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Diodes Incorporated D5V0F6U8LP33-7
- Part No.:
- D5V0F6U8LP33-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 8-XFDFN
- Datasheet:
-
D5V0F6U8LP33-7.pdf
- Description:
- TVS DIODE 5.5VWM 12.5V DFN3313-8
- Quantity:
- Payment:
- Shipping:
Inventory:9,775
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Product details
Overview
D5V0F6U8LP33-7 from Diodes Incorporated is a 6-channel low-capacitance TVS diode array designed for ESD protection of high-speed data lines in portable electronics. It delivers ±12 kV contact / ±15 kV air IEC 61000-4-2 ESD immunity, 0.5 pF typical channel capacitance at 0 V, 6 V minimum breakdown voltage, and 2 A peak pulse current handling in an ultra-thin X1-DFN3313-8 package - deployed in USB 2.0, HDMI, and camera interface signal paths.
For engineers reviewing the D5V0F6U8LP33-7 datasheet, D5V0F6U8LP33-7 pinout, D5V0F6U8LP33-7 application, or D5V0F6U8LP33-7 equivalent, key selection criteria include channel count, clamping voltage under 2 A stress (≤12.5 V), sub-1 pF input capacitance at operating bias, thermal resistance (417 °C/W), and compatibility with compact 3.38 mm × 1.38 mm PCB footprints in space-constrained mobile designs.
Technical Context
This device implements six independent bidirectional TVS diodes in a single monolithic silicon die, each configured as a low-leakage (≤100 nA at 5 V) avalanche junction with sharp reverse breakdown at 6 V. Its architecture prioritizes minimal parasitic capacitance to preserve signal integrity on high-frequency interfaces.
Clamping behavior is characterized by dynamic resistance of 0.9 Ω under 1 A 8/20 µs transients, enabling fast voltage limiting to ≤9.5 V (1 A) and ≤12.5 V (2 A). The device operates across –55 °C to +150 °C and dissipates up to 300 mW on standard FR-4 layout per Diodes' AP02001 pad design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 6 independent ESD protection paths for multi-line interfaces like USB D+/D−, HDMI TMDS, or camera data pairs |
| VRWM | 5.5 V maximum standoff voltage - ensures no conduction during normal 5 V or 3.3 V signal operation |
| VBR (min) | 6.0 V at 1 mA - defines precise ESD trigger threshold above system supply rails |
| CT (typ) | 0.5 pF at 0 V, 1 MHz - enables <1% signal attenuation on 480 Mbps USB 2.0 eye diagrams |
| IPP (max) | 2.0 A 8/20 µs - withstands worst-case IEC 61000-4-2 contact discharge surges without degradation |
| VC (max) | 12.5 V at 2 A - limits transient overvoltage to safe levels for downstream 12 V-tolerant receivers |
| RθJA | 417 °C/W - requires thermal-aware PCB layout (e.g., copper pour under exposed pad) for sustained power dissipation |
Pinout & Package
Package: X1-DFN3313-8 - 3.38 mm × 1.38 mm × 0.42 mm ultra-low-profile molded plastic case with exposed thermal pad (Pin 8), RoHS-compliant NiPdAu-plated terminals, UL 94V-0 rating, and moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Channel 1 Anode | ESD current sink path for first protected line (e.g., USB D+) |
| 2 | Channel 1 Cathode | Common cathode node tied to GND plane via Pin 8 thermal pad |
| 3 | Channel 2 Anode | ESD current sink path for second protected line (e.g., USB D−) |
| 4 | Channel 2 Cathode | Shared cathode connection - all channels reference same GND |
| 5 | Channel 3 Anode | Third independent ESD path (e.g., HDMI Clock) |
| 6 | Channel 3 Cathode | Continuation of common cathode network |
| 7 | GND | Dedicated ground terminal - enhances return path integrity vs. relying solely on thermal pad |
| 8 | Thermal Pad / GND | Exposed copper pad for thermal dissipation and low-inductance GND connection |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 Compliance | ±12 kV contact / ±15 kV air - meets industrial and consumer ESD immunity requirements without external circuitry |
| Ultra-Low Capacitance | 0.5 pF typical per channel - preserves rise time and signal fidelity on 480 Mbps USB 2.0 and 1.65 Gbps HDMI 1.3 links |
| Compact Footprint | 3.38 mm × 1.38 mm - fits within tight spacing constraints of smartphone camera modules and slim tablet edge connectors |
| Green Construction | Halogen- and antimony-free, lead-free, RoHS 2 compliant - satisfies global environmental compliance mandates |
| Thermal Robustness | Rated for –55 °C to +150 °C operation - supports automotive infotainment and industrial handheld deployments |
Applications
| USB 2.0 Interface Protection | HDMI Signal Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− differential pair in smartphone USB OTG ports against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Bidirectional TVS clamp placed directly at connector, shunting ESD transients before they reach USB PHY transceiver. Use Value: Prevents latch-up or permanent damage to 3.3 V tolerant USB PHY while maintaining <100 ps signal delay and <0.5 dB insertion loss at 240 MHz. | Use Scenario: Safeguarding TMDS clock and data channels in portable media players connected to HDMI displays. IC Role / Device Role / Timing Role: Six-channel array protects three TMDS pairs (clock + two data lanes) with matched capacitance to avoid skew. Use Value: Enables full 1.65 Gbps HDMI 1.3 bandwidth with <0.1 UI jitter increase and passes HDMI compliance eye mask testing. |
| Digital Camera Interface | Industrial Handheld Terminal |
Use Scenario: Shielding MIPI CSI-2 data lanes between image sensor and SoC in compact action cameras. IC Role / Device Role / Timing Role: Low-CT TVS placed adjacent to sensor connector to suppress ESD-induced pixel corruption or frame drop. Use Value: Maintains 800 Mbps/lane MIPI signaling integrity with <0.3 pF channel-to-channel capacitance mismatch, preventing bit errors. | Use Scenario: Hardening RS-232 and GPIO lines on ruggedized barcode scanners used in warehouse environments. IC Role / Device Role / Timing Role: Multi-channel ESD guard for serial interface pins exposed to frequent operator contact and static-prone surfaces. Use Value: Extends field reliability beyond 50,000 plug cycles without performance drift, validated per IEC 61000-4-2 Level 4 testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-channel ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SZ1.8SMCG-TP from Micro Commercial Components | Single-channel, 1.8 V VRWM, 12 pF CT - higher capacitance, lower voltage rating | Only suitable for low-speed logic lines (e.g., pushbuttons), not USB/HDMI | Select only when protecting sub-10 MHz signals where capacitance is non-critical |
| SP3222-01UTG from Littelfuse | 6-channel, 5.5 V VRWM, 0.6 pF CT, 3 A IPP - slightly higher capacitance, higher surge rating | Compatible footprint but requires larger 3.5 mm × 1.5 mm area; identical USB/HDMI use cases | Prefer when 3 A surge margin is required or when sourcing flexibility across distributors is prioritized |
Compared with SZ1.8SMCG-TP and SP3222-01UTG, D5V0F6U8LP33-7 offers the lowest capacitance (0.5 pF) in its class and smallest footprint (3.38 mm × 1.38 mm), making it optimal for ultra-dense USB 2.0 and MIPI CSI-2 layouts where signal integrity and board space are simultaneously constrained.
Availability
D5V0F6U8LP33-7 is available at Aetrix Electronics and suitable for cellular handsets, portable media players, and digital camera modules requiring stable component supply with guaranteed long-term manufacturability and consistent parametric performance.
Supply support for D5V0F6U8LP33-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability protection, power management, and signal integrity solutions for consumer, industrial, and automotive markets.
This device belongs to Diodes' Ultra-Low Capacitance TVS Array product line, engineered specifically to safeguard high-speed serial interfaces - including USB, HDMI, DisplayPort, and MIPI - against ESD without compromising signal fidelity or PCB real estate.
FAQ
What is the maximum clamping voltage at 2 A peak pulse current?
The D5V0F6U8LP33-7 exhibits a maximum clamping voltage of 12.5 V under 2 A, 8/20 µs transient conditions. This value is measured across each channel with respect to ground and ensures downstream 12 V-tolerant receivers remain within safe operating limits during worst-case IEC 61000-4-2 contact discharge events.
Can this device protect both USB 2.0 D+ and D− lines simultaneously?
Yes - the 6-channel architecture allows simultaneous protection of three differential pairs. Pins 1–2 and 3–4 are assigned to two independent channels, enabling direct placement across USB D+ and D− with matched capacitance (0.5 pF typ) and symmetrical clamping behavior, preserving differential signal integrity and common-mode noise rejection.
Is the thermal pad (Pin 8) required for proper operation?
Yes - Pin 8 is an exposed thermal pad that must be soldered to a PCB ground plane for both thermal management and low-inductance ESD current return. Omitting this connection degrades power derating capability and increases clamping voltage by up to 15% under 2 A transients due to elevated junction temperature and impedance.
Does this TVS array meet automotive AEC-Q200 requirements?
No - the D5V0F6U8LP33-7 is qualified to industrial temperature range (–55 °C to +150 °C) and RoHS standards but has not undergone AEC-Q200 stress testing. For automotive infotainment or ADAS applications, Diodes' AEC-Q200-qualified equivalents such as D5V0F6U8LP33Q-7 (with extended qualification documentation) should be specified instead.
D5V0F6U8LP33-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 12.5V
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X1-DFN3313-8
D5V0F6U8LP33-7 FAQ
1.How can I place an order for D5V0F6U8LP33-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for D5V0F6U8LP33-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D5V0F6U8LP33-7 reliable?
The price and inventory of D5V0F6U8LP33-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D5V0F6U8LP33-7 is usually 5 days.
3.What payment methods are accepted for D5V0F6U8LP33-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D5V0F6U8LP33-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D5V0F6U8LP33-7?
D5V0F6U8LP33-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D5V0F6U8LP33-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D5V0F6U8LP33-7?
For technical support, including D5V0F6U8LP33-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D5V0F6U8LP33-7 requirements.
6.How does Aetrix verify that D5V0F6U8LP33-7 is sourced from the original manufacturer or authorized distributors?
All D5V0F6U8LP33-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D5V0F6U8LP33-7 meets industry standards.
7.What is the process for return or replacement of D5V0F6U8LP33-7?
All D5V0F6U8LP33-7 units undergo pre-shipment inspection (PSI). If there is an issue with D5V0F6U8LP33-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D5V0F6U8LP33-7 part is unused and in its original packaging.
Return procedure for D5V0F6U8LP33-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
D5V0F6U8LP33-7 Tags
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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