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Diodes Incorporated D3V3L2B3LP10-7

Part No.:
D3V3L2B3LP10-7
Manufacturer:
Diodes Incorporated
Category:
TVS Diodes
Package:
3-XFDFN
Datasheet:
AetrixD3V3L2B3LP10-7.pdf
Description:
TVS DIODE 3.3VWM 7VC DFN1010-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:12,531

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Product details

Overview

D3V3L2B3LP10-7 from Diodes Incorporated is a 2-channel bidirectional TVS diode designed for ESD protection of high-speed data lines in portable electronics. It features a 3.3V reverse standoff voltage (VRWM), ±23kV contact/±25kV air ESD immunity per IEC 61000-4-2, 10pF typical channel input capacitance, and 5A peak pulse current handling in an ultra-small X2-DFN1010-3 package - ideal for USB 2.0, SIM card, and audio jack interfaces.

For engineers reviewing the D3V3L2B3LP10-7 datasheet, D3V3L2B3LP10-7 pinout, D3V3L2B3LP10-7 application, or D3V3L2B3LP10-7 equivalent, key selection criteria include low clamping voltage (4.5–7.0V at 1–5A), dual-channel symmetry, sub-1mm² footprint, and verified compliance with automotive-grade moisture sensitivity level 1 and RoHS 3/Green requirements.

Technical Context

This device implements two independent, symmetrically configured bidirectional TVS junctions in a single die, enabling simultaneous protection of differential or parallel signal paths without polarity constraints. Its low 0.3Ω differential resistance (RDIF) and tight 3.8–6.5V breakdown voltage (VBR) range ensure fast transient response and minimal signal distortion under ESD stress.

The X2-DFN1010-3 package integrates NiPdAu-plated copper terminals and a UL 94V-0 green molding compound, supporting reflow soldering per MIL-STD-202 and delivering 500°C/W junction-to-ambient thermal resistance on standard FR-4 PCB layouts - critical for thermal stability during repeated surge events.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Standoff Voltage 3.3V - Maximum continuous operating voltage before leakage exceeds 200nA; defines safe interface voltage margin for 3.3V logic rails.
Breakdown Voltage (VBR) 3.8V min / 6.5V max at 1mA - Ensures reliable triggering above normal signal swing while avoiding false triggering on noise.
Clamping Voltage (VCL) 4.5–5.4V @ 1A; 5.8–7.0V @ 5A - Limits transient overvoltage to levels compatible with 3.3V I/O structures during ESD events.
Channel Input Capacitance 10pF typ / 13pF max @ 0V, 1MHz - Preserves signal integrity on high-speed lines like USB 2.0 (480Mbps) and audio codecs.
ESD Protection Level ±23kV contact / ±25kV air per IEC 61000-4-2 - Meets industrial and consumer end-equipment immunity requirements without external shielding.
Peak Pulse Power 35W @ 8/20μs waveform - Sustains multiple ESD strikes without degradation when mounted per recommended pad layout.

Pinout & Package

Package: X2-DFN1010-3 - 1.0mm × 1.0mm × 0.39mm body, 3-terminal leadless plastic package with exposed thermal pad (GND terminal), moisture sensitivity level 1, and NiPdAu-plated copper terminals.

Pin/Terminal Circuit Role Design Meaning
1 (Ch1) Anode/Cathode of Channel 1 Bidirectional ESD path for first protected line (e.g., USB D+); symmetrical conduction enables polarity-agnostic placement.
2 (GND) Common Cathode Reference Shared low-inductance ground return for both channels; must be connected to solid system ground plane for optimal clamping.
3 (Ch2) Anode/Cathode of Channel 2 Bidirectional ESD path for second protected line (e.g., USB D−); matched electrical characteristics to Ch1 ensure balanced protection.

Key Features

Feature Design Value
IEC 61000-4-2 ESD Rating ±23kV contact / ±25kV air - Eliminates need for secondary board-level shielding in handheld devices.
Dual-Channel Integration Two matched TVS junctions in one 1.0×1.0mm package - Reduces PCB area by >60% vs. discrete dual-diode solutions.
Low Input Capacitance 10pF typical per channel - Enables use on 480Mbps USB 2.0, I²C, and audio interfaces without signal rise-time degradation.
Green & Lead-Free Construction Halogen- and antimony-free, RoHS 3 compliant (<900ppm Br/Cl, <1000ppm Sb) - Supports global environmental compliance mandates.

Applications

USB 2.0 Interface Protection SIM Card Slot ESD Guard

Use Scenario: Protecting D+ and D− lines of USB 2.0 ports in smartphones and tablets against repeated ESD events during cable insertion/removal.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point to clamp surges before reaching PHY IC.

Use Value: Maintains 480Mbps data integrity with <10pF loading and clamps transients to ≤7.0V, preventing latch-up or oxide damage in USB transceivers.

Use Scenario: Shielding SIM card detection and data lines (I/O, CLK, RST) from ESD during hot-swap insertion in mobile handsets and wearables.

IC Role / Device Role / Timing Role: Dual-channel TVS providing simultaneous protection for two adjacent low-voltage digital signals sharing common ground reference.

Use Value: Prevents SIM card communication failure or controller reset by limiting ESD-induced voltage overshoot to <5.4V at 1A surge current.

Audio Jack ESD Suppression Portable Display Data Lines

Use Scenario: Safeguarding stereo headphone/mic jack pins (left/right/ground/mic) in MP3 players and Bluetooth headsets from user-hand ESD.

IC Role / Device Role / Timing Role: Low-capacitance bidirectional clamp on unbalanced analog audio paths, preserving frequency response up to 20kHz.

Use Value: Avoids audible pop/crackle during ESD events by maintaining <10pF capacitance and clamping transients within amplifier input tolerance.

Use Scenario: Protecting MIPI D-PHY data lanes (CLK+/−, DATA+/−) in compact displays used in digital cameras and portable medical monitors.

IC Role / Device Role / Timing Role: Compact dual-channel TVS placed at display flex connector to suppress ESD before high-speed serializer/deserializer ICs.

Use Value: Enables robust 1Gbps+ data transmission by minimizing capacitive loading and ensuring clamping occurs below receiver absolute maximum ratings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
SP1006-02HTG Higher CIN (15pF typ), lower VBR (3.3V min), same 5A IPP rating Less suitable for >480Mbps interfaces due to higher capacitance; better for lower-speed GPIO protection Select when cost sensitivity outweighs high-speed signal integrity needs and VRWM margin is tighter.
ESD5Z3.3T5G Single-channel, 12pF CIN, ±17kV contact ESD rating, SOD-523 package Requires two devices for dual-line protection; larger footprint (1.2×0.8mm vs. 1.0×1.0mm) Choose only if existing design uses SOD-523 footprints and dual-channel integration is not required.

Compared with SP1006-02HTG and ESD5Z3.3T5G, D3V3L2B3LP10-7 delivers superior high-speed interface compatibility via lower capacitance and integrated dual-channel architecture, while maintaining best-in-class ESD immunity - making it optimal for space-constrained, high-data-rate portable designs.

Availability

D3V3L2B3LP10-7 is available at Aetrix Electronics and suitable for cellular handsets, portable electronics, and computers and peripherals requiring stable component supply with full traceability and lifecycle management.

Supply support for D3V3L2B3LP10-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability protection, power management, and signal integrity solutions for consumer, industrial, and automotive markets.

D3V3L2B3LP10-7 belongs to Diodes' X2-DFN series of ultra-compact TVS diodes engineered specifically for ESD protection of high-speed, low-voltage interfaces in battery-powered portable devices.

FAQ

What is the maximum operating temperature for D3V3L2B3LP10-7?

The device operates reliably from −65°C to +150°C, with thermal resistance (RθJA) of 500°C/W on standard FR-4 PCBs using Diodes' recommended pad layout. This allows sustained operation in sealed handheld enclosures where internal temperatures may exceed 85°C ambient.

Does D3V3L2B3LP10-7 require external biasing or control signals?

No - it is a passive, bidirectional TVS diode that functions without any external power, bias, or configuration. It activates automatically when transient voltage exceeds its breakdown threshold (3.8V min), clamping surges to protect downstream circuitry.

Can D3V3L2B3LP10-7 be used in automotive applications?

While not AEC-Q200 qualified out-of-box, its construction meets automotive-grade moisture sensitivity (J-STD-020 Level 1) and green material requirements. For qualified automotive use, Diodes offers pin-compatible AEC-Q200 variants - contact Diodes or Aetrix for PPAP-capable versions.

How does the GND pin (Pin 2) affect PCB layout?

Pin 2 is the common cathode connection for both TVS channels and must be tied directly to a low-impedance system ground plane. A short, wide trace or direct thermal pad connection minimizes inductance, ensuring clamping voltage remains below 7.0V during 5A ESD transients - critical for effective protection.

D3V3L2B3LP10-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Package/Case:
3-XFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
2
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
3.8V
Voltage - Clamping (Max) @ Ipp:
7V
Current - Peak Pulse (10/1000µs):
5A (8/20µs)
Power - Peak Pulse:
35W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
10pF @ 1MHz
Operating Temperature:
-65°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1010-3

D3V3L2B3LP10-7 FAQ

1.How can I place an order for D3V3L2B3LP10-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for D3V3L2B3LP10-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for D3V3L2B3LP10-7 reliable?

The price and inventory of D3V3L2B3LP10-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3L2B3LP10-7 is usually 5 days.

3.What payment methods are accepted for D3V3L2B3LP10-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3L2B3LP10-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for D3V3L2B3LP10-7?

D3V3L2B3LP10-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your D3V3L2B3LP10-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for D3V3L2B3LP10-7?

For technical support, including D3V3L2B3LP10-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3L2B3LP10-7 requirements.

6.How does Aetrix verify that D3V3L2B3LP10-7 is sourced from the original manufacturer or authorized distributors?

All D3V3L2B3LP10-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3L2B3LP10-7 meets industry standards.

7.What is the process for return or replacement of D3V3L2B3LP10-7?

All D3V3L2B3LP10-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3L2B3LP10-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The D3V3L2B3LP10-7 part is unused and in its original packaging.

Return procedure for D3V3L2B3LP10-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

D3V3L2B3LP10-7 Tags

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