My Inquiry
My Account
Diodes Incorporated DESD18VF1BLP3-7
- Part No.:
- DESD18VF1BLP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
DESD18VF1BLP3-7.pdf
- Description:
- DATALINE PROTECTION PP SLP0603
- Quantity:
- Payment:
- Shipping:
Inventory:9,900
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DESD18VF1BLP3-7 from Diodes Incorporated is a bidirectional TVS diode designed for ultra-low-capacitance ESD protection of high-speed data lines. It features a 18 V reverse working voltage, 19 V minimum breakdown voltage, 0.3 pF typical capacitance at 1 MHz, ±14 kV contact/±15 kV air ESD rating per IEC 61000-4-2, and 1 A peak pulse current capability - deployed in USB 2.0, HDMI, and cellular antenna interfaces.
For engineers reviewing the DESD18VF1BLP3-7 datasheet, DESD18VF1BLP3-7 pinout, DESD18VF1BLP3-7 application, or DESD18VF1BLP3-7 equivalent, key selection criteria include sub-0.4 pF signal-line capacitance, low clamping voltage under 15 V at 1 A, bidirectional surge handling, X2-DFN0603-2 footprint compatibility, and IEC 61000-4-2 compliance for portable electronics interface protection.
Technical Context
This TVS operates as a voltage-clamped transient suppressor across I/O-to-ground paths, leveraging an avalanche junction structure to respond within <1 ns to ESD events. Its bidirectional configuration enables symmetric clamping on both polarities without polarity dependency, critical for AC-coupled or differential signaling lines like USB D+/D−.
The device uses a planar silicon process optimized for minimal parasitic capacitance and low dynamic resistance (0.5 Ω typ), ensuring minimal signal distortion while maintaining robust 20 W peak pulse power dissipation (8/20 µs) and thermal stability up to +150 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 18 V - Maximum continuous reverse operating voltage before leakage exceeds 1 nA; sets upper limit for safe signal swing in protected line. |
| VBR (min) | 19 V - Minimum breakdown voltage at 1 mA; ensures reliable turn-on only during transients, not during normal operation. |
| VCL2 | 15 V - Clamping voltage at 1 A (8/20 µs), defining maximum voltage seen by downstream IC during surge event. |
| CT (typ) | 0.3 pF - Input capacitance at 0 V and 1 MHz; preserves signal integrity for >500 Mbps data rates (e.g., USB 2.0). |
| ESD Rating | ±14 kV contact / ±15 kV air - Complies with IEC 61000-4-2 Level 4, enabling single-device protection without external RC filtering. |
| Package | X2-DFN0603-2 - 0.62 mm × 0.32 mm, 0.3 mm height, 2-terminal land-grid package for high-density PCB layout. |
Pinout & Package
Package: X2-DFN0603-2 - ultra-compact, bottom-terminated, lead-free plastic package with matte tin-plated copper leadframe; moisture sensitivity level 1 per J-STD-020; UL 94V-0 rated molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical ESD path; connects to protected I/O line (e.g., USB D+). |
| Terminal 2 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical ESD path; connects to system ground (GND) reference plane. |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 ESD Protection | ±14 kV contact / ±15 kV air - eliminates need for secondary protection stages in consumer-grade handheld designs. |
| Ultra-Low Capacitance | 0.3 pF typical - enables use on 480 Mbps USB 2.0, MIPI D-PHY, and audio codec lines without signal rise-time degradation. |
| Bidirectional Clamping | Symmetric VBR and VCL - supports AC-coupled or floating signal paths without polarity constraints (e.g., antenna feedlines). |
| Thermal Robustness | 500 °C/W RθJA on FR-4 - maintains <125 °C junction rise under 1 A surge when mounted per recommended pad layout. |
Applications
| USB 2.0 Interface Protection | HDMI Signal Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines in smartphone USB ports against repeated ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector, shunting ESD energy to ground before it reaches PHY IC. Use Value: 0.3 pF capacitance avoids signal integrity loss at 480 Mbps; 15 V clamping prevents PHY latch-up or oxide damage. | Use Scenario: Shielding TMDS clock and data channels in portable media players from user-handling ESD during HDMI cable hot-plug. IC Role / Device Role / Timing Role: Low-C TVS placed adjacent to HDMI receptacle, providing sub-nanosecond response to ±15 kV air discharge. Use Value: Symmetric clamping preserves differential signal balance; 19 V VBR avoids false triggering during 3.3 V logic swings. |
| Cellular Antenna Feedline | Digital Camera Image Sensor Interface |
Use Scenario: Guarding RF front-end antenna switch control lines and bias feeds in LTE/5G handsets exposed to human-body ESD. IC Role / Device Role / Timing Role: Ground-referenced TVS on DC-biased RF control path, suppressing fast transients without degrading RF insertion loss. Use Value: 0.3 pF capacitance minimizes detuning of matching networks; 1 A IPP handles multiple ESD strikes over product lifetime. | Use Scenario: Protecting parallel CSI-2 data lanes between image sensor and SoC in compact digital cameras subject to lens-mount ESD. IC Role / Device Role / Timing Role: Per-lane TVS on each LVCMOS data line, placed immediately after sensor flex connector. Use Value: 15 V clamping prevents sensor pixel array latch-up; X2-DFN0603-2 footprint allows placement within 2 mm of connector. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J18A-Q | DO-214AC package; 18 V VRWM; 0.8 pF CT; 22.2 V VBR min; 30 W PPP | Larger footprint (4.3 × 2.6 mm); higher capacitance limits use to lower-speed interfaces (≤100 Mbps) | Select when board space permits and higher surge rating (30 W vs. 20 W) is prioritized over signal integrity. |
| TPD2E001DRYR | 2-channel, 0.85 pF per channel, 5.5 V VRWM, SOT-553 package, integrated ESD protection for dual-line interfaces | Lower voltage rating restricts use to 3.3 V or 5 V logic; dual-channel reduces component count but increases capacitance | Choose for cost-sensitive dual-line protection where 0.85 pF is acceptable and 18 V standoff is unnecessary. |
Compared with SMA6J18A-Q and TPD2E001DRYR, DESD18VF1BLP3-7 uniquely delivers 0.3 pF capacitance in a 0.62 mm × 0.32 mm footprint - making it the only option qualified for >400 Mbps data lines in space-constrained portable designs requiring 18 V standoff and IEC 61000-4-2 Level 4 compliance.
Availability
DESD18VF1BLP3-7 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI signal line safeguarding, and cellular antenna feedline ESD suppression requiring stable component supply across high-volume consumer electronics production.
Supply support for DESD18VF1BLP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This part belongs to Diodes' DESD ultra-low-capacitance TVS family, engineered specifically for ESD protection of high-speed digital interfaces in portable and wearable electronics where board space and signal fidelity are critical constraints.
FAQ
What is the maximum operating temperature for DESD18VF1BLP3-7?
The device supports an operating junction temperature range of –65 °C to +150 °C. Its thermal resistance (RθJA) is 500 °C/W when mounted on a standard FR-4 PCB with the recommended pad layout, allowing sustained operation at ambient temperatures up to +85 °C under typical surge conditions.
Does DESD18VF1BLP3-7 require external biasing or control signals?
No. DESD18VF1BLP3-7 is a passive, two-terminal TVS diode with no control pins or bias requirements. It functions solely through avalanche breakdown and remains fully inactive below its 19 V minimum breakdown voltage, drawing less than 30 nA leakage at 18 V reverse bias.
Can this TVS be used on differential pairs such as USB D+/D− without skew or imbalance?
Yes. Its bidirectional symmetry, matched VBR (19–25 V) and VCL (15 V at 1 A), and identical 0.3 pF capacitance on both terminals ensure balanced clamping and negligible inter-pair skew - verified in Diodes' application testing for USB 2.0 compliance with eye diagram integrity maintained at 480 Mbps.
Is the X2-DFN0603-2 package compatible with standard reflow profiles?
Yes. The package is rated for moisture sensitivity level 1 (MSL-1) per J-STD-020 and supports industry-standard lead-free reflow profiles (peak 260 °C, 10–30 sec above 217 °C). Its matte tin finish ensures reliable solderability per MIL-STD-202, Method 208, with no pre-bake required.
DESD18VF1BLP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 18V (Max)
- Voltage - Breakdown (Min):
- 19V
- Voltage - Clamping (Max) @ Ipp:
- 17V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- 20W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0603-2
DESD18VF1BLP3-7 FAQ
1.How can I place an order for DESD18VF1BLP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DESD18VF1BLP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DESD18VF1BLP3-7 reliable?
The price and inventory of DESD18VF1BLP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DESD18VF1BLP3-7 is usually 5 days.
3.What payment methods are accepted for DESD18VF1BLP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DESD18VF1BLP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DESD18VF1BLP3-7?
DESD18VF1BLP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DESD18VF1BLP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DESD18VF1BLP3-7?
For technical support, including DESD18VF1BLP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DESD18VF1BLP3-7 requirements.
6.How does Aetrix verify that DESD18VF1BLP3-7 is sourced from the original manufacturer or authorized distributors?
All DESD18VF1BLP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DESD18VF1BLP3-7 meets industry standards.
7.What is the process for return or replacement of DESD18VF1BLP3-7?
All DESD18VF1BLP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with DESD18VF1BLP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DESD18VF1BLP3-7 part is unused and in its original packaging.
Return procedure for DESD18VF1BLP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DESD18VF1BLP3-7 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
