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Toshiba Semiconductor and Storage DF2B7ACT,L3F
- Part No.:
- DF2B7ACT,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SOD-882
- Datasheet:
-
DF2B7ACT,L3F.pdf
- Description:
- TVS DIODE 5.5VWM 20VC CST2
- Quantity:
- Payment:
- Shipping:
Inventory:25,187
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Product details
Overview
DF2B7ACT,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for high-speed signal lines in mobile interfaces, featuring ±30 kV IEC61000-4-2 contact ESD immunity, 8.5 pF typical capacitance, and 0.2 Ω dynamic resistance to safeguard sensitive ICs against electrostatic discharge and noise.
For engineers reviewing the DF2B7ACT,L3F datasheet, DF2B7ACT,L3F pinout, DF2B7ACT,L3F application, or DF2B7ACT,L3F equivalent, this device is selected for compact 5 V interface protection where low clamping voltage (11 V @ 4 A), snapback behavior, and ultra-small CST2 footprint (1.0 mm × 0.6 mm) are critical design requirements.
Technical Context
The DF2B7ACT,L3F employs silicon epitaxial planar technology with snapback-triggered TVS operation, enabling low clamping voltage and fast response to ESD transients. Its bidirectional configuration supports dual-pin I/O protection with ground-referenced layout flexibility.
Designed specifically for high-speed data lines, it maintains signal integrity via low capacitance (8.5 pF typ.) and low dynamic resistance (0.2 Ω typ.), meeting IEC61000-4-2 Level 4 and IEC61000-4-5 surge immunity requirements without degrading signal rise/fall times.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 5.5 V - Ensures safe operation on 5 V signal rails without leakage or premature conduction. |
| Total Capacitance | 8.5 pF (typ.) - Minimizes signal distortion and insertion loss on USB 2.0, HDMI, or MIPI D-PHY lines. |
| Dynamic Resistance | 0.2 Ω (typ.) - Enables rapid energy shunting during ESD events, reducing voltage overshoot at protected node. |
| Clamp Voltage | 11 V @ 4 A (typ.) - Limits transient voltage seen by downstream ICs to safe levels during 8/20 µs surges. |
| ESD Withstand | ±30 kV (IEC61000-4-2 Contact) - Exceeds industrial and consumer ESD immunity requirements for handheld devices. |
| Package Size | 1.0 mm × 0.6 mm - Fits dense PCB layouts in smartphones and tablets where board space is constrained. |
Pinout & Package
The DF2B7ACT,L3F is housed in the CST2 ultra-compact surface-mount package (1.0 mm × 0.6 mm, 0.7 mg weight), optimized for automated placement and high-density routing in mobile applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O Signal Terminal | Connected to protected data line (e.g., USB D+, HDMI TMDS+); requires external GND connection on Pin 2. |
| Pin 2 | Ground Reference | Must be connected to system ground to complete ESD current path; enables bidirectional clamping when Pin 1 is active. |
Key Features
| Feature | Design Value |
|---|---|
| Snapback-triggered clamping | Enables sub-11 V clamping at 4 A while maintaining low leakage below 5.5 V VRWM. |
| Bidirectional ESD protection | Supports symmetric ±30 kV IEC61000-4-2 protection on single-ended I/O lines without polarity constraints. |
| Ultra-low capacitance | 8.5 pF typical value preserves signal integrity on high-speed interfaces up to 480 Mbps (USB 2.0). |
| Compact CST2 footprint | 1.0 mm × 0.6 mm land pattern reduces PCB area by >50% vs. SOD-323, easing layout in narrow pitch traces. |
Applications
| Smartphone Interface Protection | Tablet USB Port Protection |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D− lines in slim smartphone designs exposed to frequent user-handling ESD events. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly at connector entry point to clamp transients before reaching USB PHY. Use Value: Prevents latch-up or gate oxide damage in USB transceivers using only 8.5 pF loading and 11 V clamping at 4 A. | Use Scenario: Safeguarding HDMI CEC and DDC lines in tablet docking interfaces subject to repeated plug/unplug cycles. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor integrated into HDMI receptacle PCB trace to meet IEC61000-4-2 Level 4. Use Value: Maintains HDMI 1.4 signal eye diagram integrity while delivering ±30 kV contact ESD immunity without added series impedance. |
| Notebook PC Touchpad I²C Lines | Mobile Display MIPI D-PHY Lanes |
Use Scenario: Shielding I²C clock/data lines connecting touchpad controller to SoC in ultrabook hinge regions prone to static buildup. IC Role / Device Role / Timing Role: Dual-line ESD protection device with matched capacitance ensuring <1 ns skew between SDA/SCL paths. Use Value: Eliminates false touch interrupts caused by ESD-induced bus glitches while preserving 400 kHz timing margins. | Use Scenario: Protecting high-speed MIPI D-PHY differential pairs (CLK/HS-DATA) in OLED display modules of foldable phones. IC Role / Device Role / Timing Role: Ultra-low-capacitance TVS placed per-lane at display connector to suppress ESD without degrading 1.5 Gbps eye opening. Use Value: Achieves pass/fail compliance for JEDEC JESD22-A114F testing while adding <0.02 mm² PCB area per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.9 pF lower capacitance (7.6 pF typ.), but 12.5 V clamping @ 4 A and ±8 kV IEC61000-4-2 rating. | Targeted at ultra-high-speed SerDes lanes (e.g., PCIe Gen3), not optimized for 5 V mobile I/O. | Select when signal bandwidth >1 GHz is required and ESD level ≤±8 kV suffices. |
| ESD5Z7.0T1G | Higher clamping (13.5 V @ 4 A), same 5.5 V VRWM, but 12 pF capacitance and larger SOD-523 package (1.3 mm × 0.85 mm). | Used in cost-sensitive industrial HMI panels where board space is less constrained. | Choose when higher surge robustness (100 W PPK) is prioritized over capacitance and size. |
Compared with TPD2E001DRYR and ESD5Z7.0T1G, the DF2B7ACT,L3F delivers superior ESD immunity (±30 kV) in the smallest footprint while balancing clamping voltage and capacitance for mainstream 5 V mobile interfaces-making it optimal for smartphones, tablets, and notebooks where space and robustness are co-constrained.
Availability
DF2B7ACT,L3F is available at Aetrix Electronics and suitable for smartphone interface protection, tablet USB port hardening, and notebook PC touchpad I²C line safeguarding requiring stable component supply across high-volume production cycles.
Supply support for DF2B7ACT,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, miniaturization, and energy efficiency for consumer, industrial, and automotive markets.
The DF2B7ACT,L3F belongs to Toshiba's CST2-series ESD protection diodes, engineered specifically for space-constrained high-speed digital interfaces in portable electronics where low capacitance and high ESD immunity are simultaneously required.
FAQ
What is the maximum working voltage supported by the DF2B7ACT,L3F?
The DF2B7ACT,L3F has a working peak reverse voltage (VRWM) of 5.5 V, making it suitable for reliable operation on standard 5 V signal lines such as USB 2.0, HDMI DDC, and I²C buses without leakage or unintended conduction during normal operation. This rating is confirmed in Toshiba's Rev.2.0.A datasheet under Electrical Characteristics.
Does the DF2B7ACT,L3F require orientation-specific PCB layout?
No-the DF2B7ACT,L3F is bidirectional and symmetrical; either pin can serve as the I/O terminal provided the other is connected to ground. The internal circuit (per Toshiba datasheet Fig.10) shows identical snapback characteristics in both directions, eliminating polarity concerns during placement. This simplifies layout and reduces assembly errors in high-density mobile PCBs.
How does the DF2B7ACT,L3F achieve low clamping voltage despite its small size?
The DF2B7ACT,L3F achieves 11 V clamping at 4 A through silicon epitaxial planar process optimization and snapback-triggered avalanche design, which lowers on-state impedance after breakdown. Its 0.2 Ω dynamic resistance (RDYN) ensures minimal IR drop during ESD transients-directly enabled by Toshiba's proprietary junction engineering, not package scaling alone.
Is the DF2B7ACT,L3F compliant with RoHS and REACH regulations?
Yes-the DF2B7ACT,L3F meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006 as confirmed by Toshiba's environmental compliance documentation. It contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE above threshold limits, and is rated for lead-free reflow soldering per J-STD-020.
Can the DF2B7ACT,L3F protect against IEC61000-4-5 surge events?
Yes-the DF2B7ACT,L3F is rated for 80 W peak pulse power (tp = 8/20 µs) per IEC61000-4-5, supporting basic surge immunity in secondary-side interfaces like USB ports or display links. While not intended for primary AC-line protection, it provides validated clamping performance up to 4 A IPP under 8/20 µs waveforms as specified in Toshiba's Absolute Maximum Ratings table.
DF2B7ACT,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SOD-882
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- 20V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 80W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 8.5pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- CST2
DF2B7ACT,L3F FAQ
1.How can I place an order for DF2B7ACT,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B7ACT,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B7ACT,L3F reliable?
The price and inventory of DF2B7ACT,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B7ACT,L3F is usually 5 days.
3.What payment methods are accepted for DF2B7ACT,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B7ACT,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B7ACT,L3F?
DF2B7ACT,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B7ACT,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B7ACT,L3F?
For technical support, including DF2B7ACT,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B7ACT,L3F requirements.
6.How does Aetrix verify that DF2B7ACT,L3F is sourced from the original manufacturer or authorized distributors?
All DF2B7ACT,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B7ACT,L3F meets industry standards.
7.What is the process for return or replacement of DF2B7ACT,L3F?
All DF2B7ACT,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B7ACT,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B7ACT,L3F part is unused and in its original packaging.
Return procedure for DF2B7ACT,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2B7ACT,L3F Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
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D12V0L1B2LP-7B
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Diodes Incorporated
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