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Diodes Incorporated DESD3V3Z1BCSF-7

Part No.:
DESD3V3Z1BCSF-7
Manufacturer:
Diodes Incorporated
Category:
TVS Diodes
Package:
0201 (0603 Metric)
Datasheet:
AetrixDESD3V3Z1BCSF-7.pdf
Description:
TVS DIODE 3.3VWM 11.5VC DSN0603
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,957

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Product details

Overview

DESD3V3Z1BCSF-7 from Diodes Incorporated is a bidirectional TVS diode designed for ultra-low-capacitance ESD protection of high-speed data lines. It features a 3.3 V reverse standoff voltage, 0.17 pF typical input capacitance, ±8 kV IEC 61000-4-2 contact/air ESD rating, and 3 A peak pulse current capability-optimized for USB3.1 and Thunderbolt 3 interface protection.

For engineers reviewing the DESD3V3Z1BCSF-7 datasheet, DESD3V3Z1BCSF-7 pinout, DESD3V3Z1BCSF-7 application, or DESD3V3Z1BCSF-7 equivalent, key selection criteria include clamping voltage at 3 A (4.5 V typ), differential dynamic resistance (0.4 Ω), thermal resistance (500 °C/W), and X2-DSN0603-2 chip-scale package compatibility with high-density PCB layouts.

Technical Context

This TVS device operates in bidirectional avalanche mode to clamp transient overvoltages across signal pairs without polarity dependence. Its low 0.17 pF capacitance ensures minimal signal integrity degradation up to 10 GHz, as verified by S21 attenuation measurements.

The X2-DSN0603-2 package uses NiAu bumps for solderability and features electrically active side walls requiring controlled reflow to avoid shorts. Thermal derating follows a linear 500 °C/W junction-to-ambient path on standard FR-4 with 2 oz copper.

Key Specifications

ParameterValue and Actual Design Meaning
Reverse Standoff Voltage3.3 V - Maximum continuous working voltage before conduction begins
Clamping Voltage (IPP = 3 A)4.5 V typ - Voltage seen by protected IC during 8/20 μs surge, limiting stress on downstream transceivers
Input Capacitance0.17 pF typ @ 1 MHz - Enables <1% signal distortion on 10 Gbps USB3.1/Thunderbolt 3 differential lanes
ESD Rating±8 kV air & contact per IEC 61000-4-2 - Meets full system-level ESD immunity requirements without additional shielding
Differential Dynamic Resistance0.4 Ω - Ensures fast response and low voltage overshoot during sub-nanosecond ESD events
Peak Pulse Power25 W @ 8/20 μs - Sustains multiple ESD strikes without parameter shift or failure

Pinout & Package

Package: X2-DSN0603-2 chip-scale package (0.6 mm × 0.3 mm, 0.14 mm height) with NiAu solder bumps; moisture sensitivity level 1; side walls are electrically active bare silicon.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1Anode of bidirectional TVSConnected to high-speed signal line (e.g., USB3.1 TX+/RX+); forms one terminal of symmetrical clamping path
Pin 2Cathode of bidirectional TVSConnected to signal return or ground reference; completes low-inductance ESD current path to GND

Key Features

FeatureDesign Value
Bidirectional clamping architectureProtects AC-coupled differential signals (e.g., USB3.1 SuperSpeed lanes) without polarity constraints
Ultra-low 0.17 pF input capacitanceMaintains signal integrity up to 10 GHz, validated via S21 measurement down to –10 dB at 8 GHz
0.4 Ω dynamic resistanceMinimizes voltage overshoot during 100 ns TLP pulses, critical for sub-100 ps ESD rise times
Chip-scale X2-DSN0603-2 footprintEnables placement within 1 mm of connector pins, reducing loop inductance and improving clamping efficiency

Applications

USB3.1 Interface ProtectionThunderbolt 3 Channel Protection

Use Scenario: Protecting SuperSpeed differential pairs (TX+/TX–, RX+/RX–) in host/port controllers against connector-induced ESD.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed immediately adjacent to USB Type-C receptacle.

Use Value: 0.17 pF capacitance prevents eye diagram closure; 4.5 V clamping at 3 A ensures PHY I/O remains within safe operating area during ±8 kV contact discharge.

Use Scenario: Safeguarding 20 Gbps differential lanes in Thunderbolt 3 docking stations and cable assemblies.

IC Role / Device Role / Timing Role: Low-capacitance TVS on each high-speed lane, mounted with minimal trace length to preserve signal fidelity.

Use Value: Sub-0.2 pF capacitance and 0.4 Ω RDYN limit jitter increase to <0.5 UI and maintain BER <10⁻¹² under repeated ESD stress.

High-Speed HDMI 2.0a Port ProtectionPCIe Gen3 Serial Link Protection

Use Scenario: Shielding TMDS clock and data channels in portable monitors and graphics adapters from hot-plug ESD events.

IC Role / Device Role / Timing Role: Single-channel TVS per differential pair, leveraging symmetric breakdown for AC-coupled signaling.

Use Value: 3.3 V VRWM aligns with HDMI 2.0a common-mode voltage range; 4.5 V clamping prevents receiver latch-up during ±8 kV discharges.

Use Scenario: Protecting PCIe Gen3 x4 root complex and endpoint links in embedded servers and industrial controllers.

IC Role / Device Role / Timing Role: Per-lane TVS placed between edge connector and SerDes PHY, minimizing stub inductance.

Use Value: 0.17 pF CIN avoids measurable insertion loss at 4 GHz; 25 W PPP rating supports multi-event robustness in field-deployed systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SMA6J3.3A-QUnidirectional, 3.3 V VBR, 600 W PPP, 120 pF CINRequires external bias network for AC-coupled lines; unsuitable for USB3.1/Thunderbolt 3 due to excessive capacitanceSelect only for DC-coupled, lower-speed interfaces (≤100 Mbps) where size and capacitance are secondary
SP1003-01UTGBidirectional, 3.3 V VRWM, 0.3 pF CIN, 3 A IPP, SOD-923 packageLarger 0.3 pF capacitance increases insertion loss above 5 GHz; 0.8 mm × 0.6 mm footprint occupies 2.7× more board areaAcceptable for USB2.0 or DisplayPort 1.2, but not for 10 Gbps+ protocols requiring sub-0.2 pF performance

Compared with SMA6J3.3A-Q and SP1003-01UTG, DESD3V3Z1BCSF-7 uniquely delivers bidirectional operation, 0.17 pF capacitance, and X2-DSN0603-2 footprint-enabling direct integration into next-generation 10+ Gbps serial interfaces without signal integrity compromise.

Availability

DESD3V3Z1BCSF-7 is available at Aetrix Electronics and suitable for USB3.1 interface protection, Thunderbolt 3 channel hardening, and high-speed HDMI 2.0a port safeguarding requiring stable component supply and consistent parametric performance across production lots.

Supply support for DESD3V3Z1BCSF-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance protection, signal integrity, and power management solutions for consumer, computing, and industrial markets.

This device belongs to Diodes' DESD series of ultra-low-capacitance TVS diodes, engineered specifically for ESD hardening of >5 Gbps serial data interfaces while maintaining PCB space and signal fidelity constraints.

FAQ

What is the maximum clamping voltage at 8 A peak pulse current?

The clamping voltage is 6.0 V at 8 A using TLP testing with 100 ns pulse width. This value reflects real-world transient suppression behavior under higher-energy surges, such as those defined in IEC 61000-4-5 (lightning), and ensures protected ICs remain within absolute maximum ratings during multi-strike events.

Can DESD3V3Z1BCSF-7 be used for unidirectional signal lines?

Yes-it functions bidirectionally but may be applied on unidirectional lines (e.g., single-ended GPIO). Its symmetric breakdown (VBR = 5–9 V at 1 mA) provides equal protection for positive and negative transients, eliminating need for polarity-aware layout. No external biasing is required, simplifying design versus unidirectional TVS devices.

Is the X2-DSN0603-2 package compatible with standard reflow profiles?

Yes-the NiAu bump terminations meet MIL-STD-202 Method 208 solderability requirements and are qualified for lead-free reflow per J-STD-020 Level 1. Recommended peak temperature is 260 °C for ≤60 seconds; side-wall contact with solder paste must be avoided per Diodes' assembly guidance to prevent short circuits.

How does the 0.4 Ω dynamic resistance impact ESD response time?

The 0.4 Ω RDYN enables sub-nanosecond turn-on latency by minimizing resistive delay in the avalanche path. Combined with low junction capacitance, this allows full clamping within 100 ps of ESD onset-critical for protecting modern transceivers with I/O structures vulnerable to <500 ps rise-time events per IEC 61000-4-2.

DESD3V3Z1BCSF-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Package/Case:
0201 (0603 Metric)
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
5V
Voltage - Clamping (Max) @ Ipp:
11.5V (Typ)
Current - Peak Pulse (10/1000µs):
3A (8/20µs)
Power - Peak Pulse:
25W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
0.17pF @ 1MHz
Operating Temperature:
-65°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DSN0603-2

DESD3V3Z1BCSF-7 FAQ

1.How can I place an order for DESD3V3Z1BCSF-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DESD3V3Z1BCSF-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DESD3V3Z1BCSF-7 reliable?

The price and inventory of DESD3V3Z1BCSF-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DESD3V3Z1BCSF-7 is usually 5 days.

3.What payment methods are accepted for DESD3V3Z1BCSF-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DESD3V3Z1BCSF-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DESD3V3Z1BCSF-7?

DESD3V3Z1BCSF-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DESD3V3Z1BCSF-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DESD3V3Z1BCSF-7?

For technical support, including DESD3V3Z1BCSF-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DESD3V3Z1BCSF-7 requirements.

6.How does Aetrix verify that DESD3V3Z1BCSF-7 is sourced from the original manufacturer or authorized distributors?

All DESD3V3Z1BCSF-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DESD3V3Z1BCSF-7 meets industry standards.

7.What is the process for return or replacement of DESD3V3Z1BCSF-7?

All DESD3V3Z1BCSF-7 units undergo pre-shipment inspection (PSI). If there is an issue with DESD3V3Z1BCSF-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DESD3V3Z1BCSF-7 part is unused and in its original packaging.

Return procedure for DESD3V3Z1BCSF-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DESD3V3Z1BCSF-7 Tags

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