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Toshiba Semiconductor and Storage DF2S23P2CTC,L3F
- Part No.:
- DF2S23P2CTC,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2S23P2CTC,L3F.pdf
- Description:
- TVS DIODE 21VWM 35.7VC CST2C
- Quantity:
- Payment:
- Shipping:
Inventory:18,165
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Product details
Overview
DF2S23P2CTC from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for bidirectional signal-line protection in mobile device interfaces. It features a working peak reverse voltage of 21 V, ±30 kV IEC61000-4-2 contact ESD rating, 0.13 Ω typical dynamic resistance, 30 V clamping voltage at 14 A peak pulse current, and ultra-compact CST2C (1.6 mm × 0.8 mm) surface-mount package - deployed to safeguard USB, HDMI, and audio lines in smartphones and tablets.
For engineers reviewing the DF2S23P2CTC datasheet, DF2S23P2CTC pinout, DF2S23P2CTC application, or DF2S23P2CTC equivalent, key selection criteria include clamping performance under 14 A IPP, low dynamic resistance for noise suppression, IEC61000-4-2 compliance level, footprint constraints in high-density PCB layouts, and compatibility with 20 V signal rails.
Technical Context
The DF2S23P2CTC employs a silicon epitaxial planar TVS structure with snapback characteristics to achieve low clamping voltage during transient events. Its bidirectional configuration supports symmetric ESD protection on data lines without polarity dependency.
It is characterized using TLP testing (Z0 = 50 Ω, tp = 100 ns, tr = 300 ps) to extract dynamic resistance and clamp behavior across 16–30 A, ensuring robust response to IEC61000-4-2 and IEC61000-4-5 transients. The device operates within a junction temperature range of –55 °C to +150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 21 V maximum - defines max continuous reverse-bias voltage before leakage exceeds 0.1 µA; suitable for 20 V signal lines. |
| VESD (IEC61000-4-2) | ±30 kV contact - validated immunity to human-body-model ESD events without degradation. |
| VC @ IPP = 14 A | 30 V typical - clamping voltage during 8/20 µs surge; limits stress on downstream ICs. |
| RDYN | 0.13 Ω typical - low dynamic impedance ensures rapid voltage suppression during fast transients. |
| Ct @ VR = 0 V | 160 pF - total capacitance at zero bias; optimized for high-speed interfaces like USB 2.0 without signal integrity loss. |
| Package | CST2C (1.6 mm × 0.8 mm) - ultra-small two-terminal SMD footprint for space-constrained mobile PCBs. |
Pinout & Package
DF2S23P2CTC is housed in the CST2C surface-mount package - a 2-pin, bidirectional TVS diode with cathode (Pin 1) and anode (Pin 2) terminals. The package measures 1.6 mm × 0.8 mm × 0.4 mm (typ.) and weighs 1.5 mg.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Marked side) | Cathode | Connected to ground or lower-potential reference; defines conduction direction during positive transients. |
| 2 | Anode | Connected to protected signal line; enables bidirectional clamping when combined with cathode. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional snapback clamping | Enables symmetrical protection on AC-coupled or differential signal lines without polarity constraints. |
| Ultra-low RDYN (0.13 Ω) | Minimizes voltage overshoot during sub-nanosecond ESD events, preserving signal integrity. |
| 160 pF capacitance at 0 V | Supports data rates up to 480 Mbps (USB 2.0) without measurable rise-time degradation. |
| CST2C package footprint | Reduces board area by >50% vs. standard SOD-323, enabling placement adjacent to connectors in slim bezels. |
Applications
| Smartphone USB Interface Protection | Tablet HDMI Port ESD Suppression |
|---|---|
Use Scenario: Protects micro-USB Type-B and USB-C receptacle data lines (D+, D–) from user-handling ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed between connector pins and baseband processor I/O, operating as first-line transient shunt. Use Value: Limits clamped voltage to ≤30 V during ±30 kV contact discharge, preventing latch-up or gate oxide damage in 28 nm process SoCs. |
Use Scenario: Shields HDMI 1.4 TMDS channels (clock/data pairs) against ESD induced by hot-plug events or static discharge from display cables. IC Role / Device Role / Timing Role: Low-capacitance TVS array element integrated into HDMI receptacle ESD filter network, maintaining signal fidelity up to 165 MHz pixel clock. Use Value: 160 pF capacitance avoids eye-diagram closure; 30 V clamping prevents receiver input stage saturation during 8/20 µs surges. |
| Notebook PC Audio Jack Protection | Mobile SSD M.2 Key B Slot Interface Guard |
Use Scenario: Installed across 3.5 mm TRRS audio jack tip/ring/sleeve contacts to suppress ESD from headphone insertion and user touch. IC Role / Device Role / Timing Role: Standalone bidirectional ESD suppressor co-located with jack footprint, sinking transients directly to chassis ground. Use Value: 0.13 Ω RDYN ensures <100 ps response time, eliminating pop/click artifacts caused by slow-clamping devices. |
Use Scenario: Placed on PCIe x2 and SATA signals in M.2 Key B slots to protect NVMe controller I/O from handling-induced ESD during module replacement. IC Role / Device Role / Timing Role: Signal-line TVS component mounted adjacent to edge connector, providing localized clamping before traces route to host controller. Use Value: 21 V VRWM aligns with SATA 3.0 (0.5 V common-mode offset) and PCIe Gen3 (0.85 V swing) voltage margins without DC loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor SZ1.5SMC33AT3G | Unidirectional, 33 V VBR, 1500 W PPK, DO-214AB package (4.5 mm × 3.5 mm). | Suitable for higher-energy surges (IEC61000-4-5), but too large and high-capacitance (>300 pF) for high-speed mobile interfaces. | Select only for industrial power-line or low-frequency analog protection where size and bandwidth are secondary. |
| Vishay ESDBLE5.0D1W | Bidirectional, 5.0 V VRWM, 120 pF, SOD-923 package (1.0 mm × 0.6 mm), ±20 kV ESD rating. | Lower clamping voltage ideal for 3.3 V logic, but insufficient for 20 V signal rails; not rated for ±30 kV contact discharge. | Prefer for USB 3.0/PCIe Gen4 where lower capacitance and tighter voltage margin are critical, but verify system-level ESD test pass/fail margin. |
Compared with SZ1.5SMC33AT3G and ESDBLE5.0D1W, the DF2S23P2CTC uniquely balances ±30 kV ESD immunity, 21 V working voltage, 160 pF capacitance, and CST2C footprint - making it the only option qualified for compact, high-voltage, high-speed interface protection in flagship smartphones and ultrabooks.
Availability
DF2S23P2CTC is available at Aetrix Electronics and suitable for smartphone USB interface protection, tablet HDMI port ESD suppression, and notebook PC audio jack protection requiring stable component supply across high-volume consumer electronics production cycles.
Supply support for DF2S23P2CTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, miniaturization, and energy efficiency.
The DF2S23P2CTC belongs to Toshiba's CST2C-series ESD protection portfolio, engineered specifically for ultra-compact, high-performance transient suppression in next-generation mobile and portable electronics interfaces.
FAQ
What is the maximum working voltage supported by the DF2S23P2CTC?
The DF2S23P2CTC has a working peak reverse voltage (VRWM) of 21 V, meaning it can continuously block up to 21 V in reverse bias while maintaining leakage current below 0.1 µA. This makes DF2S23P2CTC suitable for protecting 20 V signal lines such as those found in automotive infotainment interfaces or industrial sensor buses, provided transient clamping margins are verified per IEC61000-4-2.
Does the DF2S23P2CTC meet IEC61000-4-2 Level 4 ESD requirements?
Yes, the DF2S23P2CTC is rated for ±30 kV contact discharge and ±30 kV air discharge per IEC61000-4-2, exceeding Level 4 (±8 kV contact / ±15 kV air). This performance is validated through standardized TLP characterization and production-tested ESD qualification, confirming DF2S23P2CTC's suitability for consumer-grade mobile devices subject to rigorous EMC certification.
What is the clamping voltage of the DF2S23P2CTC at 14 A peak pulse current?
The DF2S23P2CTC delivers a typical clamping voltage (VC) of 30 V at 14 A peak pulse current (8/20 µs waveform), with a maximum specified value of 35.7 V. This low VC ensures downstream ICs - such as USB transceivers or HDMI receivers - remain within safe absolute maximum ratings during surge events, directly supporting DF2S23P2CTC's role in high-reliability interface protection.
Can the DF2S23P2CTC be used in high-speed data lines like USB 2.0 or HDMI?
Yes, the DF2S23P2CTC exhibits 160 pF total capacitance at 0 V bias, which is compatible with USB 2.0 (480 Mbps) and HDMI 1.4 (165 MHz TMDS clock) without significant signal degradation. Its 0.13 Ω dynamic resistance further ensures minimal overshoot, making DF2S23P2CTC appropriate for placement directly at connector pins in high-speed mobile interface designs.
What package type does the DF2S23P2CTC use, and what are its dimensions?
The DF2S23P2CTC uses the CST2C package - a Toshiba-proprietary 2-pin surface-mount case measuring 1.6 mm × 0.8 mm × 0.4 mm (typ.), with a weight of 1.5 mg. This ultra-compact footprint enables DF2S23P2CTC integration in narrow-bezel smartphones and ultra-thin notebooks where board space is constrained near I/O connectors.
DF2S23P2CTC,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 21V (Max)
- Voltage - Breakdown (Min):
- 21.5V
- Voltage - Clamping (Max) @ Ipp:
- 35.7V
- Current - Peak Pulse (10/1000µs):
- 14A (8/20µs)
- Power - Peak Pulse:
- 500W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 160pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- CST2C
DF2S23P2CTC,L3F FAQ
1.How can I place an order for DF2S23P2CTC,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2S23P2CTC,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2S23P2CTC,L3F reliable?
The price and inventory of DF2S23P2CTC,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S23P2CTC,L3F is usually 5 days.
3.What payment methods are accepted for DF2S23P2CTC,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S23P2CTC,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2S23P2CTC,L3F?
DF2S23P2CTC,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2S23P2CTC,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2S23P2CTC,L3F?
For technical support, including DF2S23P2CTC,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S23P2CTC,L3F requirements.
6.How does Aetrix verify that DF2S23P2CTC,L3F is sourced from the original manufacturer or authorized distributors?
All DF2S23P2CTC,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S23P2CTC,L3F meets industry standards.
7.What is the process for return or replacement of DF2S23P2CTC,L3F?
All DF2S23P2CTC,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S23P2CTC,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2S23P2CTC,L3F part is unused and in its original packaging.
Return procedure for DF2S23P2CTC,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2S23P2CTC,L3F Tags
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