Toshiba Semiconductor and Storage DF2B18FU,H3XHF
- Part No.:
- DF2B18FU,H3XHF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
DF2B18FU,H3XHF.pdf
- Description:
- AUTO AEC-Q BIDIRECTIONAL ESD PRO
- Quantity:
- Payment:

- Shipping:

Inventory:8,863
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF2B18FU,H3XHF from Toshiba Electronic Devices & Storage Corporation is an AEC-Q101-qualified bidirectional ESD protection diode in USC package, rated for ±30 kV IEC61000-4-2 contact discharge, 12 V working peak reverse voltage, and 2.5 A peak pulse current. It clamps transients to ≤33 V at 2.5 A and delivers 80 W peak pulse power for high-reliability automotive interface protection.
For engineers reviewing the DF2B18FU,H3XHF datasheet, DF2B18FU,H3XHF pinout, DF2B18FU,H3XHF application, or DF2B18FU,H3XHF equivalent, key selection criteria include IEC/ISO ESD rating compliance, low dynamic resistance (≤10 Ω), sub-10 pF capacitance, AEC-Q101 qualification status, and USC footprint compatibility with high-density PCB layouts.
Technical Context
This device implements a silicon epitaxial planar dual-diode structure configured in a common-cathode arrangement for bidirectional transient suppression. Its low 0.8 V dynamic resistance ensures minimal voltage overshoot during fast ESD events, while the 9 pF typical total capacitance preserves signal integrity on high-speed lines such as USB 2.0 or HDMI interfaces.
The DF2B18FU,H3XHF operates within a junction temperature range of −55 °C to +150 °C and is characterized per IEC61000-4-2 (contact/air), ISO10605 (contact/air), and IEC61000-4-5 (8/20 µs) standards. Its clamp voltage is guaranteed ≤33 V at 2.5 A IPP, supporting robust protection without compromising downstream IC tolerance margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC61000-4-2 Contact) | ±30 kV - meets highest industrial and automotive ESD immunity requirements |
| Working Peak Reverse Voltage | 12 V - supports 3.3 V and 5 V data line protection without leakage issues |
| Clamp Voltage @ 2.5 A | ≤33 V - limits transient voltage to safe levels for protected ICs |
| Dynamic Resistance | ≤10 Ω - minimizes voltage overshoot during nanosecond-scale ESD pulses |
| Total Capacitance @ 0 V | 9 pF typ. - enables use on USB 2.0, HDMI, and other <480 Mbps interfaces |
| Peak Pulse Power | 80 W - sustains multiple high-energy transients per IEC61000-4-5 |
| Junction Temperature Range | −55 °C to +150 °C - qualified for under-hood automotive environments |
Pinout & Package
DF2B18FU,H3XHF uses the ultra-small USC (Ultra Small Chip) surface-mount package (1.0 × 0.6 × 0.35 mm, 4.5 mg), optimized for space-constrained automotive and portable electronics. Pin 1 and Pin 2 are symmetrical anode terminals in a common-cathode configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode 1 | Input terminal for bidirectional ESD path toward shared cathode |
| Pin 2 | Anode 2 | Second input terminal enabling symmetrical clamping on differential or single-ended lines |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 Qualified | Validated for automotive applications including infotainment and body control modules |
| Bidirectional Clamping | Common-cathode dual-diode architecture protects against both positive and negative transients |
| Low Dynamic Resistance | ≤10 Ω ensures rapid response and minimal overshoot during 1 ns rise-time ESD events |
| Ultra-Low Capacitance | 9 pF typical preserves signal edge integrity on high-speed digital interfaces |
| USC Package Footprint | 1.0 × 0.6 mm land pattern supports miniaturized PCB designs without sacrificing thermal performance |
Applications
| USB 2.0 Interface Protection | Automotive Infotainment Display Port |
|---|---|
Use Scenario: Protecting D+ and D− lines of USB 2.0 ports in vehicle-mounted head units against ESD from user interaction. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point. Use Value: 9 pF capacitance avoids signal degradation; ±30 kV IEC61000-4-2 rating exceeds automotive OEM requirements. | Use Scenario: Safeguarding LVDS or FPD-Link II video data lanes between MCU and TFT display in automotive dashboards. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on high-speed differential pairs operating up to 480 Mbps. Use Value: ≤10 Ω dynamic resistance prevents timing skew; AEC-Q101 qualification ensures reliability across temperature cycling. |
| Industrial HMI Touch Panel | Medical Handheld Device Keypad |
Use Scenario: Shielding capacitive touch controller I/O pins from ESD during field operation in factory environments. IC Role / Device Role / Timing Role: Point-of-entry protection on microcontroller GPIO lines connected to overlay sensors. Use Value: 12 V VRWM matches 3.3 V/5 V logic rails; 80 W peak power handles repeated surge exposure. | Use Scenario: Securing membrane keypad scan lines in battery-powered diagnostic tools subject to frequent handling. IC Role / Device Role / Timing Role: Low-leakage (<0.1 µA) ESD diode preserving battery life while meeting IEC 61000-4-2 Level 4. Use Value: −55 °C to +150 °C operation supports sterilization cycles and extended shelf life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4105MR6T1G | Quad-channel SOT-563; 12 V VRWM; 30 kV IEC61000-4-2; 12 pF typical capacitance | Higher channel count but larger footprint; not AEC-Q101 qualified | Preferred for multi-line protection where space permits and automotive qualification is not required |
| Vishay ESDBL5V0D1W | Single-channel SOD-323; 5 V VRWM; 30 kV IEC61000-4-2; 15 pF typical capacitance | Lower working voltage and higher capacitance; AEC-Q101 qualified | Suitable for 3.3 V-only lines where tighter voltage margin is acceptable |
Compared with NUP4105MR6T1G and ESDBL5V0D1W, DF2B18FU,H3XHF offers the smallest footprint (USC), lowest capacitance (9 pF), and AEC-Q101 qualification in a dual-anode configuration-making it optimal for space-limited, high-speed, automotive-grade ESD protection.
Availability
DF2B18FU,H3XHF is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial HMIs, and medical handheld devices requiring stable component supply and long-term lifecycle support.
Supply support for DF2B18FU,H3XHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on automotive, industrial, and consumer reliability.
The DF2B18FU series belongs to Toshiba's AEC-Q101-qualified ESD protection portfolio, engineered specifically for high-density, high-speed interface protection in harsh automotive and industrial environments.
FAQ
What is the ESD rating of DF2B18FU,H3XHF per IEC61000-4-2?
The DF2B18FU,H3XHF is rated for ±30 kV contact discharge and ±30 kV air discharge per IEC61000-4-2. This rating is verified per the manufacturer's qualification test report and applies to the DF2B18FU,H3XHF as shipped in its USC package with standard board layout conditions.
Is DF2B18FU,H3XHF qualified for automotive applications?
Yes, DF2B18FU,H3XHF is AEC-Q101 qualified, confirming its suitability for automotive applications including infotainment, body electronics, and ADAS subsystems. The qualification covers temperature cycling, humidity testing, and ESD robustness per the AEC-Q101 stress test standard.
What is the maximum clamp voltage of DF2B18FU,H3XHF at 2.5 A peak pulse current?
The DF2B18FU,H3XHF has a maximum clamp voltage of 33 V at 2.5 A peak pulse current (IPP), measured per IEC61000-4-5 8/20 µs waveform. This value ensures compatibility with 3.3 V and 5 V interface ICs having ≥36 V absolute maximum ratings.
Does DF2B18FU,H3XHF have low capacitance suitable for high-speed data lines?
Yes, DF2B18FU,H3XHF exhibits 9 pF typical total capacitance at 0 V bias and 1 MHz, making it suitable for USB 2.0, HDMI, and other high-speed digital interfaces up to 480 Mbps. Its low capacitance minimizes signal distortion and insertion loss.
What package type does DF2B18FU,H3XHF use and what are its dimensions?
DF2B18FU,H3XHF uses the USC (Ultra Small Chip) package measuring 1.0 mm × 0.6 mm × 0.35 mm with a typical weight of 4.5 mg. The package features two coplanar terminals (Pin 1 and Pin 2) in a common-cathode configuration, compatible with standard reflow soldering processes.
DF2B18FU,H3XHF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-76, SOD-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 12V (Max)
- Voltage - Breakdown (Min):
- 16.2V
- Voltage - Clamping (Max) @ Ipp:
- 33V
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 80W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 9pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- USC
DF2B18FU,H3XHF FAQ
1.How can I place an order for DF2B18FU,H3XHF through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B18FU,H3XHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B18FU,H3XHF reliable?
The price and inventory of DF2B18FU,H3XHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B18FU,H3XHF is usually 5 days.
3.What payment methods are accepted for DF2B18FU,H3XHF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B18FU,H3XHF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B18FU,H3XHF?
DF2B18FU,H3XHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B18FU,H3XHF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B18FU,H3XHF?
For technical support, including DF2B18FU,H3XHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B18FU,H3XHF requirements.
6.How does Aetrix verify that DF2B18FU,H3XHF is sourced from the original manufacturer or authorized distributors?
All DF2B18FU,H3XHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B18FU,H3XHF meets industry standards.
7.What is the process for return or replacement of DF2B18FU,H3XHF?
All DF2B18FU,H3XHF units undergo pre-shipment inspection (PSI). If there is an issue with DF2B18FU,H3XHF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B18FU,H3XHF part is unused and in its original packaging.
Return procedure for DF2B18FU,H3XHF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2B18FU,H3XHF Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

