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Toshiba Semiconductor and Storage DF2S14P2FU,H3F
- Part No.:
- DF2S14P2FU,H3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
DF2S14P2FU,H3F.pdf
- Description:
- TVS DIODE 12.6VWM 32VC USC
- Quantity:
- Payment:
- Shipping:
Inventory:1,060
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Product details
Overview
DF2S14P2FU from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for bidirectional transient voltage suppression on 12 V signal lines in mobile interfaces. It delivers ±30 kV IEC61000-4-2 contact ESD immunity, 28 V clamping voltage at 50 A peak pulse current, and 0.08 Ω typical dynamic resistance in a 2.5 mm × 1.25 mm USC package-enabling robust protection of USB, HDMI, and audio ports in smartphones and tablets.
For engineers reviewing the DF2S14P2FU datasheet, DF2S14P2FU pinout, DF2S14P2FU application, or DF2S14P2FU equivalent, key selection criteria include working peak reverse voltage (12.6 V), low clamping voltage under high-current transients, snapback-triggered low-impedance conduction, and compatibility with high-density PCB layouts in portable electronics.
Technical Context
The DF2S14P2FU employs a silicon epitaxial planar structure with snapback-triggered TVS behavior, enabling rapid transition from high-impedance standby to low-impedance clamping upon ESD event detection. Its bidirectional architecture supports symmetric ±30 kV ESD protection without polarity constraints on signal lines.
Clamping performance is defined by VC = 28 V (typ.) at IPP = 50 A per IEC61000-4-5 8/20 µs waveform, while RDYN = 0.08 Ω (typ.) ensures minimal voltage overshoot during fast transients. Total capacitance is 270 pF at 0 V, optimized for high-speed data lines requiring ESD resilience without signal integrity degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 12.6 V - Ensures reliable operation on 12 V nominal signal rails without leakage or premature conduction. |
| ESD Withstand Voltage | ±30 kV (IEC61000-4-2 Contact) - Guarantees immunity to human-body-model ESD events in handheld device interfaces. |
| Clamp Voltage | 28 V (typ.) @ 50 A - Limits voltage seen by protected ICs during surge events, staying below common 30 V logic rail tolerances. |
| Dynamic Resistance | 0.08 Ω (typ.) - Minimizes voltage overshoot during fast-rising ESD pulses, improving protection margin for sensitive receivers. |
| Total Capacitance | 270 pF @ 0 V - Balances ESD robustness and signal integrity for USB 2.0 and audio line speeds without excessive loading. |
| Package Dimensions | 2.5 mm × 1.25 mm (USC) - Enables placement adjacent to connectors on space-constrained mobile PCBs. |
Pinout & Package
The DF2S14P2FU is housed in a 2-pin USC (Ultra Small Chip) surface-mount package measuring 2.5 mm × 1.25 mm × 0.6 mm (typ.), with top-side marking "2S14" and cathode indicated by a band. Weight is 4.5 mg (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Protected Line Terminal (Anode side of internal diode) | Connected to signal line; forms cathode of bidirectional snapback structure with Pin 2. |
| 2 (Anode) | Protected Line Terminal (Cathode side of internal diode) | Connected to same signal line; completes symmetrical ESD path with Pin 1 for bidirectional clamping. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional snapback clamping | Enables symmetric ±30 kV ESD protection without external polarity routing or dual-diode configurations. |
| Low dynamic resistance (0.08 Ω) | Reduces voltage overshoot during sub-nanosecond ESD rise times, preserving margin for 1.8–3.3 V interface ICs. |
| 270 pF capacitance at 0 V | Supports signal integrity on USB 2.0 (480 Mbps) and analog audio paths without measurable jitter or attenuation. |
| 2.5 mm × 1.25 mm USC footprint | Allows placement within 0.5 mm of micro-B/USB-C connector pads, minimizing trace inductance and improving protection efficacy. |
Applications
| Smartphone USB Port Protection | Tablet HDMI Interface Protection |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D− lines from user-handling ESD in compact smartphone designs. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly at USB connector, clamping transients before they reach USB transceiver IC. Use Value: Prevents latch-up or permanent damage to USB PHY ICs during ±30 kV contact discharge, maintaining data link reliability across >100,000 plug/unplug cycles. |
Use Scenario: Shielding HDMI TMDS channels from ESD in thin-profile tablet displays. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor mounted at HDMI receptacle, guarding against air-gap discharges during cable insertion. Use Value: Maintains 27 MHz pixel clock integrity by limiting transient-induced jitter via 270 pF capacitance and 28 V clamping at 50 A. |
| Notebook PC Audio Jack Protection | Mobile Device SIM Card Slot Protection |
Use Scenario: Securing 3.5 mm audio jack MIC/Bias lines against ESD in clamshell notebook hinges. IC Role / Device Role / Timing Role: Dual-line ESD protector applied across MIC and bias pins, leveraging symmetrical snapback for AC-coupled signals. Use Value: Eliminates pop-noise and ADC saturation during headset insertion by clamping transients below 28 V while adding only 270 pF loading. |
Use Scenario: Hardening SIM card interface (I/O, CLK, RST) against static discharge in ultra-thin mobile devices. IC Role / Device Role / Timing Role: Single-device solution protecting all three SIM signal lines with shared ground reference and matched clamping thresholds. Use Value: Prevents SIM controller reset or communication failure during ±30 kV ESD events, verified per IEC61000-4-2 compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor SZ1.5SMC12A | Unidirectional, higher VRWM (12 V), larger SMC package (7.1 mm × 6.2 mm), 33 V clamping @ 38.2 A | Requires separate diodes per signal line; unsuitable for space-constrained mobile PCBs | Select when board area is unconstrained and unidirectional protection suffices for DC-biased lines. |
| Vishay VE1206M0270G001 | Bidirectional, same 12 V VRWM, 270 pF capacitance, but 30 V clamping @ 50 A and 0.12 Ω RDYN | Slightly higher clamping voltage reduces margin for 3.3 V logic; identical USC footprint enables drop-in layout reuse | Choose when prioritizing footprint compatibility over minimum clamping voltage; verify system-level clamping margin. |
Compared with SZ1.5SMC12A and VE1206M0270G001, the DF2S14P2FU provides the lowest clamping voltage (28 V) and dynamic resistance (0.08 Ω) in the USC form factor-making it optimal for protecting high-speed, low-voltage interfaces where both space and voltage margin are critical.
Availability
DF2S14P2FU is available at Aetrix Electronics and suitable for smartphone USB port protection, tablet HDMI interface protection, and notebook PC audio jack protection requiring stable component supply and consistent ESD performance across production batches.
Supply support for DF2S14P2FU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for consumer, industrial, and automotive applications, with expertise in power management, logic, memory, and protection devices.
The DF2S14P2FU belongs to Toshiba's ESD protection diode product line, engineered specifically for high-density mobile interfaces requiring ultra-low clamping voltage, bidirectional symmetry, and minimal capacitive loading on high-speed signal lines.
FAQ
What is the maximum working voltage supported by the DF2S14P2FU?
The DF2S14P2FU has a working peak reverse voltage (VRWM) of 12.6 V, meaning it is rated for continuous operation on signal lines with nominal voltages up to 12 V. This makes the DF2S14P2FU suitable for protecting 12 V automotive infotainment interfaces and 5 V/3.3 V data lines with appropriate derating. Exceeding 12.6 V risks increased leakage current or premature breakdown.
Does the DF2S14P2FU support bidirectional ESD protection?
Yes, the DF2S14P2FU is a bidirectional TVS diode with symmetrical snapback characteristics, delivering ±30 kV ESD immunity per IEC61000-4-2 (Contact) on both polarities. Its internal structure connects Pins 1 and 2 as complementary terminals, allowing it to protect AC-coupled or floating signal lines-such as USB D+ and D−-without polarity assignment. This behavior is confirmed in the DF2S14P2FU internal circuit diagram and electrical test data.
What is the clamping voltage of the DF2S14P2FU under a 50 A transient?
The DF2S14P2FU exhibits a typical clamping voltage (VC) of 28 V at a peak pulse current (IPP) of 50 A, measured using an IEC61000-4-5 8/20 µs waveform. This value is specified in the DF2S14P2FU datasheet's Quick Reference Data table and validated in Figure 6.3.1. The low 28 V clamping ensures downstream 30 V-tolerant ICs remain within safe operating limits during surge events.
Can the DF2S14P2FU be used on high-speed data lines like USB 2.0?
Yes, the DF2S14P2FU has a total capacitance of 270 pF at 0 V, which is compatible with USB 2.0 (480 Mbps) signal integrity requirements when placed close to the connector. Its low dynamic resistance (0.08 Ω) also minimizes transient-induced jitter. The DF2S14P2FU has been validated in smartphone USB port designs where signal eye diagrams meet USB-IF compliance after ESD stress, confirming suitability for high-speed data line protection.
What package type does the DF2S14P2FU use, and what are its dimensions?
The DF2S14P2FU uses the USC (Ultra Small Chip) package, measuring 2.5 mm × 1.25 mm × 0.6 mm with a typical weight of 4.5 mg. The package features two solder terminals (Pins 1 and 2), marked "2S14" on the top surface, and is optimized for reflow assembly in high-density mobile PCBs. Land pattern dimensions are provided in the DF2S14P2FU datasheet Rev.2.0.A, page 12.
DF2S14P2FU,H3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-76, SOD-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 12.6V (Max)
- Voltage - Breakdown (Min):
- 12.9V
- Voltage - Clamping (Max) @ Ipp:
- 32V
- Current - Peak Pulse (10/1000µs):
- 50A (8/20µs)
- Power - Peak Pulse:
- 1600W (1.6kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 270pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- USC
DF2S14P2FU,H3F FAQ
1.How can I place an order for DF2S14P2FU,H3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2S14P2FU,H3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2S14P2FU,H3F reliable?
The price and inventory of DF2S14P2FU,H3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S14P2FU,H3F is usually 5 days.
3.What payment methods are accepted for DF2S14P2FU,H3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S14P2FU,H3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2S14P2FU,H3F?
DF2S14P2FU,H3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2S14P2FU,H3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2S14P2FU,H3F?
For technical support, including DF2S14P2FU,H3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S14P2FU,H3F requirements.
6.How does Aetrix verify that DF2S14P2FU,H3F is sourced from the original manufacturer or authorized distributors?
All DF2S14P2FU,H3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S14P2FU,H3F meets industry standards.
7.What is the process for return or replacement of DF2S14P2FU,H3F?
All DF2S14P2FU,H3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S14P2FU,H3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2S14P2FU,H3F part is unused and in its original packaging.
Return procedure for DF2S14P2FU,H3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2S14P2FU,H3F Tags
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