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Diodes Incorporated D3V3P4U10LP26-7
- Part No.:
- D3V3P4U10LP26-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 10-UFDFN Exposed Pad
- Datasheet:
-
D3V3P4U10LP26-7.pdf
- Description:
- TVS DIODE 3.3VWM 12VC
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
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Product details
Overview
D3V3P4U10LP26-7 from Diodes Incorporated is a 4-channel, low-capacitance TVS diode array designed for bidirectional ESD protection of high-speed data lines. It features a 3.3 V reverse standoff voltage (VRWM), 3.8 pF typical channel capacitance (CT), and ±30 kV IEC 61000-4-2 contact/air ESD rating, enabling robust protection in USB 2.0, HDMI, and audio interface circuits.
For engineers reviewing the D3V3P4U10LP26-7 datasheet, D3V3P4U10LP26-7 pinout, D3V3P4U10LP26-7 application, or D3V3P4U10LP26-7 equivalent, key selection criteria include clamping voltage at 25 A (12 V), dynamic resistance (0.3 Ω), thermal resistance (250 °C/W), and U-DFN2626-10 package compatibility with high-density portable PCB layouts.
Technical Context
This device implements four independent bidirectional TVS diodes connected between I/O pins and ground, with no internal DC path to VCC. Its low 3.8 pF input capacitance preserves signal integrity on 480 Mbps USB 2.0 lines, while the 3.8 V minimum breakdown voltage ensures reliable triggering before IC damage thresholds.
The U-DFN2626-10 package integrates a center-tab ground plane for low-inductance transient current return, and all 10 terminals are defined: pins 1/3/7/9 serve as protected I/O channels, pins 2/4/6/8/10 are NC, and pin 5 is a dedicated ground connection - not to be tied to DC supply rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 3.3 V - Maximum continuous operating voltage before leakage exceeds 1 µA; sets upper limit for safe interface rail operation. |
| VBR (min) | 3.8 V - Minimum reverse breakdown voltage at 1 mA; guarantees activation prior to damage of 3.3 V logic interfaces. |
| CT (typ) | 3.8 pF - Typical capacitance per channel at 0 V bias and 1 MHz; enables <1% signal distortion on USB 2.0 differential pairs. |
| IPP (max) | 25 A - Peak pulse current handling under 8/20 µs waveform; supports Level 4 IEC 61000-4-5 surge immunity. |
| VC @ 25 A | 12 V - Clamping voltage during full-rated surge; limits downstream IC stress to safe levels during ESD events. |
| RDYN | 0.3 Ω - Dynamic resistance during transient conduction; minimizes voltage overshoot during fast-rising ESD pulses. |
| RθJA | 250 °C/W - Junction-to-ambient thermal resistance on standard FR-4 layout; defines power derating above +25 °C ambient. |
Pinout & Package
Package: U-DFN2626-10 - 2.6 mm × 2.6 mm × 0.6 mm ultra-thin, lead-free, halogen-free molded plastic package with exposed center thermal pad (grounded) and NiPdAu-plated copper leadframe.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9 | I/O Channel | Four independent bidirectional ESD protection paths; each connects to one data line (e.g., USB D+, D−, HDMI TMDS+/-). |
| 2, 4, 6, 8, 10 | No Connect | Internally unconnected; must remain floating - no routing or soldering required. |
| 5 | Ground Reference | Dedicated low-inductance ground terminal; must be connected directly to PCB ground plane for optimal clamping performance. |
| Center Tab | Thermal & Signal Ground | Exposed metal pad beneath package body; electrically and thermally tied to pin 5; requires solid solder mask-defined thermal via array. |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 ESD Rating | ±30 kV air/contact - exceeds industrial and consumer immunity requirements without external filtering components. |
| Low Channel Capacitance | 3.8 pF typical - maintains signal rise/fall times and eye diagram integrity on 480 Mbps USB 2.0 links. |
| U-DFN2626-10 Footprint | 2.6 mm × 2.6 mm area - saves >60% board space vs. SOIC-8 alternatives while supporting automated reflow assembly. |
| Green Compliance | Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb); fully RoHS 2 compliant with lead-free termination. |
| Thermal Performance | 250 °C/W RθJA on standard FR-4 - enables stable operation up to +85 °C ambient in sealed handheld enclosures. |
Applications
| USB 2.0 Interface Protection | HDMI Data Line Protection |
|---|---|
Use Scenario: Protecting USB D+ and D− lines in smartphones and OTG adapters against repeated ESD strikes during cable insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point, clamping surges before reaching PHY transceiver. Use Value: 3.8 pF capacitance prevents signal degradation at 480 Mbps; ±30 kV rating eliminates need for secondary protection stages. | Use Scenario: Safeguarding HDMI TMDS+ and TMDS− differential pairs in portable projectors and docking stations. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp integrated into HDMI receptacle footprint, preserving differential impedance and jitter margin. Use Value: 12 V clamping at 25 A ensures downstream HDMI controller remains within absolute maximum ratings during hot-plug ESD events. |
| Audio Jack ESD Protection | Industrial Sensor Interface |
Use Scenario: Shielding 3.5 mm TRRS audio jack lines (MIC, L/R, GND) in Bluetooth headsets from user-hand ESD. IC Role / Device Role / Timing Role: Four-channel TVS array covering all analog signal paths with shared ground reference and minimal parasitic coupling. Use Value: Sub-4 pF capacitance avoids bass roll-off and noise modulation in 20 Hz–20 kHz audio band; compact U-DFN allows placement under jack housing. | Use Scenario: Protecting RS-485 or CAN FD transceiver I/O pins in factory automation gateways exposed to maintenance personnel ESD. IC Role / Device Role / Timing Role: Standalone ESD guard for isolated communication ports where system-level surge protection is impractical. Use Value: 25 A peak pulse rating handles multiple ESD events without parameter shift; -55 °C to +150 °C operating range supports extended industrial temperature deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 4-channel low-capacitance TVS diode array applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SZESD7371WDT5G | Single-channel, 0.5 pF CT, 5.5 V VRWM, SOD-923 package | Requires four discrete devices; lower capacitance but higher board area and assembly cost | Preferred only when sub-1 pF capacitance is mandatory and layout density is secondary |
| TPD4E001DPYR | 4-channel, 3.5 pF CT, 3.6 V VRWM, X2SON-10 package, ±20 kV ESD rating | Lower ESD rating (±20 kV vs. ±30 kV); identical footprint but slightly reduced surge margin | Valid alternative if design targets IEC 61000-4-2 Level 3 (±20 kV) and cost sensitivity outweighs margin needs |
Compared with SZESD7371WDT5G and TPD4E001DPYR, D3V3P4U10LP26-7 delivers superior ESD immunity (±30 kV), matched 4-channel integration, and verified USB 2.0 signal integrity - making it optimal for space-constrained, high-reliability portable designs requiring full Level 4 compliance.
Availability
D3V3P4U10LP26-7 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI data line safeguarding, and audio jack ESD mitigation requiring stable component supply across high-volume consumer electronics production.
Supply support for D3V3P4U10LP26-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This device belongs to Diodes' Ultra-Low Capacitance TVS Array product line, engineered specifically for high-speed digital interface protection where signal fidelity and ESD robustness must coexist in miniature packages.
FAQ
What is the maximum allowable DC voltage applied across any I/O pin and ground?
The maximum continuous DC voltage is the reverse standoff voltage VRWM = 3.3 V. Exceeding this level risks increased leakage current (>1 µA) and potential premature breakdown. Operation at 3.3 V nominal rails is safe; 5 V interfaces require series resistors or alternate protection schemes.
Can pin 5 be left unconnected or tied to VCC?
No - pin 5 is the designated ground reference and must be connected directly to the PCB ground plane. It is not a power pin and must never be tied to VCC or left floating, as doing so compromises clamping performance and may cause device failure during ESD events.
How does the center thermal pad affect PCB layout requirements?
The exposed center tab is electrically and thermally connected to pin 5 (ground). It requires a dedicated solder mask-defined thermal pad on the PCB, with ≥4 thermal vias (0.3 mm diameter) connecting to an internal or bottom-layer ground plane to maintain RθJA ≤ 250 °C/W and ensure long-term reliability under surge conditions.
Is D3V3P4U10LP26-7 qualified for automotive AEC-Q200 stress testing?
No - this part is not AEC-Q200 qualified. It is rated for industrial and consumer temperature ranges (–55 °C to +150 °C) and intended for non-safety-critical portable electronics. Automotive applications require AEC-Q200-certified alternatives such as the D3V3P4U10LP26Q-7 variant, which undergoes additional qualification testing.
D3V3P4U10LP26-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 10-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.8V
- Voltage - Clamping (Max) @ Ipp:
- 12V
- Current - Peak Pulse (10/1000µs):
- 25A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 3.8pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2626-10
D3V3P4U10LP26-7 FAQ
1.How can I place an order for D3V3P4U10LP26-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for D3V3P4U10LP26-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D3V3P4U10LP26-7 reliable?
The price and inventory of D3V3P4U10LP26-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3P4U10LP26-7 is usually 5 days.
3.What payment methods are accepted for D3V3P4U10LP26-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3P4U10LP26-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D3V3P4U10LP26-7?
D3V3P4U10LP26-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D3V3P4U10LP26-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D3V3P4U10LP26-7?
For technical support, including D3V3P4U10LP26-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3P4U10LP26-7 requirements.
6.How does Aetrix verify that D3V3P4U10LP26-7 is sourced from the original manufacturer or authorized distributors?
All D3V3P4U10LP26-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3P4U10LP26-7 meets industry standards.
7.What is the process for return or replacement of D3V3P4U10LP26-7?
All D3V3P4U10LP26-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3P4U10LP26-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D3V3P4U10LP26-7 part is unused and in its original packaging.
Return procedure for D3V3P4U10LP26-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D3V3P4U10LP26-7 Tags
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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