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Diodes Incorporated D3V3L4BS4LP1308-7

Part No.:
D3V3L4BS4LP1308-7
Manufacturer:
Diodes Incorporated
Category:
TVS Diodes
Package:
6-XFDFN
Datasheet:
AetrixD3V3L4BS4LP1308-7.pdf
Description:
GENERAL PROTECTION PP X1-DFN1308
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,017

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Product details

Overview

D3V3L4BS4LP1308-7 from Diodes Incorporated is a 4-channel bidirectional TVS diode array designed for ESD and surge protection of high-speed data lines in portable electronics. It features a reverse working voltage of 3.3 V, minimum breakdown voltage of 3.8 V, peak pulse current rating of 11 A (8/20 µs), typical junction capacitance of 9.5 pF, and IEC 61000-4-2 ±30 kV (contact/air) ESD immunity - deployed in cellular handsets, digital cameras, and MP3 players.

For engineers reviewing the D3V3L4BS4LP1308-7 datasheet, D3V3L4BS4LP1308-7 pinout, D3V3L4BS4LP1308-7 application, or D3V3L4BS4LP1308-7 equivalent, key selection criteria include low clamping voltage (4.8 V @ 1 A), ultra-low capacitance for signal integrity, bidirectional channel symmetry, and compatibility with space-constrained DFN1308 packaging for USB, HDMI, and audio interface protection.

Technical Context

This TVS array uses silicon avalanche diode structures arranged in four independent, symmetrical bidirectional pairs between I/O pins and ground. Each channel provides low dynamic resistance (0.16 Ω) and fast TLP response (100 ns pulse), enabling effective transient suppression without signal distortion on high-frequency lines.

It operates within –55 °C to +150 °C, supports 250 mW power dissipation on standard FR-4 PCB layout, and maintains stable clamping performance across temperature due to its monolithic DFN construction and NiPdAu-plated copper leadframe.

Key Specifications

Parameter Value and Actual Design Meaning
Channels 4 independent bidirectional I/O-to-GND protection paths
VRWM 3.3 V - maximum continuous operating voltage before leakage exceeds 0.5 µA
VBR (Min) 3.8 V @ 1 mA - ensures reliable turn-on during ESD events above system logic thresholds
VCL @ 1 A 4.8 V (typ) - low clamping limits voltage overshoot on protected data lines
CT (Typ) 9.5 pF @ 0 V, 1 MHz - preserves signal integrity for USB 2.0 and audio interfaces
IPP (Max) 11 A (8/20 µs) - withstands IEC 61000-4-5 surge transients in portable equipment
ESD Rating ±30 kV contact & air (IEC 61000-4-2) - exceeds industrial and consumer immunity requirements

Pinout & Package

Package: X1-DFN1308-6 (Type A), 1.3 mm × 0.8 mm × 0.4 mm body, 6-terminal leadless package with exposed thermal pad (Pin 6 = GND). Molded green compound, UL 94V-0 rated, MSL Level 1.

Pin/Terminal Circuit Role Design Meaning
1 I/O Channel 1 Bidirectional ESD path between data line and GND; symmetric conduction
2 I/O Channel 2 Independent protection node; electrically isolated from other channels
3 GND Common return for all four TVS paths; connected to thermal pad for heat dissipation
4 I/O Channel 3 Matches Channel 1/2 electrical characteristics; enables multi-line interface protection
5 I/O Channel 4 Full functional equivalence to Channels 1–3; supports quad-data bus layouts
6 Thermal Pad / GND Exposed copper pad for soldering to PCB ground plane; improves thermal derating and ESD path impedance

Key Features

Feature Design Value
Four-channel bidirectional protection Enables simultaneous safeguarding of differential or single-ended high-speed lines without polarity constraints
Ultra-low 9.5 pF capacitance Minimizes insertion loss and signal rise-time degradation on 480 Mbps USB 2.0 and stereo audio paths
±30 kV IEC 61000-4-2 ESD rating Eliminates need for external ESD test margining in handheld device qualification
0.16 Ω dynamic resistance Reduces clamping voltage overshoot under fast TLP pulses, improving system-level robustness
Green, halogen-free, RoHS-compliant Meets IPC-1752A material declaration requirements for global electronics manufacturing

Applications

Cellular Handsets Digital Cameras

Use Scenario: Protecting micro-USB, SIM card, and headphone jack interfaces from user-handling ESD.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry points.

Use Value: Prevents latch-up and permanent damage to baseband ICs while maintaining <10 pF loading on high-speed signals.

Use Scenario: Shielding CMOS image sensor data buses (e.g., MIPI CSI-2) and SD card slots from electrostatic discharge.

IC Role / Device Role / Timing Role: Low-capacitance TVS array integrated into flex-cable connectors and board-edge interfaces.

Use Value: Ensures uninterrupted video streaming by clamping transients below 5 V without distorting 1.2 Gbps serial data eye diagrams.

MP3 Players Portable Audio Accessories

Use Scenario: Guarding line-out, mic-in, and USB charging ports against repeated human-body-model discharges.

IC Role / Device Role / Timing Role: Primary ESD front-end protection for analog and digital audio signal chains.

Use Value: Maintains THD+N <0.01% in audio paths by avoiding nonlinear conduction during sub-100 ns ESD events.

Use Scenario: Securing Bluetooth headset charging contacts and touch-control buttons from accidental static discharge.

IC Role / Device Role / Timing Role: Compact, low-profile TVS solution mounted adjacent to tactile switches and pogo pins.

Use Value: Achieves full ±30 kV ESD immunity in <1.5 mm² footprint, enabling thinner industrial-grade wearable designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar TVS diode array applications.

Alternative Part Technical Difference Application Difference Selection Advice
SMAJ3.3A-Q Unidirectional, SMA package (4.5 mm × 2.7 mm), higher CT (~25 pF), lower IPP (24.7 A) Requires polarity-aware routing; unsuitable for AC-coupled or differential lines Select only when board space allows larger package and unidirectional protection suffices
SP1006-04UTG 4-channel bidirectional, SOT-23-6 package, CT = 12 pF, VBR min = 3.6 V, IPP = 8 A Larger footprint (2.9 mm × 1.6 mm); higher capacitance limits use in >100 Mbps interfaces Prefer where legacy SOT-23 assembly infrastructure exists and 12 pF is acceptable

Compared with SMAJ3.3A-Q and SP1006-04UTG, D3V3L4BS4LP1308-7 delivers superior high-speed interface compatibility via its 9.5 pF capacitance and DFN1308 footprint, while maintaining full bidirectionality and industry-leading ±30 kV ESD rating in the smallest available form factor.

Availability

D3V3L4BS4LP1308-7 is available at Aetrix Electronics and suitable for cellular handsets, digital cameras, and MP3 players requiring stable component supply, consistent ESD performance, and compact TVS integration.

Supply support for D3V3L4BS4LP1308-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

This device belongs to Diodes' X1-series ultra-compact TVS portfolio, engineered specifically for ESD-hardened portable consumer electronics where board area, signal fidelity, and regulatory compliance are critical.

FAQ

What is the maximum operating temperature for D3V3L4BS4LP1308-7?

The device is rated for continuous operation from –55 °C to +150 °C ambient temperature. Its thermal resistance (RθJA = 500 °C/W) assumes mounting on a standard FR-4 PCB with 2 oz copper per Diodes' recommended pad layout; derating begins above +70 °C ambient per Figure 1 in DS43449.

Does D3V3L4BS4LP1308-7 require external biasing or control signals?

No. It is a passive, always-active TVS diode array with no enable pins, supply rails, or configuration requirements. Protection engages automatically when transient voltage exceeds the 3.8 V breakdown threshold, making it ideal for plug-and-play interface hardening.

Can D3V3L4BS4LP1308-7 be used on USB 3.0 or HDMI interfaces?

No - its 9.5 pF typical capacitance is optimized for USB 2.0 (<480 Mbps), audio, and low-speed data lines. USB 3.0 and HDMI require sub-2 pF solutions to avoid signal integrity failure; this device would cause excessive insertion loss and jitter on those interfaces.

How is the marking code 'QZ4' interpreted on the device top-side?

'QZ4' is the product type marking per Diodes' coding scheme, indicating the D3V3L4BS4LP1308-7 variant. The backside includes date code 'YM', where 'Y' (e.g., J = 2022) and 'M' (e.g., N = November) denote manufacturing year and month, respectively, per the datasheet's Date Code Key table.

D3V3L4BS4LP1308-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Package/Case:
6-XFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
4
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
3.8V
Voltage - Clamping (Max) @ Ipp:
10.5V
Current - Peak Pulse (10/1000µs):
11A (8/20µs)
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
9.5pF @ 1MHz
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN1308-6

D3V3L4BS4LP1308-7 FAQ

1.How can I place an order for D3V3L4BS4LP1308-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for D3V3L4BS4LP1308-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for D3V3L4BS4LP1308-7 reliable?

The price and inventory of D3V3L4BS4LP1308-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3L4BS4LP1308-7 is usually 5 days.

3.What payment methods are accepted for D3V3L4BS4LP1308-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3L4BS4LP1308-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for D3V3L4BS4LP1308-7?

D3V3L4BS4LP1308-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your D3V3L4BS4LP1308-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for D3V3L4BS4LP1308-7?

For technical support, including D3V3L4BS4LP1308-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3L4BS4LP1308-7 requirements.

6.How does Aetrix verify that D3V3L4BS4LP1308-7 is sourced from the original manufacturer or authorized distributors?

All D3V3L4BS4LP1308-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3L4BS4LP1308-7 meets industry standards.

7.What is the process for return or replacement of D3V3L4BS4LP1308-7?

All D3V3L4BS4LP1308-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3L4BS4LP1308-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The D3V3L4BS4LP1308-7 part is unused and in its original packaging.

Return procedure for D3V3L4BS4LP1308-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

D3V3L4BS4LP1308-7 Tags

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