My Inquiry
My Account
Diodes Incorporated D5V0F4U10MR-13
- Part No.:
- D5V0F4U10MR-13
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
D5V0F4U10MR-13.pdf
- Description:
- TVS DIODE 5.5VWM 12VC 10MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,707
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
D5V0F4U10MR from Diodes Incorporated is a 4-channel low-capacitance TVS diode array designed for ESD protection of high-speed data lines, featuring ±15kV air/±8kV contact ESD immunity per IEC 61000-4-2, 0.5pF typical channel capacitance, and 5.5V reverse working voltage - deployed in USB 2.0/3.0, HDMI, and SATA interfaces.
For engineers reviewing the D5V0F4U10MR datasheet, D5V0F4U10MR pinout, D5V0F4U10MR application, or D5V0F4U10MR equivalent, key selection criteria include channel count, clamping voltage (10V typ at 1A), dynamic resistance (1.0Ω), thermal derating behavior, and MSOP-10 footprint compatibility with high-speed signal integrity constraints.
Technical Context
This device implements four independent bidirectional TVS diodes in a single MSOP-10 package, each configured between an I/O line and ground, with a common VP (pin 3) and dedicated GND (pin 8). It operates as a shunt-type transient suppressor triggered above 6.0V breakdown voltage.
Its low 0.5pF capacitance minimizes signal distortion on differential pairs; clamping occurs at ≤12V under 1A 8/20µs transients, while leakage remains ≤200nA at 5.5V - enabling use in 480Mbps USB 2.0 and multi-Gbps serial links without impedance discontinuity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±15kV air / ±8kV contact - meets industrial-grade ESD immunity requirements for exposed ports |
| Reverse Working Voltage (VRWM) | 5.5V - supports 5V logic and USB signaling without leakage-induced bias shift |
| Breakdown Voltage (VBR) | 6.0V min at 1mA - ensures reliable triggering before damage to downstream ICs |
| Clamping Voltage (VCL) | 10V typ at 1A, 8/20µs - limits transient overvoltage to safe levels for 3.3V/5V interface receivers |
| Channel Capacitance | 0.5pF typ at 0V, 1MHz - preserves signal integrity up to ~5Gbps in HDMI 1.4 and SATA II |
| Peak Pulse Current (IPP) | 3A per channel, 8/20µs - handles multiple ESD events without degradation |
| Dynamic Resistance (RDYN) | 1.0Ω typ - reduces clamping overshoot and improves energy dissipation efficiency |
Pinout & Package
Package: MSOP-10, surface-mount, lead-free, halogen-free, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 6, 9 | Input/IO Channel | Four independent protected I/O lines - each connects to one data line (e.g., USB D+, D−, HDMI TMDS+) |
| 2, 5, 7, 10 | No Connection | Unbonded pins - must remain unconnected; no internal function or routing |
| 3 | VP (Power Pin) | Optional positive rail connection for enhanced clamping symmetry; not required for basic operation |
| 8 | VN/GND | Common ground reference for all four channels - requires low-inductance PCB tie to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| 4-channel ESD protection | Enables full-port protection for dual-lane interfaces (e.g., USB 2.0 D+/D− + ID/VBUS sense) in one compact footprint |
| 0.5pF typical channel capacitance | Minimizes insertion loss and reflection at >1GHz, supporting eye diagram compliance in USB 3.0 Gen1 (5Gbps) |
| ±15kV air / ±8kV contact ESD rating | Exceeds IEC 61000-4-2 Level 4, qualifying for front-panel and cable-connector applications in consumer electronics |
| MSOP-10 package with 0.5mm pitch | Enables dense layout on space-constrained PCBs while maintaining manufacturability via standard reflow profiles |
| Lead-free, halogen-free, RoHS-compliant | Meets global environmental regulations and enables use in automotive infotainment and medical display modules |
Applications
| USB 2.0 Interface Protection | HDMI 1.4 Signal Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of embedded host controllers against ESD during hot-plug events. IC Role / Device Role / Timing Role: Shunt-type transient voltage suppressor placed directly at connector entry point. Use Value: 0.5pF capacitance avoids signal rise-time degradation; 10V clamping prevents PHY latch-up during ±8kV contact discharge. | Use Scenario: Safeguarding TMDS clock and data pairs in portable media players connecting to external displays. IC Role / Device Role / Timing Role: Per-channel bidirectional clamp referenced to chassis ground, preserving differential impedance. Use Value: Low dynamic resistance (1.0Ω) ensures fast response and minimal overshoot on 2.25Gbps TMDS signals. |
| SATA II Data Lane Protection | IEEE 1394 (FireWire) Port Protection |
Use Scenario: ESD hardening of SATA TX/RX differential pairs in solid-state storage enclosures. IC Role / Device Role / Timing Role: Four-channel array assigned to SATA+/-, Ground, and optional VP bias for balanced clamping. Use Value: 5.5V VRWM aligns with SATA I/O voltage range; 3A peak pulse rating withstands repeated surge events. | Use Scenario: Front-panel FireWire 400 (400Mbps) port protection in audio/video editing workstations. IC Role / Device Role / Timing Role: Bidirectional TVS on TPB+/TPB− and TPA+/TPA− lines, grounded via shared pin 8. Use Value: MSOP-10 footprint allows placement within 5mm of connector; ±15kV air rating covers lab handling ESD risks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1006-04UTG | 0.35pF capacitance, 6.5V VRWM, SOT-23-6 package (2-channel) | Lower capacitance but only two channels; requires two devices for 4-line protection | Select when ultra-low capacitance (<0.4pF) is prioritized over channel density and board area |
| ESD5V3U4-2/TR | 0.6pF capacitance, 5.3V VRWM, SOT-23-6 package (2-channel) | Higher leakage (500nA), slightly lower ESD rating (±12kV air) | Choose for cost-sensitive designs where moderate capacitance and reduced ESD margin are acceptable |
Compared with SP1006-04UTG and ESD5V3U4-2/TR, D5V0F4U10MR delivers optimal balance of 4-channel integration, 0.5pF capacitance, and ±15kV air rating in a single MSOP-10 - reducing BOM count and PCB real estate versus dual 2-channel alternatives.
Availability
D5V0F4U10MR is available at Aetrix Electronics and suitable for USB 2.0/3.0 interface protection, HDMI 1.4 signal conditioning, and SATA II data lane hardening requiring stable component supply across production lifecycles.
Supply support for D5V0F4U10MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
D5V0F4U10MR belongs to Diodes' ESD protection product line, engineered specifically for high-speed digital interface robustness - targeting consumer, computing, and industrial applications where signal integrity and ESD reliability are co-constrained.
FAQ
What is the maximum operating temperature for D5V0F4U10MR?
The device is rated for continuous operation from −65°C to +150°C ambient. Its thermal resistance (RθJA) is 250°C/W on a standard FR-4 board with 2oz copper, and power derating begins linearly above 25°C - reaching 50% of 500mW rating at +125°C ambient.
Can pin 3 (VP) be left unconnected?
Yes, VP (pin 3) is optional and may be left floating or tied to VCC depending on system grounding strategy. When unconnected, the device functions as four independent bidirectional clamps between I/O pins and GND (pin 8); connecting VP can improve clamping symmetry in asymmetric transient scenarios.
Is D5V0F4U10MR suitable for USB 3.0 Gen 1 (5Gbps) applications?
Yes - its 0.5pF typical capacitance, 1.0Ω dynamic resistance, and 10V clamping voltage meet USB-IF signal integrity requirements for Gen 1. Application Note AN77 from Diodes confirms eye diagram compliance at 5Gbps with this device placed within 5mm of the connector.
How does the MSOP-10 footprint compare to industry-standard layouts?
The MSOP-10 outline matches JEDEC MO-187AA, with 0.5mm pitch, 3.0mm × 4.9mm body, and recommended pad layout AP02001. Its thermal pad is absent (no exposed die pad), simplifying soldering but requiring attention to trace width and ground plane coupling to manage 3A pulse energy dissipation.
D5V0F4U10MR-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 12V
- Current - Peak Pulse (10/1000µs):
- 3A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- HDMI
- Capacitance @ Frequency:
- 0.5pF @ 1MHz
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-MSOP
D5V0F4U10MR-13 FAQ
1.How can I place an order for D5V0F4U10MR-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for D5V0F4U10MR-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D5V0F4U10MR-13 reliable?
The price and inventory of D5V0F4U10MR-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D5V0F4U10MR-13 is usually 5 days.
3.What payment methods are accepted for D5V0F4U10MR-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D5V0F4U10MR-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D5V0F4U10MR-13?
D5V0F4U10MR-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D5V0F4U10MR-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D5V0F4U10MR-13?
For technical support, including D5V0F4U10MR-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D5V0F4U10MR-13 requirements.
6.How does Aetrix verify that D5V0F4U10MR-13 is sourced from the original manufacturer or authorized distributors?
All D5V0F4U10MR-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D5V0F4U10MR-13 meets industry standards.
7.What is the process for return or replacement of D5V0F4U10MR-13?
All D5V0F4U10MR-13 units undergo pre-shipment inspection (PSI). If there is an issue with D5V0F4U10MR-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D5V0F4U10MR-13 part is unused and in its original packaging.
Return procedure for D5V0F4U10MR-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D5V0F4U10MR-13 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
