RDIF-R) | 0.25 Ω - minimizes IR drop during ESD event, reducing clamping overshoot |
Pinout & Package
Package: U-DFN2510-10 (2.5 mm × 1.0 mm, 0.5 mm pitch, 10-terminal, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4, 5 | I/O Channel Terminals | Each connects to one protected high-speed data line (e.g., USB TX/RX, SATA+, DP++) |
| 3, 8 | VSS (Ground) | Common cathode reference for all four TVS diodes; must be low-inductance ground plane connection |
| 6, 7, 9, 10 | No Connection | Unused terminals - left floating per design; no internal connection or bond wire |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.5 pF typical per channel - enables use in >5 Gbps serial interfaces without signal degradation |
| Bidirectional clamping | 5 V clamping at ±16 A TLP - protects against both positive and negative ESD events on AC-coupled lines |
| Low dynamic resistance | 0.25 Ω TLP RDIF-R - reduces clamping voltage rise time and peak overshoot during fast transients |
| Lead-free & green compliance | RoHS 2 compliant, halogen/antimony free (<900 ppm Br/Cl, <1000 ppm Sb) - meets IPC-1752A Tier 1 reporting requirements |
Applications
| USB 3.0/3.1 Interface Protection | SATA III Port Protection |
|---|---|
Use Scenario: Protecting differential SuperSpeed TX/RX pairs on host or device side against ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed immediately before the USB PHY, referenced to system ground. Use Value: 0.5 pF capacitance avoids eye diagram closure; 5 V clamping prevents PHY latch-up or damage during ±12 kV contact discharge. | Use Scenario: Safeguarding SATA transmitter/receiver pins on motherboard or storage controller against factory handling and field ESD. IC Role / Device Role / Timing Role: Four-channel TVS array placed at connector edge, with VSS tied to chassis ground plane. Use Value: Matches SATA III 6 Gbps signaling bandwidth; 0.25 Ω dynamic resistance ensures sub-100 ps response to 1 ns ESD pulses. |
| DisplayPort 1.4 Source Protection | PCIe Gen3 Lane Protection |
Use Scenario: Shielding DP++ main link lanes (CH0–CH3) on graphics card output or dock port against electrostatic discharge. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp between each differential lane pair and common ground, minimizing skew impact. Use Value: 0.5 pF per channel maintains differential impedance match; ±12 kV ESD rating satisfies IEC61000-4-2 Level 4 compliance. | Use Scenario: Protecting PCIe Gen3 x4 root complex or endpoint lanes from ESD during board assembly and system integration. IC Role / Device Role / Timing Role: Four-channel TVS array deployed per x4 link, with dedicated VSS pins ensuring low-impedance return path. Use Value: Clamping voltage ≤5 V prevents receiver input overvoltage beyond PCIe CEM v3.0 electrical limits; 350 mW PD supports burst-mode surge handling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 4-channel low-capacitance TVS protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP3204-04UTG | 0.35 pF typical CI/O, 5.2 V VC @ 16A, SOD-323-4 package (larger footprint) | Lower capacitance but 2-channel only; requires two devices for 4-line protection | Select when absolute minimum capacitance is critical and board area permits discrete placement |
| TPD4E05U06DQAR | 0.5 pF CI/O, 5.5 V VC @ 16A, X2SON-10 package (same footprint, higher RθJA = 420 °C/W) | Same channel count and capacitance, but lower power derating margin above 70°C ambient | Select when sourcing flexibility is prioritized and thermal environment remains <65°C |
Compared with SP3204-04UTG and TPD4E05U06DQAR, D3V3F4U10LP delivers balanced performance: identical 0.5 pF capacitance to TPD4E05U06DQAR but superior thermal capability (350 mW vs. 280 mW), and integrated 4-channel functionality versus SP3204-04UTG's dual-channel limitation requiring duplication.
Availability
D3V3F4U10LP is available at Aetrix Electronics and suitable for USB 3.1 host designs, SATA III storage controllers, and DisplayPort 1.4 source implementations requiring stable component supply across production lifecycles.
Supply support for D3V3F4U10LP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The D3V3F4U10LP belongs to Diodes' advanced ESD protection product line, engineered specifically for high-speed serial interface protection where signal fidelity and compact packaging are critical.
FAQ
What is the maximum operating temperature for D3V3F4U10LP?
The D3V3F4U10LP is rated for continuous operation from –55 °C to +150 °C junction temperature. Its thermal resistance (RθJA = 360 °C/W) allows full 350 mW power dissipation at ambient temperatures up to +85 °C when mounted on a 2 oz copper FR-4 pad layout per Diodes' recommended footprint.
Can D3V3F4U10LP protect AC-coupled differential signals like USB 3.1 Gen 2?
Yes - its bidirectional clamping architecture and 0.5 pF channel capacitance make it suitable for AC-coupled differential pairs. The 5 V clamping voltage at ±16 A TLP ensures signal integrity is preserved during ESD events without forward-biasing the transceiver's internal ESD diodes.
How are pins 6, 7, 9, and 10 used in PCB layout?
Pins 6, 7, 9, and 10 are internally unconnected (NC) and must remain unbonded and un-soldered. They serve only as mechanical alignment aids during assembly. No copper pour, trace, or thermal relief should connect to these terminals to avoid parasitic coupling or solder bridging risks.
Does D3V3F4U10LP meet automotive AEC-Q200 requirements?
No - D3V3F4U10LP is not AEC-Q200 qualified. It is specified for commercial and industrial applications only (–55 °C to +150 °C operating range). For automotive-grade ESD protection, Diodes offers the D3V3F4U10QP variant, which undergoes extended reliability testing per AEC-Q200 Rev D.
D3V3F4U10LP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 0.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2510-10
D3V3F4U10LP-7 FAQ
1.How can I place an order for D3V3F4U10LP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for D3V3F4U10LP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D3V3F4U10LP-7 reliable?
The price and inventory of D3V3F4U10LP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3F4U10LP-7 is usually 5 days.
3.What payment methods are accepted for D3V3F4U10LP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3F4U10LP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D3V3F4U10LP-7?
D3V3F4U10LP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D3V3F4U10LP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D3V3F4U10LP-7?
For technical support, including D3V3F4U10LP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3F4U10LP-7 requirements.
6.How does Aetrix verify that D3V3F4U10LP-7 is sourced from the original manufacturer or authorized distributors?
All D3V3F4U10LP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3F4U10LP-7 meets industry standards.
7.What is the process for return or replacement of D3V3F4U10LP-7?
All D3V3F4U10LP-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3F4U10LP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D3V3F4U10LP-7 part is unused and in its original packaging.
Return procedure for D3V3F4U10LP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D3V3F4U10LP-7 Tags
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Diodes Incorporated
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