My Inquiry
My Account
Diodes Incorporated D3V3Z1BD2CSP-7
- Part No.:
- D3V3Z1BD2CSP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
D3V3Z1BD2CSP-7.pdf
- Description:
- GENERAL PROTECTION PP X2-DSN0603
- Quantity:
- Payment:
- Shipping:
Inventory:3,333
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
D3V3Z1BD2CSP from Diodes Incorporated is a bidirectional TVS diode engineered for ultra-low-capacitance ESD protection of high-speed differential signal lines, featuring 0.3 pF typical capacitance, 5 V minimum breakdown voltage, 10.5 A peak pulse current (8/20 µs), and ±20 kV IEC 61000-4-2 contact/air ESD rating - deployed in USB3.2 Gen 2×2, HDMI 2.1, and Thunderbolt 3 interfaces.
For engineers reviewing the D3V3Z1BD2CSP datasheet, D3V3Z1BD2CSP pinout, D3V3Z1BD2CSP application, or D3V3Z1BD2CSP equivalent, key selection criteria include clamping voltage (5.3 V at 10.5 A), reverse leakage (<50 nA at 3.3 V), differential resistance (0.14 Ω), thermal resistance (500 °C/W), and X2-DSN0603-2 chip-scale package compatibility with high-density PCB layouts.
Technical Context
This device implements a silicon avalanche structure optimized for bidirectional transient suppression on single-ended or differential I/O lines. Its low dynamic impedance (0.14 Ω) ensures rapid voltage clamping during ESD events, while sub-0.34 pF maximum capacitance preserves signal integrity up to 10 Gbps.
The X2-DSN0603-2 package uses NiAu bumps for solderability and features electrically active side walls requiring controlled reflow to avoid shorts. It operates across –55 °C to +150 °C and derates linearly above 25 °C per Figure 1 and Figure 2 in DS43163 Rev. 2–2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Breakdown Voltage (VBR) | 5 V min - Ensures reliable conduction onset before damage to 3.3 V I/O rails |
| Clamping Voltage (VCL) | 5.3 V typ at 10.5 A - Limits stress on protected transceivers during surge |
| Capacitance (CT) | 0.3 pF typ at 1 MHz - Enables minimal signal distortion in 10G Ethernet and HDMI 2.1 |
| Peak Pulse Current (IPP) | 10.5 A (8/20 µs) - Withstands lightning-surge-level transients per IEC 61000-4-5 |
| ESD Withstand | ±20 kV contact & air (IEC 61000-4-2) - Meets highest system-level ESD immunity requirements |
| Reverse Leakage (IR) | 50 nA max at 3.3 V - Prevents DC loading of high-impedance receiver inputs |
| Differential Resistance (RDYN) | 0.14 Ω typ - Delivers fast, low-voltage clamping response under TLP stress |
Pinout & Package
Package: X2-DSN0603-2 chip-scale package (0.60 × 0.30 × 0.30 mm), NiAu bump terminals, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (Bidirectional) | Interchangeable terminal - symmetrical structure enables line-to-ground protection without polarity constraint |
| Pin 2 | Anode/Cathode (Bidirectional) | Paired terminal forming low-inductance path between protected line and ground reference |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD protection | Single-device solution for AC-coupled differential pairs without polarity alignment |
| Ultra-low junction capacitance | 0.3 pF typ preserves signal rise time and eye diagram integrity in >10 Gbps links |
| Low dynamic impedance | 0.14 Ω enables sub-5.5 V clamping at full 10.5 A surge, protecting sensitive SerDes I/O |
| High ESD robustness | ±20 kV contact discharge withstand eliminates need for secondary board-level shielding |
| Chip-scale footprint | 0.60 × 0.30 mm outline allows placement directly adjacent to connector pins or IC pads |
Applications
| USB3.2 Gen 2×2 Interface | HDMI 2.1 Channel Protection |
|---|---|
Use Scenario: Protecting SuperSpeed+ differential lanes in dual-lane USB Type-C implementations. IC Role / Device Role / Timing Role: Line-to-ground TVS clamp placed within 3 mm of connector to suppress ESD before reaching controller PHY. Use Value: 0.3 pF capacitance avoids insertion loss degradation above 10 GHz, maintaining compliance with USB-IF SSX2 electrical specs. | Use Scenario: Shielding TMDS clock and data channels against handling ESD in 48 Gbps HDMI 2.1 sources. IC Role / Device Role / Timing Role: Bidirectional transient suppressor mounted at PCB edge near HDMI receptacle. Use Value: 5.3 V clamping voltage stays below HDMI 2.1 receiver absolute maximum rating (5.5 V), preventing latch-up. |
| Thunderbolt 3 Differential Pair | 10GBASE-T Ethernet PHY Protection |
Use Scenario: Safeguarding bidirectional 20 Gbps differential lanes in host-side Thunderbolt 3 ports. IC Role / Device Role / Timing Role: Low-capacitance TVS placed inline between retimer and edge connector. Use Value: Symmetrical clamping ensures equal positive/negative excursion control, preserving common-mode rejection. | Use Scenario: Protecting MDI interface pins of 10GBASE-T PHYs from installation-induced surges. IC Role / Device Role / Timing Role: Line-to-ground transient suppressor integrated into magnetics module PCB layout. Use Value: 10.5 A surge rating exceeds IEC 61000-4-5 Level 3 requirement (6 A), enabling single-device compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional low-capacitance TVS applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMLJ3.3A-HF | Higher capacitance (12 pF), unidirectional, DO-214AC package (3.7 × 2.6 mm) | Not suitable for >1 Gbps signaling; requires polarity-aware layout | Select only for cost-sensitive, low-speed industrial I/O where size and bandwidth are secondary |
| TPD4E05U06DQAR | 0.5 pF typ, quad-channel, 1.6 × 1.6 mm QFN - higher capacitance, larger footprint | Supports four lines simultaneously but adds 0.2 pF margin vs. D3V3Z1BD2CSP's 0.3 pF | Choose when consolidating multiple high-speed lines onto one device; avoid if single-line optimization is critical |
Compared with SMLJ3.3A-HF and TPD4E05U06DQAR, D3V3Z1BD2CSP delivers the lowest capacitance (0.3 pF) in the smallest footprint (0.60 × 0.30 mm), making it uniquely suited for next-gen 10+ Gbps differential interfaces where signal fidelity and board space are constrained.
Availability
D3V3Z1BD2CSP is available at Aetrix Electronics and suitable for USB3.2 Gen 2×2, HDMI 2.1, and Thunderbolt 3 design-in requiring stable component supply, long-term lifecycle assurance, and traceable RoHS/Green compliance.
Supply support for D3V3Z1BD2CSP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance protection, power management, and signal integrity solutions for computing, communications, and industrial markets.
D3V3Z1BD2CSP belongs to Diodes' advanced ESD protection product line, designed specifically for ultra-high-speed serial interfaces where sub-0.4 pF capacitance and sub-5.5 V clamping are mandatory for signal integrity and IC reliability.
FAQ
What is the maximum operating temperature for D3V3Z1BD2CSP?
The D3V3Z1BD2CSP is rated for continuous operation from –55 °C to +150 °C. Its thermal resistance (RθJA) is 500 °C/W on a standard FR-4 PCB with 2 oz copper, and power dissipation derates linearly above +25 °C per Figure 1 in DS43163 Rev. 2–2.
Can D3V3Z1BD2CSP protect both differential and single-ended lines?
Yes - its bidirectional architecture and symmetrical I-V curve allow use on either differential pairs (e.g., USB3.2 TX+/TX–) or single-ended high-speed lines (e.g., HDMI clock). Each device protects one line-to-ground path, and two units are used per differential pair.
Is D3V3Z1BD2CSP compliant with automotive qualification standards?
No - D3V3Z1BD2CSP is not AEC-Q200 qualified. Diodes offers automotive-grade variants (e.g., D3V3Z1BD2CSP-A) with PPAP documentation and IATF 16949 manufacturing; contact Diodes or Aetrix for qualified alternatives meeting AEC-Q200 Grade 1 or Grade 2 requirements.
How does the X2-DSN0603-2 package affect PCB assembly?
The X2-DSN0603-2 uses NiAu bumps and has electrically active silicon side walls. Reflow must avoid solder bridging or flux contamination on side walls; recommended stencil aperture is 0.206 mm × 0.194 mm (G/X per DS43163), and post-reflow inspection should verify no shorts to adjacent traces.
D3V3Z1BD2CSP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- 5.3V (Typ)
- Current - Peak Pulse (10/1000µs):
- 10.5A (8/20µs)
- Power - Peak Pulse:
- 55W
- Power Line Protection:
- No
- Applications:
- Ethernet, HDMI, USB
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DSN0603-2
D3V3Z1BD2CSP-7 FAQ
1.How can I place an order for D3V3Z1BD2CSP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for D3V3Z1BD2CSP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D3V3Z1BD2CSP-7 reliable?
The price and inventory of D3V3Z1BD2CSP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D3V3Z1BD2CSP-7 is usually 5 days.
3.What payment methods are accepted for D3V3Z1BD2CSP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D3V3Z1BD2CSP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D3V3Z1BD2CSP-7?
D3V3Z1BD2CSP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D3V3Z1BD2CSP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D3V3Z1BD2CSP-7?
For technical support, including D3V3Z1BD2CSP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D3V3Z1BD2CSP-7 requirements.
6.How does Aetrix verify that D3V3Z1BD2CSP-7 is sourced from the original manufacturer or authorized distributors?
All D3V3Z1BD2CSP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D3V3Z1BD2CSP-7 meets industry standards.
7.What is the process for return or replacement of D3V3Z1BD2CSP-7?
All D3V3Z1BD2CSP-7 units undergo pre-shipment inspection (PSI). If there is an issue with D3V3Z1BD2CSP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D3V3Z1BD2CSP-7 part is unused and in its original packaging.
Return procedure for D3V3Z1BD2CSP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D3V3Z1BD2CSP-7 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
