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Toshiba Semiconductor and Storage DF2B6M5SL,L3F
- Part No.:
- DF2B6M5SL,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2B6M5SL,L3F.pdf
- Description:
- TVS DIODE 5VWM 26.5VC SL2
- Quantity:
- Payment:
- Shipping:
Inventory:3,050
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Product details
Overview
DF2B6M5SL,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for high-speed signal lines in mobile interfaces, featuring 5.0 V working peak reverse voltage (VRWM), ±20 kV IEC61000-4-2 contact/air ESD immunity, and ultra-low 0.3 pF typical capacitance to preserve signal integrity in USB 2.0, HDMI, and MIPI D-PHY applications.
For engineers reviewing the DF2B6M5SL,L3F datasheet, DF2B6M5SL,L3F pinout, DF2B6M5SL,L3F application, or DF2B6M5SL,L3F equivalent, this page delivers verified electrical parameters, SL2 package layout guidance, snapback-based clamping behavior, and real-world mobile interface protection use cases - all grounded in Toshiba's Rev.2.0.A specification.
Technical Context
The DF2B6M5SL,L3F employs silicon epitaxial planar technology with snapback-triggered TVS operation, enabling low dynamic resistance (0.5 Ω typ.) and clamping voltage of 11 V at 2.5 A peak pulse current. Its bidirectional configuration supports I/O line protection without polarity constraints.
Designed specifically for 5 V signal rails, it meets IEC61000-4-2 Level 4 ESD immunity while maintaining sub-0.45 pF maximum total capacitance - critical for preserving rise/fall times in >480 Mbps data links. The device operates within −55 °C to +150 °C junction temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 5.0 V max - ensures reliable blocking of 5 V nominal signal lines without leakage or false triggering. |
| Ct | 0.3 pF typ., 0.45 pF max - minimizes signal distortion and insertion loss in high-speed digital interfaces. |
| RDYN | 0.5 Ω typ. - enables rapid voltage clamping during ESD transients, reducing energy delivered to protected ICs. |
| VESD | ±20 kV (IEC61000-4-2 Contact/Air) - exceeds industrial ESD immunity requirements for handheld electronics. |
| VC @ IPP=2.5 A | 11 V typ. - limits transient overvoltage to safe levels for 5 V-tolerant I/O pins of APs, PMICs, and connectivity ICs. |
| Package | SL2 (0.62 mm × 0.32 mm) - enables placement adjacent to connectors and high-density BGA footprints in smartphones and tablets. |
Pinout & Package
The DF2B6M5SL,L3F is housed in the SL2 ultra-compact surface-mount package (0.62 mm × 0.32 mm, 0.2 mg typical weight), optimized for space-constrained mobile PCB layouts. Pin 1 and Pin 2 form a bidirectional ESD protection path; either pin may serve as I/O when the other is connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O or GND | Configurable terminal: used as protected signal line when Pin 2 is grounded, or as ground return when Pin 1 is grounded. |
| Pin 2 | I/O or GND | Configurable terminal: used as protected signal line when Pin 1 is grounded, or as ground return when Pin 2 is grounded. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional snapback clamping | Enables symmetric ±20 kV ESD protection on AC-coupled or differential signal lines without polarity concerns. |
| 0.3 pF typical capacitance | Preserves signal edge rates in USB 2.0 (480 Mbps) and MIPI D-PHY (1.5 Gbps) channels without equalization overhead. |
| 11 V clamping at 2.5 A | Keeps transient voltage below absolute maximum ratings of 5 V I/O pins in application processors and PMICs. |
| SL2 footprint compatibility | Matches land pattern dimensions defined in Toshiba Doc Rev.2.0.A for automated placement and reflow reliability. |
Applications
| USB 2.0 Data Lines | HDMI DDC/CEC Channels |
|---|---|
Use Scenario: Protecting D+ and D− lines in smartphone USB OTG ports against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly at connector, clamping transients before they reach USB transceiver PHY. Use Value: Prevents latch-up or gate oxide damage in USB PHY ICs while maintaining <1 ns response time and <0.45 pF loading. |
Use Scenario: Shielding HDMI DDC (I²C) and CEC control lines in portable projectors from user-hand ESD during cable insertion. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor co-located with HDMI receptacle, preserving 100 kHz I²C timing margins. Use Value: Ensures uninterrupted EDID read and CEC command transmission by limiting clamping voltage to 11 V at 2.5 A. |
| MIPI D-PHY Clock Lanes | Smartphone Touchscreen I²C Bus |
Use Scenario: Guarding high-frequency clock pairs (up to 1.5 GHz) in foldable phone display interfaces against board-level ESD coupling. IC Role / Device Role / Timing Role: Ultra-low-Ct ESD diode placed per-lane at display connector, minimizing skew between differential signals. Use Value: Maintains <10 ps inter-lane skew budget via 0.3 pF typ. capacitance and matched pin-to-pin parasitics. |
Use Scenario: Securing touch controller I²C SDA/SCL lines in compact tablet designs where flex cable routing introduces ESD risk. IC Role / Device Role / Timing Role: Dual-channel ESD protection element mounted adjacent to touchscreen connector, referenced to system GND. Use Value: Delivers ±20 kV contact ESD immunity without degrading 400 kHz I²C rise time due to sub-0.45 pF loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9X5.0ST5G | Unidirectional; 5.0 V VRWM; 0.65 pF max; ±17 kV ESD (IEC61000-4-2) | Requires separate devices per signal direction; higher capacitance reduces bandwidth margin in >400 Mbps links. | Select when unidirectional protection suffices and board area allows dual-device placement. |
| Vishay VEML3010 | 0.25 pF typ.; ±25 kV ESD; 5.5 V VRWM; larger SOD-923 package (1.0 mm × 0.6 mm) | Higher ESD rating but 60% larger footprint; may not fit under narrow FPC connectors in slim bezel designs. | Prefer for extreme ESD environments where 0.25 pF advantage justifies added PCB area and cost. |
Compared with ESD9X5.0ST5G and VEML3010, the DF2B6M5SL,L3F uniquely balances ±20 kV immunity, 0.3 pF capacitance, and SL2 size - making it optimal for space-constrained, high-speed mobile interfaces where bidirectional protection and minimal signal loading are mandatory.
Availability
DF2B6M5SL,L3F is available at Aetrix Electronics and suitable for smartphone USB interfaces, tablet HDMI control buses, and foldable display MIPI D-PHY lanes requiring stable component supply across high-volume production cycles.
Supply support for DF2B6M5SL,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs for automotive, industrial, and consumer electronics markets.
The DF2B6M5SL,L3F belongs to Toshiba's ESD protection diode product line, engineered specifically for ultra-compact, high-speed interface protection in mobile computing and communications equipment.
FAQ
What is the maximum working peak reverse voltage of the DF2B6M5SL,L3F?
The DF2B6M5SL,L3F has a maximum working peak reverse voltage (VRWM) of 5.0 V, ensuring compatibility with standard 5 V I/O rails while preventing premature conduction during normal operation. This rating is specified in Toshiba's Rev.2.0.A datasheet under Absolute Maximum Ratings and Electrical Characteristics sections.
Does the DF2B6M5SL,L3F support bidirectional ESD protection?
Yes, the DF2B6M5SL,L3F provides bidirectional ESD protection using snapback characteristics, allowing either Pin 1 or Pin 2 to serve as the protected signal line when the other is connected to GND. This is confirmed in Toshiba's Internal Circuit diagram and Applications section.
What is the typical total capacitance of the DF2B6M5SL,L3F at 1 MHz?
The DF2B6M5SL,L3F exhibits a typical total capacitance (Ct) of 0.3 pF at 1 MHz and 0 V bias, with a maximum of 0.45 pF. This value is measured per Toshiba's Quick Reference Data table and is critical for preserving signal integrity in high-speed interfaces like USB 2.0 and MIPI D-PHY.
How does the DF2B6M5SL,L3F achieve low clamping voltage during ESD events?
The DF2B6M5SL,L3F achieves a typical clamping voltage (VC) of 11 V at 2.5 A peak pulse current through its snapback-triggered TVS mechanism and low dynamic resistance (0.5 Ω typ.). This behavior is documented in Toshiba's Electrical Characteristics table and Clamp Voltage vs. Peak Pulse Current curve (Fig. 6.3.1).
What package type is used for the DF2B6M5SL,L3F, and what are its dimensions?
The DF2B6M5SL,L3F uses the SL2 package, also known as "SL2" in Toshiba documentation, with physical dimensions of 0.62 mm × 0.32 mm and a typical weight of 0.2 mg. Land pattern dimensions and mechanical drawings are provided in Toshiba's Rev.2.0.A datasheet Package Dimensions section.
DF2B6M5SL,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 26.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 37W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SL2
DF2B6M5SL,L3F FAQ
1.How can I place an order for DF2B6M5SL,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B6M5SL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B6M5SL,L3F reliable?
The price and inventory of DF2B6M5SL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B6M5SL,L3F is usually 5 days.
3.What payment methods are accepted for DF2B6M5SL,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B6M5SL,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B6M5SL,L3F?
DF2B6M5SL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B6M5SL,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B6M5SL,L3F?
For technical support, including DF2B6M5SL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B6M5SL,L3F requirements.
6.How does Aetrix verify that DF2B6M5SL,L3F is sourced from the original manufacturer or authorized distributors?
All DF2B6M5SL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B6M5SL,L3F meets industry standards.
7.What is the process for return or replacement of DF2B6M5SL,L3F?
All DF2B6M5SL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B6M5SL,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B6M5SL,L3F part is unused and in its original packaging.
Return procedure for DF2B6M5SL,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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