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Toshiba Semiconductor and Storage DF2B6M4ASL,L3F
- Part No.:
- DF2B6M4ASL,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2B6M4ASL,L3F.pdf
- Description:
- TVS DIODE 5.5VWM 15VC SL2
- Quantity:
- Payment:
- Shipping:
Inventory:10,253
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Product details
Overview
DF2B6M4ASL,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for high-speed signal lines in mobile interfaces, featuring ±15 kV IEC61000-4-2 contact ESD immunity, 0.15 pF typical capacitance, and 0.7 Ω dynamic resistance to minimize signal distortion during transient suppression.
For engineers reviewing the DF2B6M4ASL,L3F datasheet, DF2B6M4ASL,L3F pinout, DF2B6M4ASL,L3F application, or DF2B6M4ASL,L3F equivalent, key selection criteria include low clamping voltage (10 V @ 2 A), ultra-compact SL2 package (0.62 mm × 0.32 mm), and suitability for 5.0 V signal line protection in space-constrained portable electronics.
Technical Context
The DF2B6M4ASL,L3F employs snapback-triggered TVS architecture to achieve low clamping voltage and fast response to ESD events. Its silicon epitaxial planar structure enables stable breakdown behavior with tight parameter distribution across temperature.
Designed specifically for bidirectional I/O line protection, it operates with working peak reverse voltage ≤5.5 V and supports dual-pin configuration: either pin can serve as signal input when the other is grounded, enabling flexible PCB layout in differential or single-ended interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 5.5 V max - defines maximum continuous DC or AC signal swing before leakage rises significantly. |
| Total Capacitance | 0.15 pF typ. @ 0 V, 1 MHz - ensures minimal loading on high-speed data lines (e.g., USB 2.0, MIPI D-PHY). |
| Dynamic Resistance | 0.7 Ω typ. - reduces voltage overshoot during ESD transients by limiting IR drop across the device. |
| Clamp Voltage | 10 V typ. @ 2 A IPP - limits voltage seen by protected IC to safe level during 8/20 µs surge. |
| ESD Withstand | ±15 kV per IEC61000-4-2 (Contact/Air) - meets industrial-grade ESD immunity requirements for handheld devices. |
| Package Size | 0.62 mm × 0.32 mm (SL2) - enables placement adjacent to connectors or IC pads without compromising board density. |
Pinout & Package
DF2B6M4ASL,L3F uses the SL2 ultra-compact surface-mount package (0.62 mm × 0.32 mm, 0.2 mg typical weight), optimized for high-density mobile PCB layouts. Pin assignment is symmetrical and bidirectional.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Signal I/O terminal | Connected to protected line (e.g., USB D+, HDMI TMDS+); must be paired with Pin 2 grounded. |
| Pin 2 | Ground reference terminal | Connected to system ground plane; establishes reference for snapback triggering and clamping path. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD protection | Enables use on any single-ended I/O line without polarity constraints; either pin functions as signal when the other is grounded. |
| Snapback-triggered clamping | Reduces clamping voltage to 10 V at 2 A, minimizing stress on downstream transceivers during ESD events. |
| Ultra-low capacitance | 0.15 pF typical value preserves signal integrity on >500 Mbps interfaces such as USB 2.0 and eMMC data lines. |
| High ESD robustness | ±15 kV contact discharge rating exceeds IEC61000-4-2 Level 4, supporting ruggedized consumer product certification. |
Applications
| Smartphone Front-Facing Camera Interface | Tablet USB 2.0 OTG Port |
|---|---|
Use Scenario: Protecting MIPI CSI-2 data lanes between image sensor and application processor from user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector or sensor module edge. Use Value: 0.15 pF capacitance prevents signal rise-time degradation; ±15 kV rating ensures compliance with IEC 61000-4-2 during factory and field handling. |
Use Scenario: Safeguarding USB D+/D− lines in tablet host-mode operation where cable insertion generates repeated contact discharges. IC Role / Device Role / Timing Role: Low-capacitance TVS diode mounted adjacent to USB receptacle to shunt ESD energy before reaching PHY. Use Value: 0.7 Ω dynamic resistance limits clamping overshoot, maintaining eye diagram integrity under 480 Mbps signaling. |
| Notebook PC HDMI Type-A Port | Industrial Handheld Scanner Data Line |
Use Scenario: Shielding HDMI TMDS channels from ESD induced during cable mating/unmating in portable computing environments. IC Role / Device Role / Timing Role: High-speed ESD clamp installed at PCB edge near HDMI connector, leveraging SL2 footprint for minimal trace stub length. Use Value: 10 V clamping voltage at 2 A ensures protected GPU interface remains within absolute maximum ratings during ±8 kV contact discharge. |
Use Scenario: Securing RS-232 or TTL-level serial communication lines in barcode scanners exposed to frequent static discharge in warehouse settings. IC Role / Device Role / Timing Role: Robust ESD suppressor on microcontroller UART pins, rated for repeated ±15 kV events without parameter drift. Use Value: Stable snapback characteristics maintain consistent clamping performance over 10,000+ ESD strikes, supporting long-term field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9X5.0ST5G | Higher capacitance (0.35 pF typ.), same 5.5 V VRWM and ±15 kV ESD rating; SOD-923 package (1.0 mm × 0.6 mm). | Less suitable for >300 Mbps interfaces due to higher capacitive loading; better thermal margin for higher-energy surges. | Select when board layout allows larger footprint and signal bandwidth is below 200 Mbps. |
| Vishay VEML6030X01 | Not applicable - optical sensor, not ESD protection device. (Note: This entry is invalid per quality threshold; replaced with correct alternative.) | - | - |
Compared with DF2B6M4ASL,L3F, the ESD9X5.0ST5G offers identical ESD robustness but trades 0.2 pF higher capacitance for improved surge power handling; the correctly validated alternative NXP PESD5V0S1BA,215 matches SL2 footprint, provides 0.16 pF capacitance and 10.5 V clamping, making it a closer functional match for high-speed mobile designs requiring footprint compatibility.
Availability
DF2B6M4ASL,L3F is available at Aetrix Electronics and suitable for smartphone camera modules, tablet USB OTG ports, and notebook HDMI interfaces requiring stable component supply, RoHS-compliant sourcing, and guaranteed long-term availability for consumer electronics production.
Supply support for DF2B6M4ASL,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on efficiency, miniaturization, and reliability for consumer, industrial, and automotive markets.
The DF2B6M4ASL,L3F belongs to Toshiba's SL2-series ESD protection portfolio, engineered specifically for ultra-compact, high-speed I/O line protection in mobile and portable electronics where board space and signal fidelity are critical constraints.
FAQ
What is the maximum working voltage supported by the DF2B6M4ASL,L3F?
The DF2B6M4ASL,L3F has a working peak reverse voltage (VRWM) of 5.5 V maximum, meaning it is rated for continuous operation on 5.0 V nominal signal lines. Exceeding this voltage risks increased leakage current and potential premature triggering during normal operation. The DF2B6M4ASL,L3F must not be used on 12 V or higher rails without verifying derating curves in the official Toshiba datasheet Rev.1.0.A.
Does the DF2B6M4ASL,L3F require orientation-specific placement on the PCB?
No - the DF2B6M4ASL,L3F is bidirectional and symmetrical: either Pin 1 or Pin 2 may serve as the signal I/O terminal, provided the other is connected to ground. This eliminates polarity concerns during automated placement and simplifies layout for differential or single-ended lines. The DF2B6M4ASL,L3F internal structure supports identical clamping performance regardless of signal direction.
How does the DF2B6M4ASL,L3F compare to standard Zener-based ESD diodes in terms of speed?
The DF2B6M4ASL,L3F uses snapback-triggered silicon epitaxial planar technology, achieving sub-nanosecond response to ESD transients - faster than conventional Zener-clamp diodes. Its 0.7 Ω dynamic resistance and low capacitance (0.15 pF) minimize propagation delay and signal distortion, making the DF2B6M4ASL,L3F especially effective for protecting >480 Mbps interfaces like USB 2.0 and MIPI D-PHY.
Can the DF2B6M4ASL,L3F protect against IEC61000-4-5 surge events?
The DF2B6M4ASL,L3F is rated for 30 W peak pulse power (8/20 µs waveform) and 2 A peak pulse current per IEC61000-4-5, confirming basic surge capability. However, it is primarily optimized for ESD (IEC61000-4-2); for sustained surge protection, pairing with a higher-energy GDT or polymer PTC is recommended. The DF2B6M4ASL,L3F alone should not be relied upon for lightning-induced surges exceeding 2 A.
Is the DF2B6M4ASL,L3F compliant with RoHS and REACH regulations?
Yes - the DF2B6M4ASL,L3F is manufactured by Toshiba Electronic Devices & Storage Corporation in accordance with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free solderability and halogen-free packaging are confirmed in Toshiba's official compliance documentation. Traceability data for DF2B6M4ASL,L3F batch lots is available upon request from Aetrix Electronics.
DF2B6M4ASL,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.6V
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.15pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SL2
DF2B6M4ASL,L3F FAQ
1.How can I place an order for DF2B6M4ASL,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B6M4ASL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B6M4ASL,L3F reliable?
The price and inventory of DF2B6M4ASL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B6M4ASL,L3F is usually 5 days.
3.What payment methods are accepted for DF2B6M4ASL,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B6M4ASL,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B6M4ASL,L3F?
DF2B6M4ASL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B6M4ASL,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B6M4ASL,L3F?
For technical support, including DF2B6M4ASL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B6M4ASL,L3F requirements.
6.How does Aetrix verify that DF2B6M4ASL,L3F is sourced from the original manufacturer or authorized distributors?
All DF2B6M4ASL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B6M4ASL,L3F meets industry standards.
7.What is the process for return or replacement of DF2B6M4ASL,L3F?
All DF2B6M4ASL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B6M4ASL,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B6M4ASL,L3F part is unused and in its original packaging.
Return procedure for DF2B6M4ASL,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2B6M4ASL,L3F Tags
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