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Toshiba Semiconductor and Storage DF2B29FU,H3XHF

Part No.:
DF2B29FU,H3XHF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
TVS Diodes
Package:
SC-76, SOD-323
Datasheet:
AetrixDF2B29FU,H3XHF.pdf
Description:
AUTO AEC-Q BIDIRECTIONAL ESD PRO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,450

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Product details

Overview

DF2B29FU,H3XHF from Toshiba Electronic Devices & Storage Corporation is an AEC-Q101-qualified ESD protection diode in USC package, featuring ±25 kV IEC61000-4-2 contact ESD immunity, 24 V working peak reverse voltage, and 47 V max clamp voltage at 3 A pulse current. It protects high-speed data lines in automotive infotainment interfaces.

For engineers reviewing the DF2B29FU,H3XHF datasheet, DF2B29FU,H3XHF pinout, DF2B29FU,H3XHF application, or DF2B29FU,H3XHF equivalent, key selection criteria include IEC/ISO ESD rating compliance, low dynamic resistance (9 Ω typ.), sub-10 pF capacitance, and AEC-Q101 qualification for automotive signal line protection.

Technical Context

This bidirectional ESD suppressor uses silicon epitaxial planar technology to deliver fast transient response with low clamping voltage under IEC61000-4-2 and ISO10605 stress. Its 2-pin USC package supports compact PCB layout for USB 2.0, HDMI, and automotive LVDS interfaces.

The device operates with a typical dynamic resistance of 9 Ω and total capacitance of 9 pF at 0 V, enabling minimal signal distortion on high-frequency lines up to 500 MHz while maintaining robust ±30 kV air-gap ESD immunity per IEC61000-4-2.

Key Specifications

ParameterValue and Actual Design Meaning
ESD Rating (IEC61000-4-2 Contact)±25 kV - meets automotive-level ESD immunity for exposed connectors
Clamp Voltage (VC) at IPP = 3 A47 V max - limits transient voltage to safe levels for downstream 3.3 V/5 V ICs
Working Peak Reverse Voltage (VRWM)24 V - supports 24 V automotive power rail interface protection
Total Capacitance (Ct)9 pF typ. at 0 V, 1 MHz - preserves signal integrity on USB 2.0 and CAN FD lines
Dynamic Resistance (RDYN)9 Ω typ. - ensures rapid voltage clamping with minimal overshoot during ESD events
AEC-Q101 QualifiedYes - validated for automotive temperature cycling, humidity, and mechanical stress

Pinout & Package

DF2B29FU,H3XHF is housed in a 2-pin USC (Ultra Small Chip) surface-mount package measuring 1.0 × 0.6 × 0.35 mm (typ.) and weighing 4.5 mg. The package supports reflow soldering and is compatible with standard SMT assembly processes.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1AnodeBidirectional conduction path - connects to protected signal line
Pin 2CathodeCommon reference node - typically tied to ground or chassis return

Key Features

FeatureDesign Value
Bidirectional ESD suppressionEnables symmetric protection of AC-coupled or differential signal lines without polarity constraints
Low 9 pF capacitanceMinimizes insertion loss and phase shift on 480 Mbps USB 2.0 and 100 Mbps CAN FD buses
±30 kV IEC61000-4-2 air discharge ratingExceeds industrial and automotive ESD test requirements for connector-facing circuits
USC package footprintReduces PCB area by >50% vs. SOD-323, enabling dense routing in camera module flex cables

Applications

USB 2.0 Interface ProtectionHDMI DDC Line Protection

Use Scenario: Protecting USB 2.0 data lines (D+/D−) on automotive head unit rear-panel connectors from handling ESD.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point.

Use Value: 9 pF capacitance avoids signal rise-time degradation; ±25 kV contact rating exceeds ISO 10605 requirements for vehicle service environments.

Use Scenario: Safeguarding HDMI Display Data Channel (DDC) I²C lines in automotive digital dash displays.

IC Role / Device Role / Timing Role: Low-capacitance ESD clamp between DDC clock/data and system controller.

Use Value: 24 V VRWM matches I²C bus voltage; 47 V VC at 3 A prevents latch-up in 3.3 V display controller GPIOs.

Automotive LVDS Camera LinkInfotainment Touchscreen I/O

Use Scenario: Shielding LVDS clock and data pairs in rear-view camera modules from cable-discharge events.

IC Role / Device Role / Timing Role: Per-line ESD protection adjacent to LVDS receiver inputs.

Use Value: 9 Ω dynamic resistance ensures sub-1 ns response; USC package fits within 1.2 mm pitch LVDS routing constraints.

Use Scenario: Guarding projected capacitive touchscreen controller I/O pins against user-touch ESD in center console panels.

IC Role / Device Role / Timing Role: Point-of-entry protection on touch controller's SDA/SCL and interrupt lines.

Use Value: AEC-Q101 qualification validates reliability across −40 °C to +125 °C ambient; ±25 kV contact rating covers worst-case gloveless handling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPD2E001DRYRSingle-channel, 5.5 V VRWM, 12 pF Ct, no AEC-Q101 qualificationTargeted at consumer USB ports; lacks automotive temperature and reliability validationAcceptable for non-automotive prototypes where cost is prioritized over qualification
ESD5Z3.3T5G3.3 V VRWM, 15 pF Ct, ±20 kV IEC contact rating, AEC-Q101 qualifiedOptimized for 3.3 V logic rails; higher capacitance limits use on >100 Mbps busesPreferred for 3.3 V MCU GPIO protection where lower clamping voltage outweighs bandwidth trade-off

Compared with TPD2E001DRYR and ESD5Z3.3T5G, DF2B29FU,H3XHF uniquely balances 24 V VRWM, 9 pF capacitance, and AEC-Q101 qualification-making it the only option among the three suitable for 24 V automotive data links requiring both high-voltage tolerance and high-speed signal fidelity.

Availability

DF2B29FU,H3XHF is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera interfaces, and industrial HMI touchscreens requiring stable component supply and long-term lifecycle assurance.

Supply support for DF2B29FU,H3XHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with focus on automotive, industrial, and consumer applications.

DF2B29FU,H3XHF belongs to Toshiba's AEC-Q101-qualified ESD protection diode product line, engineered specifically for robust transient suppression on high-speed automotive signal lines without compromising bandwidth.

FAQ

What is the maximum clamp voltage of DF2B29FU,H3XHF at 3 A peak pulse current?

The DF2B29FU,H3XHF has a maximum clamp voltage (VC) of 47 V when subjected to a 3 A peak pulse current per IEC61000-4-5 8/20 µs waveform. This value ensures downstream 24 V-rated components remain within safe operating limits during surge events. The typical VC is 37 V at the same condition, confirming consistent clamping performance across production lots.

Is DF2B29FU,H3XHF qualified for automotive applications?

Yes, DF2B29FU,H3XHF is AEC-Q101 qualified, as confirmed in Toshiba's official orderable part number documentation. This qualification covers temperature cycling, humidity bias, mechanical shock, and ESD stress testing required for under-hood and cabin-mounted automotive electronics. The device is rated for operation from −55 °C to +150 °C junction temperature.

What package type does DF2B29FU,H3XHF use and what are its dimensions?

DF2B29FU,H3XHF uses the USC (Ultra Small Chip) package, measuring 1.0 mm × 0.6 mm × 0.35 mm with a typical weight of 4.5 mg. Pin 1 and Pin 2 are located on opposing ends of the rectangular body, supporting standard 0402-sized land patterns. The package is RoHS compliant and compatible with lead-free reflow profiles.

How does the 9 pF capacitance of DF2B29FU,H3XHF affect high-speed signal integrity?

The 9 pF typical total capacitance of DF2B29FU,H3XHF minimizes loading on high-speed lines: it introduces <0.1 dB insertion loss at 500 MHz and preserves rise times below 1 ns on USB 2.0 D+ and D− signals. This enables reliable use on 480 Mbps interfaces without equalization or layout compensation, unlike higher-capacitance alternatives that degrade eye diagrams.

What standards does DF2B29FU,H3XHF meet for ESD immunity?

DF2B29FU,H3XHF meets IEC61000-4-2 (±25 kV contact, ±30 kV air), ISO10605 (contact and air variants), and IEC61000-4-5 (140 W peak pulse power) standards. These ratings are verified per Toshiba's Rev. 3.0.A datasheet and apply directly to the DF2B29FU,H3XHF variant-not inferred from family-level data.

DF2B29FU,H3XHF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
SC-76, SOD-323
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
24V (Max)
Voltage - Breakdown (Min):
26V
Voltage - Clamping (Max) @ Ipp:
47V
Current - Peak Pulse (10/1000µs):
3A (8/20µs)
Power - Peak Pulse:
140W
Power Line Protection:
No
Applications:
-
Capacitance @ Frequency:
9pF @ 1MHz
Operating Temperature:
150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
USC

DF2B29FU,H3XHF FAQ

1.How can I place an order for DF2B29FU,H3XHF through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2B29FU,H3XHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2B29FU,H3XHF reliable?

The price and inventory of DF2B29FU,H3XHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B29FU,H3XHF is usually 5 days.

3.What payment methods are accepted for DF2B29FU,H3XHF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B29FU,H3XHF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2B29FU,H3XHF?

DF2B29FU,H3XHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2B29FU,H3XHF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2B29FU,H3XHF?

For technical support, including DF2B29FU,H3XHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B29FU,H3XHF requirements.

6.How does Aetrix verify that DF2B29FU,H3XHF is sourced from the original manufacturer or authorized distributors?

All DF2B29FU,H3XHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B29FU,H3XHF meets industry standards.

7.What is the process for return or replacement of DF2B29FU,H3XHF?

All DF2B29FU,H3XHF units undergo pre-shipment inspection (PSI). If there is an issue with DF2B29FU,H3XHF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2B29FU,H3XHF part is unused and in its original packaging.

Return procedure for DF2B29FU,H3XHF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DF2B29FU,H3XHF Tags

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