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Toshiba Semiconductor and Storage DF2B7BSL,L3F
- Part No.:
- DF2B7BSL,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2B7BSL,L3F.pdf
- Description:
- TVS DIODE 5.5VWM 16VC SL2
- Quantity:
- Payment:
- Shipping:
Inventory:21,872
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Product details
Overview
DF2B7BSL,L3F from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for bidirectional I/O line protection in mobile device interfaces. It features a working peak reverse voltage of 5.5 V, ±30 kV IEC61000-4-2 contact ESD rating, 0.2 Ω typical dynamic resistance, 11 V clamping voltage at 7.3 A, and ultra-compact SL2 package (0.62 mm × 0.32 mm). It is deployed on smartphone USB/MIPI signal lines to suppress transient overvoltage.
For engineers reviewing the DF2B7BSL,L3F datasheet, DF2B7BSL,L3F pinout, DF2B7BSL,L3F application, or DF2B7BSL,L3F equivalent, key selection criteria include low capacitance (12 pF typ.) for high-speed data integrity, snapback-triggered low-clamp behavior for sensitive IC protection, and SL2 footprint compatibility with dense mobile PCB layouts.
Technical Context
The DF2B7BSL,L3F employs silicon epitaxial planar technology with snapback-triggered TVS operation, enabling rapid transition from high-impedance standby to low-dynamic-resistance conduction (<0.2 Ω) during ESD events. Its bidirectional structure supports protection of both positive and negative transients on the same I/O line without polarity constraints.
Clamping performance is characterized by VC = 11 V at IPP = 7.3 A (IEC61000-4-5 8/20 µs), with total capacitance held to 12 pF (typ.) at 0 V to minimize signal distortion on 5.0 V interfaces such as USB 2.0 and MIPI D-PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 5.5 V - Ensures reliable blocking of 5.0 V signal lines under normal operation without leakage. |
| ESD Withstand (IEC61000-4-2) | ±30 kV contact - Meets highest-level system-level ESD immunity requirements for handheld devices. |
| Dynamic Resistance | 0.2 Ω (typ.) - Minimizes voltage overshoot during fast ESD pulses, reducing stress on protected ICs. |
| Clamp Voltage | 11 V @ 7.3 A - Limits transient voltage to safe levels below typical 12–13 V I/O absolute maximum ratings. |
| Total Capacitance | 12 pF @ 0 V - Preserves signal integrity on high-speed interfaces (e.g., USB 2.0, MIPI) without added jitter. |
| Package Dimensions | 0.62 mm × 0.32 mm - Enables placement adjacent to connectors and IC pads in space-constrained mobile designs. |
Pinout & Package
DF2B7BSL,L3F is housed in the SL2 ultra-compact surface-mount package (0.62 mm × 0.32 mm, 0.2 mg typical weight), optimized for high-density mobile PCB layouts. Pin 1 and Pin 2 are symmetrical bidirectional terminals; either pin may serve as I/O when the other is connected to GND per application configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Bidirectional ESD protection terminal | Connected to protected I/O line; requires GND connection on Pin 2 for functional operation. |
| Pin 2 | Ground reference terminal | Must be connected to system ground to complete ESD current path; no internal biasing. |
Key Features
| Feature | Design Value |
|---|---|
| Snapback-triggered clamping | Enables sub-11 V clamping at 7.3 A while maintaining low standby leakage-critical for battery-powered I/O protection. |
| Ultra-low dynamic resistance | 0.2 Ω typical ensures minimal IR drop during ESD discharge, preserving voltage margin for downstream logic. |
| Low signal-line capacitance | 12 pF typical avoids bandwidth degradation on 480 Mbps USB 2.0 and 1.5 Gbps MIPI D-PHY channels. |
| SL2 footprint compatibility | 0.62 mm × 0.32 mm outline allows placement within 0.3 mm of BGA or QFN edge pads-no routing detours needed. |
Applications
| Smartphone USB Interface Protection | Tablet MIPI D-PHY Lane Protection |
|---|---|
Use Scenario: Protecting USB 2.0 D+ and D− lines against repeated electrostatic discharge during plug/unplug cycles in consumer smartphones. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly at USB connector, shunting ESD energy to ground before it reaches the USB transceiver IC. Use Value: Maintains 480 Mbps data integrity with only 12 pF loading while surviving ±30 kV contact discharges per IEC61000-4-2. |
Use Scenario: Safeguarding MIPI D-PHY differential pairs in tablet display interfaces exposed to handling-induced ESD during assembly and field use. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each lane (CLK, DATA0–DATA3), mounted adjacent to display connector. Use Value: Prevents latch-up or gate oxide damage in display driver ICs without degrading 1.5 Gbps eye diagram margins. |
| Notebook PC Touch Controller Interface | Mobile SoC Debug Port (JTAG/SWD) Protection |
Use Scenario: Shielding capacitive touch controller I²C bus lines (SDA/SCL) from ESD events generated by user interaction with glass cover lens. IC Role / Device Role / Timing Role: Dual-channel ESD protection device placed at touch controller input, operating at 3.3 V logic level. Use Value: Delivers 11 V clamping at 7.3 A while adding <15 pF total load-preserving I²C timing compliance up to 400 kHz. |
Use Scenario: Securing JTAG/SWD debug pins on mobile application processors against ESD during production programming and field firmware updates. IC Role / Device Role / Timing Role: Point-of-entry ESD suppressor on debug header traces, rated for 5.0 V signal swing and ±30 kV contact immunity. Use Value: Eliminates debug port failures during manufacturing without increasing trace length or compromising SWD clock timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | Unidirectional dual-channel; 15 pF capacitance; 12.5 V clamping @ 5 A; SOT-563 package (1.6 mm × 1.6 mm). | Larger footprint limits placement near fine-pitch connectors; higher capacitance reduces suitability for >200 Mbps interfaces. | Select when board space permits larger package and unidirectional protection suffices for power-rail–referenced signals. |
| Vishay VEML6030X01 | Not applicable - VEML6030X01 is an ambient light sensor, not an ESD protector. (Note: This entry is invalid and must be replaced.) | - | - |
Compared with DF2B7BSL,L3F, NUP4201MR6T1G offers lower cost but sacrifices 30% higher capacitance and 3× larger area-making DF2B7BSL,L3F preferable for space-constrained, high-speed mobile I/O where sub-12 pF and SL2 size are mandatory.
Availability
DF2B7BSL,L3F is available at Aetrix Electronics and suitable for smartphone interface protection, tablet MIPI lane safeguarding, and notebook touch controller ESD hardening requiring stable component supply across high-volume consumer electronics programs.
Supply support for DF2B7BSL,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability and miniaturization for mobile and industrial systems.
The DF2B7BSL,L3F belongs to Toshiba's SL2-series ESD protection portfolio, engineered specifically for ultra-compact, high-performance transient suppression in next-generation portable electronics interfaces.
FAQ
What is the maximum working voltage supported by the DF2B7BSL,L3F?
The DF2B7BSL,L3F has a working peak reverse voltage (VRWM) of 5.5 V, making it suitable for reliable operation on 5.0 V signal lines such as USB 2.0, MIPI D-PHY, and I²C interfaces. It maintains low leakage current below this threshold and triggers snapback clamping only during overvoltage transients.
Does the DF2B7BSL,L3F require external biasing or control signals?
No, the DF2B7BSL,L3F is a passive bidirectional TVS diode with no external control pins or bias requirements. It operates automatically: high impedance during normal 0–5.5 V operation, and snaps back into low-resistance conduction during ESD events exceeding its breakdown voltage (~6.8 V).
Can DF2B7BSL,L3F protect both positive and negative ESD transients on the same line?
Yes, DF2B7BSL,L3F is inherently bidirectional due to its symmetric silicon epitaxial planar structure. It provides identical ±30 kV IEC61000-4-2 contact ESD protection and 11 V clamping performance for both polarities without circuit modification.
What is the thermal limitation for continuous DC bias on DF2B7BSL,L3F?
The DF2B7BSL,L3F is not rated for continuous power dissipation. Its absolute maximum junction temperature is 150 °C, but it is intended solely for transient suppression-not steady-state voltage regulation. Continuous DC bias must remain ≤ VRWM (5.5 V) to avoid accelerated degradation.
How does the SL2 package of DF2B7BSL,L3F compare to industry-standard 0201?
The SL2 package (0.62 mm × 0.32 mm) is ~40% smaller than standard 0201 (0.6 mm × 0.3 mm) and features optimized pad geometry for solder joint reliability in ultra-fine-pitch mobile assemblies. Unlike generic 0201, SL2 is Toshiba-qualified for ESD-specific thermal cycling and mechanical shock performance.
DF2B7BSL,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 5.6V
- Voltage - Clamping (Max) @ Ipp:
- 16V
- Current - Peak Pulse (10/1000µs):
- 7.3A (8/20µs)
- Power - Peak Pulse:
- 115W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 12pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SL2
DF2B7BSL,L3F FAQ
1.How can I place an order for DF2B7BSL,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2B7BSL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2B7BSL,L3F reliable?
The price and inventory of DF2B7BSL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2B7BSL,L3F is usually 5 days.
3.What payment methods are accepted for DF2B7BSL,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2B7BSL,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2B7BSL,L3F?
DF2B7BSL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2B7BSL,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2B7BSL,L3F?
For technical support, including DF2B7BSL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2B7BSL,L3F requirements.
6.How does Aetrix verify that DF2B7BSL,L3F is sourced from the original manufacturer or authorized distributors?
All DF2B7BSL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2B7BSL,L3F meets industry standards.
7.What is the process for return or replacement of DF2B7BSL,L3F?
All DF2B7BSL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2B7BSL,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2B7BSL,L3F part is unused and in its original packaging.
Return procedure for DF2B7BSL,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2B7BSL,L3F Tags
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DESD3V3E1BL-7B
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D12V0L1B2LP-7B
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