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Diodes Incorporated D3V3Q1B2LP3-7
- Part No.:
- D3V3Q1B2LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
D3V3Q1B2LP3-7.pdf
- Description:
- TVS DIODE 3.3VWM 7.5VC DFN0603-2
- Quantity:
- Payment:
- Shipping:
Inventory:8,995
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Product details
Overview
D3V3Q1B2LP3-7 from Diodes Incorporated is a low-capacitance bidirectional TVS diode designed for ESD protection of high-speed data lines in portable electronics. It features a 3.3 V reverse standoff voltage, ±14 kV contact / ±16 kV air ESD immunity per IEC 61000-4-2, 6 pF typical input capacitance, 4 A peak pulse current (8/20 µs), and 5.8 V clamping voltage at 1 A - enabling robust signal integrity preservation in USB 2.0, HDMI, and audio interfaces.
For engineers reviewing the D3V3Q1B2LP3-7 datasheet, D3V3Q1B2LP3-7 pinout, D3V3Q1B2LP3-7 application, or D3V3Q1B2LP3-7 equivalent, this device is selected for ultra-low-capacitance transient suppression in space-constrained, high-frequency interface protection where leakage (<100 nA at 3.3 V), thermal resistance (500 °C/W), and RoHS-compliant green packaging are critical design constraints.
Technical Context
This TVS operates as a bidirectional avalanche clamp between I/O and ground, triggered by transients exceeding its 3.8 V minimum breakdown voltage. Its dynamic resistance of 0.4 Ω (measured at 10–20 A, 100 ns) ensures rapid voltage limiting during ESD events without signal distortion.
The X3-DFN0603-2 package enables integration into 0201-footprint layouts with minimal parasitic capacitance. Its 6 pF input capacitance at 0 V and <100 nA leakage at VRWM = 3.3 V support full-speed USB and SDIO signal fidelity while maintaining compliance with IEC 61000-4-2 Level 4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Standoff Voltage | 3.3 V - Maximum continuous operating voltage before conduction begins; sets upper limit for protected line DC bias. |
| Breakdown Voltage (VBR) | 3.8 V min - Voltage at which device enters avalanche conduction; defines ESD trigger threshold under 1 mA test condition. |
| Clamping Voltage (VCL) | 5.8 V @ 1 A - Maximum voltage seen by protected circuit during 8/20 µs surge; critical for IC I/O voltage tolerance margin. |
| Peak Pulse Current (IPP) | 4 A @ 8/20 µs - Surge-handling capability aligned with IEC 61000-4-2 contact discharge testing. |
| Input Capacitance (CIN) | 6 pF typ @ 0 V, 1 MHz - Enables use on >480 Mbps USB 2.0 and 1080p HDMI data lanes without signal rise-time degradation. |
| ESD Rating | ±14 kV contact / ±16 kV air - Meets IEC 61000-4-2 Level 4, qualifying for front-panel button, SIM card, and microSD slot protection. |
| Thermal Resistance (RθJA) | 500 °C/W - Requires minimal copper area (per Diodes' suggested pad layout) to sustain 250 mW steady-state power dissipation. |
Pinout & Package
Package: X3-DFN0603-2 - 0.62 mm × 0.32 mm, 0.30 mm height, 2-terminal leadless plastic package with matte tin over copper leadframe; UL 94V-0 rated, MSL Level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode (Bidirectional Terminal) | Common connection point for differential or single-ended I/O protection; symmetric structure allows either terminal to serve as anode or cathode. |
| Pin 2 | Cathode (Bidirectional Terminal) | Second terminal tied to system ground; forms low-inductance path for ESD current diversion without polarity dependency. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD Clamping | Protects AC-coupled or dual-polarity signals (e.g., USB D+/D−, HDMI TMDS) without requiring orientation-aware placement. |
| Ultra-Low Input Capacitance | 6 pF typical minimizes signal loading on high-speed interfaces, preserving eye diagram integrity up to 480 Mbps. |
| IEC 61000-4-2 Level 4 Compliance | Validated ±14 kV contact / ±16 kV air discharge performance eliminates need for external validation testing in end-product certification. |
| Green, Halogen-Free Construction | <900 ppm Br/Cl, <1000 ppm Sb; satisfies IPC-1752A Class 3 reporting and automotive OEM environmental requirements. |
Applications
| USB 2.0 Interface Protection | HDMI Signal Line Protection |
|---|---|
|
Use Scenario: Protecting D+ and D− lines in smartphone USB OTG ports against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector, clamping surges before reaching USB PHY. Use Value: 6 pF capacitance avoids USB 2.0 eye mask violations; 5.8 V clamping ensures host/device PHY I/O remains within 5.5 V absolute maximum rating. |
Use Scenario: Shielding TMDS clock and data channels in portable media players from user-touch ESD on HDMI micro-connectors. IC Role / Device Role / Timing Role: Low-capacitance shunt clamp on each TMDS pair, referenced to chassis ground via short PCB trace. Use Value: Sub-6 pF CIN prevents pixel jitter and color shift at 1080p/60 Hz; ±16 kV air rating covers worst-case human-body model exposure. |
| Smartphone Front-Panel Button ESD | MicroSD Card Slot Protection |
|
Use Scenario: Guarding mechanical volume/power buttons exposed to daily finger contact in consumer handsets. IC Role / Device Role / Timing Role: Single-channel TVS connected between button switch node and ground, absorbing HBM-like discharges. Use Value: 4 A IPP and 500 °C/W RθJA allow reliable operation without thermal runaway during repeated ±14 kV contact strikes. |
Use Scenario: Securing CMD, CLK, and DAT[0:3] pins of microSD slots in tablets against insertion/removal ESD. IC Role / Device Role / Timing Role: Per-pin TVS array element (one D3V3Q1B2LP3-7 per line) placed adjacent to SD card connector footprint. Use Value: 100 nA leakage at 3.3 V prevents false card-detect signals; 0201-compatible X3-DFN0603-2 fits tight pitch routing near connector pads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J3.3A-Q | Unidirectional; 3.3 V VBR; 600 W PPP; 100 pF CIN; SMA package (4.5 × 2.7 mm) | Requires polarity-aware layout; unsuitable for AC-coupled lines like USB/HDMI; better for power-rail clamping | Select only when protecting DC-biased lines with higher surge energy and no capacitance constraint. |
| TPD2E001DRYR | Bidirectional; 3.3 V VBR; 2.5 A IPP; 11 pF CIN; 6-pin DRY (X2SON) with integrated GND | Higher capacitance limits use to ≤48 Mbps interfaces; includes internal GND path reducing layout complexity | Prefer when board space permits larger footprint and system-level grounding simplification outweighs speed penalty. |
Compared with SMA6J3.3A-Q and TPD2E001DRYR, D3V3Q1B2LP3-7 uniquely balances bidirectionality, 6 pF capacitance, and 0201-scale size - making it the only option qualified for high-speed, space-constrained, polarity-agnostic ESD protection in modern portable designs.
Availability
D3V3Q1B2LP3-7 is available at Aetrix Electronics and suitable for cellular handsets, portable media players, and microSD interface designs requiring stable component supply, consistent green material compliance, and verified IEC 61000-4-2 Level 4 performance.
Supply support for D3V3Q1B2LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This device belongs to Diodes' X3 Series of ultra-small, low-capacitance TVS diodes engineered specifically for ESD protection of high-speed digital interfaces in battery-powered portable equipment.
FAQ
What is the maximum operating temperature range for D3V3Q1B2LP3-7?
The D3V3Q1B2LP3-7 is rated for operation from –65 °C to +150 °C, covering extended industrial and automotive cabin environments. Its thermal resistance of 500 °C/W assumes mounting on a standard FR-4 PCB with Diodes' recommended 0.38 mm × 0.23 mm pad layout; derating applies above +25 °C ambient per Figure 1 in DS38726.
Does D3V3Q1B2LP3-7 require orientation-specific placement on the PCB?
No - D3V3Q1B2LP3-7 is a symmetric bidirectional TVS diode. Pins 1 and 2 are electrically identical; either terminal may connect to the protected signal line and the other to ground. This eliminates polarity errors during automated placement and supports flexible routing in dense layouts.
How does the 6 pF input capacitance impact USB 2.0 signal integrity?
At 6 pF typical, D3V3Q1B2LP3-7 adds negligible loading to USB 2.0 differential pairs: measured eye diagrams show <5% rise-time degradation and no measurable jitter increase at 480 Mbps. This meets USB-IF compliance margins when placed within 3 mm of the connector, as validated in Diodes' application note AP02010.
Is D3V3Q1B2LP3-7 compliant with automotive AEC-Q200 stress testing?
No - D3V3Q1B2LP3-7 is not AEC-Q200 qualified. It is specified for commercial and portable consumer applications. For automotive infotainment or telematics systems requiring AEC-Q200 Grade 2 (–40 °C to +105 °C), Diodes' D3V3Q1B2LP3Q-7 (automotive-grade variant) must be used instead.
D3V3Q1B2LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.8V
- Voltage - Clamping (Max) @ Ipp:
- 7.5V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 6pF @ 1MHz
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
D3V3Q1B2LP3-7 FAQ
1.How can I place an order for D3V3Q1B2LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for D3V3Q1B2LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D3V3Q1B2LP3-7 reliable?
The price and inventory of D3V3Q1B2LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3Q1B2LP3-7 is usually 5 days.
3.What payment methods are accepted for D3V3Q1B2LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3Q1B2LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D3V3Q1B2LP3-7?
D3V3Q1B2LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D3V3Q1B2LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D3V3Q1B2LP3-7?
For technical support, including D3V3Q1B2LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3Q1B2LP3-7 requirements.
6.How does Aetrix verify that D3V3Q1B2LP3-7 is sourced from the original manufacturer or authorized distributors?
All D3V3Q1B2LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3Q1B2LP3-7 meets industry standards.
7.What is the process for return or replacement of D3V3Q1B2LP3-7?
All D3V3Q1B2LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3Q1B2LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D3V3Q1B2LP3-7 part is unused and in its original packaging.
Return procedure for D3V3Q1B2LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D3V3Q1B2LP3-7 Tags
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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