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Toshiba Semiconductor and Storage DF2B5M4ASL,L3F

Part No.:
DF2B5M4ASL,L3F
Manufacturer:
Toshiba Semiconductor and Storage
Category:
TVS Diodes
Package:
2-SMD, No Lead
Datasheet:
AetrixDF2B5M4ASL,L3F.pdf
Description:
TVS DIODE 3.6VWM 15VC SL2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,278

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Product details

Overview

DF2B5M4ASL,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for high-speed signal lines in mobile interfaces, featuring 3.3 V working voltage (VRWM ≤ 3.6 V), ±16 kV IEC61000-4-2 contact ESD immunity, 0.15 pF typical capacitance, 0.7 Ω dynamic resistance, and ultra-compact SL2 package (0.62 mm × 0.32 mm).

For engineers reviewing the DF2B5M4ASL,L3F datasheet, DF2B5M4ASL,L3F pinout, DF2B5M4ASL,L3F application, or DF2B5M4ASL,L3F equivalent, key selection considerations include low-capacitance signal integrity preservation, snapback-based clamping performance under 2 A peak pulse current, and compatibility with space-constrained PCB layouts in smartphones and tablets.

Technical Context

The DF2B5M4ASL,L3F employs silicon epitaxial planar technology with snapback-triggered TVS behavior, enabling low clamping voltage (VC = 10 V @ IPP = 2 A) and fast response to ESD transients. Its bidirectional configuration supports I/O line protection without polarity constraints.

Designed specifically for 3.3 V systems, it operates within a 0–25 °C ambient range and delivers stable protection across IEC61000-4-2 (±16 kV contact/air) and IEC61000-4-5 (8/20 µs surge) standards, with junction temperature limited to 150 °C.

Key Specifications

Parameter Value and Actual Design Meaning
Working Peak Reverse Voltage 3.6 V max - ensures safe operation on 3.3 V signal rails with margin against overvoltage drift.
Total Capacitance 0.15 pF typ. - preserves signal integrity up to multi-GHz frequencies in USB 2.0, HDMI, and MIPI interfaces.
Dynamic Resistance 0.7 Ω typ. - minimizes voltage overshoot during ESD events by limiting IR drop across the protection path.
Clamp Voltage 10 V @ 2 A peak pulse - holds protected IC input below damage threshold during IEC61000-4-2 discharge.
ESD Withstand ±16 kV (IEC61000-4-2 contact) - exceeds industrial and consumer ESD immunity requirements.
Package Size 0.62 mm × 0.32 mm - enables placement adjacent to connectors and high-density BGA footprints.

Pinout & Package

The DF2B5M4ASL,L3F is housed in the SL2 ultra-compact surface-mount package (0.62 mm × 0.32 mm, 0.2 mg typical weight), optimized for mobile PCB real estate constraints.

Pin/Terminal Circuit Role Design Meaning
Pin 1 I/O Signal Terminal Connected to protected data line (e.g., USB D+, HDMI TMDS+); requires Pin 2 tied to GND when used as input/output node.
Pin 2 Ground Reference Mandatory GND connection for snapback conduction path; must be low-inductance to ensure effective clamping.

Key Features

Feature Design Value
Snapback-triggered clamping Enables sub-10 V clamping at 2 A pulse while maintaining low leakage (<0.1 µA @ 3.6 V) in standby.
Bidirectional ESD protection Supports AC-coupled and bidirectional signal lines (e.g., USB, MIPI D-PHY) without polarity dependency.
Ultra-low capacitance 0.15 pF typical value prevents signal rise-time degradation and insertion loss in >500 MHz channels.
SL2 footprint compatibility Matches standard 0201 land pattern dimensions, enabling drop-in replacement in existing high-density layouts.

Applications

Smartphone Front-Panel Interfaces Tablet USB-C Port Protection

Use Scenario: Protecting touch controller I²C lines and display serial interface (DSI) from user-hand ESD during screen interaction.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point before signal conditioning ICs.

Use Value: Prevents latch-up or gate oxide damage in 28 nm/16 nm application processors by clamping transients to <10 V within nanoseconds.

Use Scenario: Safeguarding USB-C CC and SBU pins against repeated plug/unplug ESD events in portable tablet designs.

IC Role / Device Role / Timing Role: Low-capacitance ESD clamp integrated into USB-C receptacle layout, co-located with common-mode chokes.

Use Value: Maintains USB 2.0 signal integrity (≤0.2 dB insertion loss @ 480 MHz) while meeting ±16 kV IEC61000-4-2 compliance.

Notebook PC Audio Jack ESD Guard Industrial Handheld Scanner Data Lines

Use Scenario: Shielding 3.5 mm audio jack MIC and HP lines from electrostatic discharge during cable insertion/removal.

IC Role / Device Role / Timing Role: Dual-line ESD protector mounted adjacent to jack PCB footprint, referenced to system ground plane.

Use Value: Eliminates audible pop/click artifacts and ADC saturation caused by ESD-induced bias shift in audio codec inputs.

Use Scenario: Protecting RS-485 and GPIO lines in ruggedized barcode scanners exposed to dry-environment static buildup.

IC Role / Device Role / Timing Role: Point-of-entry ESD guard on scanner mainboard, placed before level translators and microcontroller I/O buffers.

Use Value: Ensures field reliability across 100,000+ connect/disconnect cycles without parametric drift or failure in -25 °C to 70 °C operating range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD2E001DRYR Unidirectional, 5.5 V VRWM, 1.2 pF capacitance, ±8 kV IEC61000-4-2 contact rating. Requires separate GND and VCC references; unsuitable for true bidirectional AC signals like USB D+/D−. Select when protecting 5 V logic rails where higher clamping voltage is acceptable and capacitance tolerance >1 pF.
ESD5Z3.3T5G Bidirectional, 3.3 V VRWM, 0.6 pF capacitance, ±12 kV IEC61000-4-2 contact rating, SOD-523 package (1.3 mm × 0.85 mm). Larger footprint increases trace inductance; lower ESD rating limits use in premium consumer devices. Prefer for cost-sensitive industrial designs where board space is less constrained and ±12 kV suffices.

Compared with TPD2E001DRYR and ESD5Z3.3T5G, the DF2B5M4ASL,L3F uniquely combines bidirectional operation, ±16 kV robustness, and 0.15 pF capacitance in a 0.62 mm × 0.32 mm footprint-enabling first-tier smartphone-grade ESD protection without signal integrity trade-offs.

Availability

DF2B5M4ASL,L3F is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, tablet USB-C port protection, and notebook PC audio jack ESD guard requiring stable component supply and consistent SL2 package delivery.

Supply support for DF2B5M4ASL,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for mobile, industrial, and computing applications, with expertise in ESD protection, power management, and discrete devices.

The DF2B5M4ASL,L3F belongs to Toshiba's SL2-series ultra-low-capacitance TVS diodes, engineered specifically for high-speed data line protection in space-constrained portable electronics.

FAQ

What is the maximum working voltage supported by the DF2B5M4ASL,L3F?

The DF2B5M4ASL,L3F has a working peak reverse voltage (VRWM) of 3.6 V maximum, making it suitable for 3.3 V nominal signal lines with sufficient margin against voltage fluctuations. This rating is verified per IEC61000-4-2 test conditions and ensures reliable operation without premature conduction during normal signal swings. The DF2B5M4ASL,L3F maintains low leakage (<0.1 µA) up to this voltage threshold.

Does the DF2B5M4ASL,L3F support bidirectional ESD protection?

Yes, the DF2B5M4ASL,L3F provides symmetrical bidirectional clamping, enabling protection of AC-coupled or differential signal pairs such as USB D+/D− and MIPI D-PHY lanes. Its internal structure allows equal response to positive and negative ESD transients without polarity dependency. This behavior is confirmed in the device's I–V curve (Fig. 9.1) and clamping waveform data (Fig. 6.1.1/6.1.2) in the official DF2B5M4ASL,L3F datasheet.

What is the typical capacitance of the DF2B5M4ASL,L3F and why does it matter?

The DF2B5M4ASL,L3F exhibits 0.15 pF typical total capacitance at 0 V and 1 MHz, critical for preserving signal integrity in high-speed interfaces like USB 2.0 and MIPI. This ultra-low value minimizes insertion loss, group delay variation, and rise-time degradation-ensuring compliance with eye diagram masks and jitter budgets. The DF2B5M4ASL,L3F achieves this via optimized silicon geometry and SL2 package parasitics.

How is the DF2B5M4ASL,L3F mounted and what is its package name?

The DF2B5M4ASL,L3F uses the SL2 surface-mount package (0.62 mm × 0.32 mm), also known as "SL2" in Toshiba documentation. It is a two-terminal device with Pin 1 for signal connection and Pin 2 for ground reference. Land pattern dimensions are specified in the datasheet (Rev. 1.0.A, page 8), and the device weighs 0.2 mg typical. The DF2B5M4ASL,L3F requires reflow soldering per J-STD-020 moisture sensitivity level (MSL) guidelines.

What ESD standards does the DF2B5M4ASL,L3F meet?

The DF2B5M4ASL,L3F meets IEC61000-4-2 Level 4 for both contact (±16 kV) and air (±16 kV) discharge, and supports IEC61000-4-5 surge immunity with 2 A peak pulse current (8/20 µs). These ratings are measured using standardized TLP and ESD gun methodologies and are guaranteed per Toshiba's production test flow. The DF2B5M4ASL,L3F is not rated for voltage regulation or continuous overvoltage protection.

DF2B5M4ASL,L3F Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
2-SMD, No Lead
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
3.6V (Max)
Voltage - Breakdown (Min):
4V
Voltage - Clamping (Max) @ Ipp:
15V
Current - Peak Pulse (10/1000µs):
2A (8/20µs)
Power - Peak Pulse:
30W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
0.15pF @ 1MHz
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SL2

DF2B5M4ASL,L3F FAQ

1.How can I place an order for DF2B5M4ASL,L3F through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2B5M4ASL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2B5M4ASL,L3F reliable?

The price and inventory of DF2B5M4ASL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B5M4ASL,L3F is usually 5 days.

3.What payment methods are accepted for DF2B5M4ASL,L3F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B5M4ASL,L3F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2B5M4ASL,L3F?

DF2B5M4ASL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2B5M4ASL,L3F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2B5M4ASL,L3F?

For technical support, including DF2B5M4ASL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B5M4ASL,L3F requirements.

6.How does Aetrix verify that DF2B5M4ASL,L3F is sourced from the original manufacturer or authorized distributors?

All DF2B5M4ASL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B5M4ASL,L3F meets industry standards.

7.What is the process for return or replacement of DF2B5M4ASL,L3F?

All DF2B5M4ASL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B5M4ASL,L3F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2B5M4ASL,L3F part is unused and in its original packaging.

Return procedure for DF2B5M4ASL,L3F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DF2B5M4ASL,L3F Tags

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