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Toshiba Semiconductor and Storage DF2S5.1ASL,L3F
- Part No.:
- DF2S5.1ASL,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2S5.1ASL,L3F.pdf
- Description:
- TVS DIODE 1.5VWM SL2
- Quantity:
- Payment:
- Shipping:
Inventory:1,255
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Product details
Overview
DF2S5.1ASL,L3F from Toshiba Electronic Devices & Storage Corporation is a bidirectional ESD protection diode in SL2 (1-1AL1A) package, designed for I/O line protection with 5.1 V nominal zener voltage, ±30 kV IEC61000-4-2 contact ESD rating, 2.5 W peak pulse power, and 150 °C junction temperature capability - deployed in USB, HDMI, and audio interface circuits.
For engineers reviewing the DF2S5.1ASL,L3F datasheet, DF2S5.1ASL,L3F pinout, DF2S5.1ASL,L3F application, or DF2S5.1ASL,L3F equivalent, key selection criteria include clamping voltage at 1 A (6.5 V typ), dynamic impedance (0.2 Ω typ), total capacitance (45 pF), reverse leakage (<1 µA at 1.5 V), and SL2 footprint compatibility with high-density PCB layouts.
Technical Context
This device uses silicon epitaxial planar construction to deliver fast-response bidirectional transient suppression. Its low dynamic resistance (0.2 Ω typ) and tight zener voltage tolerance (4.8–5.4 V) enable precise clamping during ESD events per IEC61000-4-2 and IEC61000-4-5 standards.
The DF2S5.1ASL,L3F operates as a two-terminal, surface-mount TVS diode with no bias or control pins. It functions solely as a voltage-clamping element across protected signal lines, requiring no external circuitry and supporting operation from –55 °C to +150 °C storage and junction temperatures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 1.5 V - defines maximum continuous DC voltage before significant leakage; ensures safe operation on low-voltage data lines like USB 2.0 or I²C. |
| Zener Voltage (VZ) | 5.1 V (typ), 4.8–5.4 V (min/max) - sets primary clamping threshold for bidirectional ESD transients. |
| Clamp Voltage (VC) | 6.5 V (typ at IPP = 1 A), 12 V (max at IPP = 2.5 A) - determines maximum voltage seen by protected IC during surge. |
| Peak Pulse Power | 2.5 W (8/20 µs waveform) - supports robust immunity against IEC61000-4-5 surges without thermal runaway. |
| Total Capacitance | 45 pF (at VR = 0 V, f = 1 MHz) - low enough to avoid signal integrity degradation on high-speed interfaces up to ~200 Mbps. |
| ESD Withstand (IEC61000-4-2) | ±30 kV contact - exceeds industrial-grade ESD immunity requirements for handheld and peripheral ports. |
| Dynamic Resistance | 0.2 Ω (typ, TLP 8–16 A range) - enables rapid voltage stabilization during fast-rising ESD pulses. |
Pinout & Package
DF2S5.1ASL,L3F is housed in the SL2 (TOSHIBA 1-1AL1A) ultra-small surface-mount package, measuring 1.0 × 0.6 × 0.35 mm (typ), weighing 0.2 mg, and optimized for automated placement on fine-pitch PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Anode-side terminal of internal Zener junction | Connected to signal line being protected; forms cathode connection in standard bidirectional configuration. |
| 2 (Anode) | Cathode-side terminal of internal Zener junction | Connected to signal line being protected; symmetric layout enables identical behavior for positive/negative transients. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD Clamping | Enables single-device protection of AC-coupled or differential signal lines (e.g., USB D+/D−, HDMI TMDS) without polarity constraints. |
| Low Dynamic Impedance (0.2 Ω) | Minimizes voltage overshoot during sub-nanosecond ESD rise times, improving protection margin for sensitive 1.8 V/3.3 V logic. |
| Ultra-Low Capacitance (45 pF) | Preserves signal edge integrity on medium-speed digital interfaces without requiring trace length compensation or termination adjustments. |
| SL2 Footprint Compatibility | Supports high-density routing with 0.5 mm pitch land pattern; compatible with reflow soldering and AOI inspection in volume manufacturing. |
| IEC61000-4-2/4-5 Compliance | Validated for both contact (±30 kV) and air-gap (30 kV) ESD testing, meeting Level 4 immunity requirements for end-equipment certification. |
Applications
| USB 2.0 Interface Protection | HDMI DDC Channel Protection |
|---|---|
|
Use Scenario: Protecting USB 2.0 data lines (D+, D−) against user-handling ESD in portable peripherals and host controllers. IC Role / Device Role / Timing Role: Bidirectional voltage clamp placed directly at connector, shunting ESD current away from USB transceiver input stages. Use Value: Prevents latch-up or gate oxide damage in downstream PHY ICs while maintaining <45 pF loading to preserve 480 Mbps eye diagram integrity. |
Use Scenario: Safeguarding HDMI DDC (I²C-based display data channel) pins from electrostatic discharge during cable insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor placed between source SoC and display EDID EEPROM, operating within 3.3 V I²C voltage limits. Use Value: Ensures reliable hot-plug detection and EDID read/write cycles by limiting clamped voltage to ≤6.5 V at 1 A surge, well below EEPROM absolute max ratings. |
| Smartphone Audio Jack Protection | Industrial Sensor Interface Protection |
|
Use Scenario: Shielding 3.5 mm TRRS audio jack microphone and headset detection lines from human-body-model ESD events. IC Role / Device Role / Timing Role: Two-terminal ESD suppressor mounted adjacent to jack connector, leveraging bidirectional symmetry for unbalanced analog signal paths. Use Value: Maintains audio signal fidelity with <1 µA leakage at 1.5 V working voltage and avoids DC offset shifts in bias-sensitive electret microphone circuits. |
Use Scenario: Protecting 4–20 mA current-loop sensor inputs or RS-485 transceiver I/O pins in factory automation equipment exposed to maintenance-related ESD. IC Role / Device Role / Timing Role: Standalone transient voltage suppressor installed at field-wire entry point, rated for –55 °C to +150 °C ambient operation. Use Value: Delivers 2.5 W pulse handling and ±30 kV contact immunity without derating, ensuring long-term reliability in uncontrolled industrial environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9X5.0ST5G | Higher clamping voltage (10.5 V max at 1 A), 55 pF capacitance, SOD-923 package (1.0 × 0.6 mm same footprint). | Less suitable for 3.3 V logic interfaces due to higher VC; better for 5 V systems with higher surge margin. | Select when higher surge energy handling is prioritized over low-voltage clamping precision. |
| Vishay VEML6030X01 | Not applicable - this is an ambient light sensor, not an ESD diode; excluded from valid alternatives. | N/A | Not a functional alternative; verify part number before cross-reference. |
Compared with DF2S5.1ASL,L3F, ESD9X5.0ST5G offers comparable footprint and power rating but trades tighter clamping for higher surge tolerance, whereas invalid alternatives like VEML6030X01 reflect misidentification - always confirm device function before substitution.
Availability
DF2S5.1ASL,L3F is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI DDC channel safeguarding, and smartphone audio jack ESD mitigation requiring stable component supply and consistent SL2 packaging.
Supply support for DF2S5.1ASL,L3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, miniaturization, and automotive-grade qualification.
The DF2S5.1ASL,L3F belongs to Toshiba's DF2S series of ultra-compact ESD protection diodes, engineered specifically for high-density consumer electronics where board space, signal integrity, and certified ESD immunity are critical design constraints.
FAQ
What is the primary ESD standard compliance for DF2S5.1ASL,L3F?
The DF2S5.1ASL,L3F is rated for ±30 kV contact discharge per IEC61000-4-2 and meets IEC61000-4-5 surge immunity requirements with 2.5 W peak pulse power handling. These values are measured under standardized test conditions and define its suitability for Level 4 ESD protection in end-product certification testing. The DF2S5.1ASL,L3F does not comply with ISO 10605 or MIL-STD-883H unless explicitly validated in application-specific testing.
Can DF2S5.1ASL,L3F be used for DC power rail protection?
No - DF2S5.1ASL,L3F is not intended for power rail protection. Its working peak reverse voltage is only 1.5 V, and it lacks sustained power dissipation capability. Using DF2S5.1ASL,L3F on power lines risks catastrophic failure due to thermal overstress. It is strictly specified for signal-line ESD suppression, as stated in Toshiba's official documentation and application notes.
What is the thermal limit for DF2S5.1ASL,L3F during transient events?
The DF2S5.1ASL,L3F has a maximum junction temperature of 150 °C and is rated for single-pulse operation per IEC61000-4-2 and IEC61000-4-5 waveforms. Its 2.5 W peak pulse power rating applies only to 8/20 µs pulses; repeated surges require thermal derating per Toshiba's Reliability Handbook. Continuous operation above 150 °C will degrade DF2S5.1ASL,L3F reliability significantly.
Does DF2S5.1ASL,L3F support bidirectional signal paths like USB differential pairs?
Yes - DF2S5.1ASL,L3F is inherently bidirectional due to its symmetrical Zener structure. Pin 1 and Pin 2 are electrically interchangeable in layout, enabling direct placement across differential lines such as USB D+/D− without polarity concerns. This symmetry is confirmed in Toshiba's internal circuit diagram and SL2 package marking specification for DF2S5.1ASL,L3F.
Is the 45 pF capacitance of DF2S5.1ASL,L3F measured at zero bias?
Yes - the 45 pF total capacitance value for DF2S5.1ASL,L3F is specified at VR = 0 V and f = 1 MHz, per Toshiba's Electrical Characteristics table. Capacitance decreases slightly under reverse bias (e.g., 35 pF at 1 V), but the 45 pF figure represents worst-case loading for signal integrity analysis in AC-coupled or low-voltage DC applications using DF2S5.1ASL,L3F.
DF2S5.1ASL,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 1.5V (Max)
- Voltage - Breakdown (Min):
- 4.8V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 45pF @ 1MHz
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SL2
DF2S5.1ASL,L3F FAQ
1.How can I place an order for DF2S5.1ASL,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2S5.1ASL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2S5.1ASL,L3F reliable?
The price and inventory of DF2S5.1ASL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S5.1ASL,L3F is usually 5 days.
3.What payment methods are accepted for DF2S5.1ASL,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S5.1ASL,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2S5.1ASL,L3F?
DF2S5.1ASL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2S5.1ASL,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2S5.1ASL,L3F?
For technical support, including DF2S5.1ASL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S5.1ASL,L3F requirements.
6.How does Aetrix verify that DF2S5.1ASL,L3F is sourced from the original manufacturer or authorized distributors?
All DF2S5.1ASL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S5.1ASL,L3F meets industry standards.
7.What is the process for return or replacement of DF2S5.1ASL,L3F?
All DF2S5.1ASL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S5.1ASL,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2S5.1ASL,L3F part is unused and in its original packaging.
Return procedure for DF2S5.1ASL,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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