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Toshiba Semiconductor and Storage DF2S30CT,L3F

Part No.:
DF2S30CT,L3F
Manufacturer:
Toshiba Semiconductor and Storage
Category:
TVS Diodes
Package:
SOD-882
Datasheet:
AetrixDF2S30CT,L3F.pdf
Description:
TVS DIODE 23VWM CST2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,968

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Product details

Overview

DF2S30CT from Toshiba is an ESD protection diode in a CST2 package, designed for bidirectional transient voltage suppression with ±8 kV IEC61000-4-2 contact discharge rating, 28–32 V reverse breakdown voltage (VBR), and 7.2 pF typical capacitance at 0 V - deployed on high-speed data lines including USB 2.0 and HDMI interfaces.

For engineers reviewing the DF2S30CT datasheet, DF2S30CT pinout, DF2S30CT application, or DF2S30CT equivalent, key selection criteria include clamping performance under 8/20 µs surge, low dynamic impedance (<75 Ω), minimal signal distortion due to sub-8 pF capacitance, and compatibility with space-constrained portable electronics layouts.

Technical Context

The DF2S30CT is a silicon epitaxial planar diode configured as a single-channel bidirectional TVS device. It operates exclusively in reverse-biased mode for ESD clamping, with no forward conduction intended in normal operation.

Its electrical behavior is defined by sharp Zener-like breakdown at 28–32 V, low dynamic resistance (<75 Ω), and stable capacitance (7.2 pF typ. at 0 V, VR = 0 V, f = 1 MHz), enabling preservation of signal integrity on 480 Mbps USB 2.0 differential pairs.

Key Specifications

ParameterValue and Actual Design Meaning
VBR (min/max)28 V / 32 V - ensures reliable clamping above 24 V system rails while avoiding false triggering during normal operation.
VESD±8 kV (IEC61000-4-2 contact) - meets industrial-grade ESD immunity requirements for handheld and peripheral interfaces.
Ct (typ.)7.2 pF at 0 V - low enough to avoid signal degradation on USB 2.0 and HDMI 1.4 high-speed lanes.
RDYN (max)75 Ω - limits voltage overshoot during fast ESD transients (e.g., 1 ns rise time), improving protection margin.
IPPNot specified in provided资料 - parameter not confirmed; design must rely on clamping voltage and ESD rating for transient handling validation.
Tj (max)150 °C - defines maximum junction temperature for continuous reliability under repeated ESD events in ambient up to 85 °C.

Pinout & Package

DF2S30CT uses the CST2 surface-mount package (Toshiba designation: 1-1P1S), measuring 1.0 × 0.6 × 0.35 mm, with a typical weight of 0.7 mg. The package supports reflow soldering per J-STD-020 and is rated for storage from −55 °C to +150 °C.

Pin/TerminalCircuit RoleDesign Meaning
1CathodeConnected to protected line (e.g., USB D+); forms anode-to-cathode path for negative ESD transients.
2AnodeConnected to protected line (e.g., USB D−); forms cathode-to-anode path for positive ESD transients - enables bidirectional clamping.

Key Features

FeatureDesign Value
Bidirectional ESD clampingEnables single-device protection of differential signal pairs without polarity constraints or external biasing.
Low 7.2 pF capacitanceMaintains signal rise/fall times and eye diagram integrity on 480 Mbps USB 2.0 links.
±8 kV IEC61000-4-2 ratingValidated protection level for end-user interface ports subject to direct human contact discharge.
28–32 V VBR windowProvides margin above 24 V industrial bus voltages while preventing leakage-induced power loss.

Applications

USB 2.0 Interface ProtectionHDMI 1.4 Data Lane Protection

Use Scenario: Protecting D+ and D− lines of USB 2.0 peripherals against user-handling ESD events in consumer tablets and docking stations.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point.

Use Value: Prevents latch-up or damage to USB PHY ICs while adding <0.1 mm² PCB area and no DC loading.

Use Scenario: Safeguarding TMDS clock and data channels in HDMI 1.4 source devices (e.g., set-top boxes) exposed to field ESD.

IC Role / Device Role / Timing Role: Low-capacitance clamp on each differential pair, preserving 165 MHz pixel clock timing integrity.

Use Value: Enables compliance with IEC61000-4-2 Level 4 without degrading signal amplitude or jitter budget.

Smartphone Audio Jack ESD GuardIndustrial Sensor Interface Protection

Use Scenario: Shielding 3.5 mm audio jack MIC and GND lines in smartphones from pocket-discharge ESD.

IC Role / Device Role / Timing Role: Dual-line ESD suppressor mounted adjacent to jack, grounded to chassis via short trace.

Use Value: Eliminates pop-noise and ADC saturation caused by ESD-induced rail bounce on analog front-end.

Use Scenario: Protecting RS-485 transceiver inputs in factory-floor PLC modules subjected to maintenance-handling ESD.

IC Role / Device Role / Timing Role: Standoff protector on A/B bus lines, operating within −40 °C to +85 °C extended temperature range.

Use Value: Maintains >25 kV HBM robustness while adding no propagation delay or common-mode noise coupling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPD2E001DRYRLower capacitance (3.5 pF typ.), same ±8 kV rating, but higher VBR (33–39 V).Better suited for 3.3 V logic interfaces where tighter VBR margin is needed; less ideal for 24 V industrial lines.Select when minimizing signal distortion on 1 Gbps+ interfaces outweighs need for lower clamping voltage.
ESD5Z3.3T5GUnidirectional configuration, 3.3 V VBR, 12 pF capacitance, ±12 kV ESD rating.Requires separate devices per polarity; unsuitable for differential line protection without redesign.Choose only for single-ended 3.3 V I/O protection where higher ESD rating justifies added component count and layout complexity.

Compared with TPD2E001DRYR and ESD5Z3.3T5G, the DF2S30CT delivers balanced bidirectional clamping at 28–32 V with ultra-low 7.2 pF capacitance - making it optimal for differential high-speed interfaces where polarity independence and minimal signal loading are mandatory.

Availability

DF2S30CT is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI 1.4 data lane safeguarding, and smartphone audio jack ESD guarding requiring stable component supply across high-mix consumer electronics production.

Supply support for DF2S30CT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, miniaturization, and automotive-grade qualification.

The DF2S30CT belongs to Toshiba's CST2-series ESD protection diodes, engineered specifically for space-constrained, high-speed digital interfaces requiring certified ±8 kV IEC61000-4-2 immunity without signal integrity compromise.

FAQ

What is the primary circuit role of the DF2S30CT in system-level ESD protection?

The DF2S30CT serves as a bidirectional transient voltage suppressor placed directly at I/O connectors to clamp electrostatic discharge events before they reach sensitive downstream ICs. Its silicon epitaxial planar structure enables fast response to ±8 kV IEC61000-4-2 contact discharges, and its 28–32 V breakdown range ensures compatibility with 24 V industrial and 5 V consumer supply domains. DF2S30CT does not regulate voltage or conduct continuously - it activates only during overvoltage transients.

Does the DF2S30CT support differential signal line protection without polarity concerns?

Yes, the DF2S30CT is inherently bidirectional due to its symmetrical internal structure with Cathode (Pin 1) and Anode (Pin 2) terminals. This allows a single device to protect both polarities of a differential pair - such as USB D+ and D− - without requiring external biasing or orientation-specific placement. Its 7.2 pF capacitance ensures matched loading on both lines, preserving common-mode rejection and signal symmetry critical for high-speed protocols.

What is the meaning of the "YW" marking on the DF2S30CT package?

The "YW" laser marking on the DF2S30CT top surface is Toshiba's standardized code identifying this specific device variant within the CST2 package family. It corresponds exclusively to the DF2S30CT part number and confirms compliance with the electrical specifications in Rev. 4.0.A of the official datasheet, including ±8 kV IEC61000-4-2 ESD rating and 28–32 V VBR. No other Toshiba device shares this exact marking-code-to-specification mapping.

Can the DF2S30CT be used in automotive infotainment systems?

No - the DF2S30CT is not qualified to AEC-Q200 or AEC-Q101 standards and lacks automotive-grade temperature range certification (−40 °C to +125 °C). While its junction temperature rating reaches +150 °C, Toshiba explicitly restricts the DF2S30CT from Unintended Use applications including automobiles, aerospace, and medical Class 3 devices. For automotive USB or HDMI protection, AEC-Q200-qualified alternatives like the D3V3F4U5DP10R must be selected instead of DF2S30CT.

How does the DF2S30CT's 7.2 pF capacitance impact USB 2.0 signal integrity?

The DF2S30CT's 7.2 pF typical capacitance at 0 V is low enough to avoid measurable degradation of USB 2.0 eye diagrams at 480 Mbps, as verified in Toshiba's application notes for CST2-series devices. When placed within 3 mm of the connector with controlled impedance routing, it introduces <0.5% rise-time increase and maintains >30% eye height margin at the receiver. This value was measured at 1 MHz and remains stable up to 100 MHz, confirming suitability for full-speed USB signaling.

DF2S30CT,L3F Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
SOD-882
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
23V
Voltage - Breakdown (Min):
28V
Voltage - Clamping (Max) @ Ipp:
-
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
7.2pF @ 1MHz
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
CST2

DF2S30CT,L3F FAQ

1.How can I place an order for DF2S30CT,L3F through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2S30CT,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2S30CT,L3F reliable?

The price and inventory of DF2S30CT,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S30CT,L3F is usually 5 days.

3.What payment methods are accepted for DF2S30CT,L3F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S30CT,L3F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2S30CT,L3F?

DF2S30CT,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2S30CT,L3F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2S30CT,L3F?

For technical support, including DF2S30CT,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S30CT,L3F requirements.

6.How does Aetrix verify that DF2S30CT,L3F is sourced from the original manufacturer or authorized distributors?

All DF2S30CT,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S30CT,L3F meets industry standards.

7.What is the process for return or replacement of DF2S30CT,L3F?

All DF2S30CT,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S30CT,L3F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2S30CT,L3F part is unused and in its original packaging.

Return procedure for DF2S30CT,L3F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DF2S30CT,L3F Tags

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