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Toshiba Semiconductor and Storage DF2B7AE,L3F
- Part No.:
- DF2B7AE,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-79, SOD-523
- Datasheet:
-
DF2B7AE,L3F.pdf
- Description:
- TVS DIODE 5.5VWM 20VC ESC
- Quantity:
- Payment:
- Shipping:
Inventory:12,090
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Product details
Overview
DF2B7AE,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for bidirectional I/O line protection in mobile device interfaces. It features a working peak reverse voltage of 5.5 V, ±30 kV IEC61000-4-2 contact ESD rating, 0.2 Ω typical dynamic resistance, 11 V clamping voltage at 4 A, and ultra-compact ESC package (0.8 mm × 1.2 mm). It is deployed on smartphone USB, HDMI, and audio jack signal lines to suppress transient overvoltage.
For engineers reviewing the DF2B7AE,L3F datasheet, DF2B7AE,L3F pinout, DF2B7AE,L3F application, or DF2B7AE,L3F equivalent, key selection criteria include low clamping voltage under 4 A pulse, sub-10 pF capacitance for high-speed interface integrity, snapback-triggered low dynamic resistance, and ESC footprint compatibility with dense PCB layouts in portable electronics.
Technical Context
The DF2B7AE,L3F employs silicon epitaxial planar technology with snapback-triggered clamping behavior, enabling fast response to ESD transients while maintaining low dynamic resistance (0.2 Ω typ.) across its operating range. Its bidirectional structure supports protection of both positive and negative polarity surges without external biasing.
It operates within a 5.5 V working peak reverse voltage limit and delivers 11 V clamping at 4 A IPP, meeting IEC61000-4-2 Level 4 (±30 kV contact) and IEC61000-4-5 surge immunity requirements. Total capacitance is 8.5 pF typ. at 0 V, ensuring minimal signal distortion on 5 V high-speed data lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 5.5 V - Ensures safe operation on standard 5 V signal rails without leakage or premature conduction. |
| ESD Withstand (IEC61000-4-2) | ±30 kV contact - Guarantees robust protection against human-body-model ESD events in handheld devices. |
| Clamp Voltage @ 4 A | 11 V typ. - Limits voltage seen by downstream ICs during surge, preventing latch-up or gate oxide damage. |
| Dynamic Resistance | 0.2 Ω typ. - Enables rapid energy shunting with minimal voltage overshoot during fast ESD pulses. |
| Total Capacitance | 8.5 pF typ. @ 0 V, 1 MHz - Preserves signal integrity on USB 2.0, HDMI, and audio interfaces without bandwidth degradation. |
| Package Dimensions | 0.8 mm × 1.2 mm - Fits tight spacing constraints in smartphones and tablets; ESC footprint verified per Toshiba land pattern. |
Pinout & Package
DF2B7AE,L3F is housed in Toshiba's ESC (Extremely Small Chip) package: 2-terminal surface-mount device with no polarity marking; Pin 1 and Pin 2 are symmetrical and interchangeable for bidirectional protection. GND connection is made via either pin depending on I/O routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O Protection Terminal | Connected to protected signal line (e.g., USB D+); clamps transients to GND when used with Pin 2 grounded. |
| Pin 2 | GND Reference Terminal | Connected to system ground plane; completes ESD current path during snapback conduction event. |
Key Features
| Feature | Design Value |
|---|---|
| Snapback-triggered clamping | Enables sub-11 V clamping at 4 A with stable low-RDYN, reducing stress on sensitive SoCs and PMICs. |
| Bidirectional ESD protection | Supports ±30 kV contact discharge without external bias or polarity configuration-ideal for unidirectional or bidirectional data lines. |
| Ultra-low capacitance | 8.5 pF typ. minimizes insertion loss and phase distortion on 480 Mbps USB 2.0 and 2.25 Gbps HDMI signals. |
| ESC package integration | 0.8 mm × 1.2 mm footprint allows placement directly adjacent to connectors, shortening transient path and improving protection efficacy. |
Applications
| Smartphone Interface Protection | Tablet USB/HDMI Port Protection |
|---|---|
Use Scenario: Protecting micro-USB and USB-C data lines in compact smartphones against repeated handling-induced ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and baseband processor or USB PHY. Use Value: Prevents field failures caused by ±30 kV contact discharges while adding <10 pF loading to maintain USB 2.0 eye diagram compliance. | Use Scenario: Shielding HDMI and audio jack signal paths in thin-profile tablets exposed to frequent accessory plugging/unplugging. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on differential pairs and analog audio inputs before codec or display controller. Use Value: Maintains signal fidelity up to 2.25 Gbps with clamping action that limits voltage excursion to ≤11 V during 4 A surge events. |
| Notebook PC Touchpad/Keyboard Lines | Desktop PC Front-Panel I/O Protection |
Use Scenario: Guarding I²C and GPIO lines connected to touchpad, keyboard, and sensor hubs in ultrabooks. IC Role / Device Role / Timing Role: Standalone ESD suppressor on low-voltage (≤5.5 V) control buses where space and capacitance are critical. Use Value: Delivers 0.2 Ω dynamic resistance to rapidly divert ESD energy away from MCU pins, avoiding reset or brownout conditions. | Use Scenario: Securing front-panel USB, audio, and power button traces on desktop motherboards subject to user-accessible ESD exposure. IC Role / Device Role / Timing Role: Discrete ESD protection element mounted near chassis-mounted connectors to minimize trace inductance. Use Value: Provides certified ±30 kV air/contact immunity in ESC package, eliminating need for larger SOD-323 or SC-70 alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.9 pF typ. capacitance, 12 V clamping @ 4 A, SOT-5X3 package (1.0 mm × 1.45 mm) | Lower capacitance suits USB 3.0/PCIe; larger footprint may limit layout flexibility in ultra-thin designs. | Select when sub-1 pF loading is mandatory and board space permits slightly larger package. |
| ESD9B5.0ST5G | 5.0 V VRWM, 15 V clamping @ 4 A, SOD-523 package (1.2 mm × 0.8 mm) | Higher clamping voltage increases risk to 5 V tolerant receivers; same footprint orientation but different pin assignment. | Choose only if VRWM margin must be tighter than 5.5 V and system can tolerate higher VC. |
Compared with TPD2E001DRYR and ESD9B5.0ST5G, the DF2B7AE,L3F offers optimal balance of 8.5 pF capacitance, 11 V clamping, and 0.8 mm × 1.2 mm ESC footprint-making it preferred for space-constrained 5 V mobile interfaces where signal integrity and surge suppression must coexist.
Availability
DF2B7AE,L3F is available at Aetrix Electronics and suitable for smartphone interface protection, tablet HDMI/audio port hardening, and notebook PC touchpad I²C line safeguarding requiring stable component supply and long-term lifecycle support.
Supply support for DF2B7AE,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs for consumer, industrial, and automotive markets with emphasis on reliability and miniaturization.
The DF2B7AE,L3F belongs to Toshiba's ESC-series ESD protection diode family, engineered specifically for ultra-dense portable electronics where sub-10 pF capacitance, ±30 kV ESD immunity, and footprint minimization are non-negotiable design requirements.
FAQ
What is the maximum working voltage supported by the DF2B7AE,L3F?
The DF2B7AE,L3F has a working peak reverse voltage (VRWM) of 5.5 V, meaning it is rated for continuous operation on 5 V signal lines without leakage or conduction. This makes DF2B7AE,L3F suitable for USB, HDMI, and other standard 5 V interface applications where reliable standoff is required between normal operation and ESD clamping thresholds.
Does the DF2B7AE,L3F require external biasing or polarity configuration?
No, the DF2B7AE,L3F is a bidirectional ESD protection diode with symmetrical pin structure-Pin 1 and Pin 2 are functionally identical. Either pin connects to the protected I/O line, while the other connects to GND; no external bias or polarity selection is needed. This simplifies layout and eliminates configuration errors in DF2B7AE,L3F implementations.
What is the clamping voltage of the DF2B7AE,L3F under a 4 A ESD pulse?
The DF2B7AE,L3F delivers a typical clamping voltage (VC) of 11 V at 4 A peak pulse current (IPP), per IEC61000-4-2 test conditions. This value ensures downstream ICs-such as USB transceivers or audio codecs-are exposed to less than 11 V during worst-case ESD events, significantly reducing risk of functional interruption or permanent damage in DF2B7AE,L3F-protected systems.
How does the dynamic resistance of the DF2B7AE,L3F affect ESD protection performance?
The DF2B7AE,L3F exhibits 0.2 Ω typical dynamic resistance (RDYN), which enables rapid dissipation of ESD energy into ground with minimal voltage overshoot. This low RDYN directly contributes to tighter clamping and faster response-critical for protecting modern low-voltage, high-speed ICs where even brief overvoltage can cause latch-up or data corruption in DF2B7AE,L3F-deployed circuits.
Is the DF2B7AE,L3F compatible with automated SMT assembly processes?
Yes, the DF2B7AE,L3F uses Toshiba's ESC package (0.8 mm × 1.2 mm), which is fully compatible with standard reflow soldering profiles and pick-and-place equipment. Its 1.4 mg typical weight and defined land pattern ensure reliable placement yield and solder joint integrity-making DF2B7AE,L3F suitable for high-volume manufacturing of smartphones, tablets, and other portable electronics.
DF2B7AE,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-79, SOD-523
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- 20V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 80W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 8.5pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- ESC
DF2B7AE,L3F FAQ
1.How can I place an order for DF2B7AE,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B7AE,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B7AE,L3F reliable?
The price and inventory of DF2B7AE,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B7AE,L3F is usually 5 days.
3.What payment methods are accepted for DF2B7AE,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B7AE,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B7AE,L3F?
DF2B7AE,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B7AE,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B7AE,L3F?
For technical support, including DF2B7AE,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B7AE,L3F requirements.
6.How does Aetrix verify that DF2B7AE,L3F is sourced from the original manufacturer or authorized distributors?
All DF2B7AE,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B7AE,L3F meets industry standards.
7.What is the process for return or replacement of DF2B7AE,L3F?
All DF2B7AE,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B7AE,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B7AE,L3F part is unused and in its original packaging.
Return procedure for DF2B7AE,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2B7AE,L3F Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
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ESD5Z5.0T1G
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D12V0L1B2LP-7B
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PESD2V0Y1BSFYL
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