My Inquiry
My Account
Toshiba Semiconductor and Storage DF2S5.6CT,L3F
- Part No.:
- DF2S5.6CT,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SOD-882
- Datasheet:
-
DF2S5.6CT,L3F.pdf
- Description:
- TVS DIODE 3.5VWM CST2
- Quantity:
- Payment:
- Shipping:
Inventory:42,517
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF2S5.6CT from Toshiba is a silicon epitaxial planar ESD protection diode designed for bidirectional transient suppression in high-speed data lines. It features a 5.6 V nominal Zener voltage, ±30 kV IEC61000-4-2 contact ESD rating, 40 pF typical capacitance at 0 V, and CST2 (1-1P1S) surface-mount package with anode-cathode-terminal configuration. It is deployed in USB 2.0, HDMI, and audio jack interfaces to prevent electrostatic damage.
For engineers reviewing the DF2S5.6CT datasheet, DF2S5.6CT pinout, DF2S5.6CT application, or DF2S5.6CT equivalent, key selection criteria include clamping voltage under peak pulse current, dynamic impedance, reverse leakage at operating bias, junction temperature limit, and package land pattern compatibility with high-density PCB layouts.
Technical Context
The DF2S5.6CT operates as a bidirectional Zener-type TVS diode optimized for low-capacitance signal-line protection. Its silicon epitaxial planar structure enables fast response to ESD transients while maintaining stable breakdown behavior across temperature.
It is rated for ±30 kV IEC61000-4-2 contact discharge with no device damage, supports 150 °C maximum junction temperature, and exhibits 30 Ω typical dynamic resistance at 5 mA test current - critical for minimizing voltage overshoot during fast-rising ESD events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener voltage (VZ) | 5.6 V nominal at IZ = 5 mA - defines primary clamping threshold for low-voltage signal rails. |
| Dynamic resistance (ZZ) | 30 Ω typical at IZ = 5 mA - determines voltage rise under transient current, directly impacting clamping performance. |
| Total capacitance (Ct) | 40 pF typical at VR = 0 V, f = 1 MHz - ensures minimal signal distortion on high-speed interfaces like USB 2.0. |
| Reverse leakage (IR) | ≤1.0 µA max at VR = 3.5 V - guarantees negligible DC loading on protected I/O lines. |
| ESD withstand (IEC61000-4-2) | ±30 kV contact discharge - validated immunity level for end-equipment compliance testing. |
| Junction temperature (Tj) | 150 °C maximum - sets thermal derating boundary for continuous operation near hot components. |
Pinout & Package
DF2S5.6CT uses the CST2 (Toshiba 1-1P1S) ultra-small surface-mount package - 1.0 mm × 0.6 mm × 0.35 mm, 0.7 mg typical weight - optimized for space-constrained portable electronics.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Connected to system ground or low-impedance return path; forms cathode-side of bidirectional Zener pair. |
| 2 | Anode | Connected to protected signal line; completes bidirectional conduction path with Pin 1 during positive/negative ESD events. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD clamping | Enables symmetric protection of AC-coupled or differential signal lines without polarity constraints. |
| Low 40 pF capacitance | Maintains signal integrity on 480 Mbps USB 2.0 and other high-speed digital interfaces. |
| ±30 kV IEC61000-4-2 rating | Exceeds industrial and consumer ESD immunity requirements without external circuitry. |
| 150 °C junction temperature rating | Supports placement near thermally active components (e.g., PMICs, power inductors) in compact layouts. |
Applications
| USB 2.0 Data Lines | HDMI Hot-Plug Detection |
|---|---|
Use Scenario: Protecting D+ and D− pins of USB 2.0 connectors against user-handling ESD events during plug/unplug cycles. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector footprint. Use Value: 40 pF capacitance avoids signal rise-time degradation; ±30 kV rating ensures pass/fail compliance in system-level ESD testing. | Use Scenario: Safeguarding HDMI HPD (Hot-Plug Detect) line from ESD during cable insertion into displays or source devices. IC Role / Device Role / Timing Role: Low-leakage (≤1 µA) clamping diode between HPD and ground, preserving DC logic levels. Use Value: 5.6 V Zener voltage aligns with standard 5 V HPD pull-up, preventing false disconnect detection during transients. |
| Smartphone Audio Jacks | Industrial Sensor Interface Lines |
Use Scenario: Shielding microphone and headset detection lines in 3.5 mm TRRS jacks from human-body-model ESD. IC Role / Device Role / Timing Role: Space-optimized ESD shunt mounted adjacent to jack contacts on thin PCBs. Use Value: CST2 package (1.0 × 0.6 mm) fits tight mechanical clearances; 150 °C Tj rating accommodates proximity to battery management ICs. | Use Scenario: Protecting analog output lines (e.g., 4–20 mA current loop sensors) from field-installed ESD in factory environments. IC Role / Device Role / Timing Role: Standalone Zener clamp on sensor transmitter outputs, independent of system controller. Use Value: 30 Ω dynamic resistance limits clamping voltage overshoot to safe levels for downstream op-amps and ADC inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NZQ2S5.6T5G | Same 5.6 V VZ, but 55 pF typical capacitance; SOD-923 package (1.0 × 0.6 mm, same footprint). | Higher capacitance may affect >200 Mbps signal integrity; suitable where layout allows minor timing margin. | Select when sourcing flexibility is prioritized and signal bandwidth ≤100 Mbps. |
| Vishay ESDBLE5.6D1W | 5.6 V VZ, 30 pF typical, but rated only to ±20 kV IEC61000-4-2 contact. | Limited ESD margin requires additional system-level hardening for ±30 kV compliance. | Choose where cost sensitivity outweighs full IEC61000-4-2 certification requirement. |
Compared with NZQ2S5.6T5G and ESDBLE5.6D1W, the DF2S5.6CT delivers superior ESD margin (±30 kV) with lower capacitance than the ON part and higher robustness than the Vishay part - making it optimal for certified USB/HDMI interface protection where signal fidelity and compliance are co-prioritized.
Availability
DF2S5.6CT is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI hot-plug detection circuits, and smartphone audio jack ESD hardening requiring stable component supply and long-term production continuity.
Supply support for DF2S5.6CT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, miniaturization, and automotive-grade qualification.
The DF2S5.6CT belongs to Toshiba's CST2-series ESD protection diodes, engineered specifically for ultra-compact, high-fidelity signal-line protection in portable and consumer electronics.
FAQ
What is the primary function of the DF2S5.6CT in circuit design?
The DF2S5.6CT serves as a bidirectional ESD protection diode, clamping transient voltages on signal lines to prevent damage from electrostatic discharge. Its 5.6 V Zener voltage, ±30 kV IEC61000-4-2 rating, and 40 pF capacitance make the DF2S5.6CT especially suited for safeguarding high-speed, low-voltage interfaces such as USB 2.0 and HDMI without compromising signal integrity.
Does the DF2S5.6CT support unidirectional or bidirectional ESD protection?
The DF2S5.6CT provides bidirectional ESD protection due to its symmetrical Zener structure, enabling clamping of both positive and negative transients relative to ground. This characteristic is confirmed by its ±30 kV IEC61000-4-2 contact discharge rating and anode-cathode terminal configuration - essential for protecting AC-coupled or differential signal paths in the DF2S5.6CT application.
What is the maximum junction temperature specification for the DF2S5.6CT?
The DF2S5.6CT has a maximum junction temperature (Tj) of 150 °C, as specified in Toshiba's official datasheet Rev. 4.0.A. This rating allows the DF2S5.6CT to operate reliably in thermally demanding environments - for example, near power management ICs or in sealed enclosures - provided appropriate PCB copper area and thermal relief are implemented per the recommended land pattern.
Can the DF2S5.6CT be used for voltage regulation or overvoltage protection beyond ESD?
No - the DF2S5.6CT is explicitly designed and qualified only for ESD protection, not for voltage regulation or sustained overvoltage conditions. Toshiba's datasheet states: "This product is designed for protection against electrostatic discharge (ESD) and is not intended for any other purpose, including, but not limited to, voltage regulation." Continuous DC or surge stress outside IEC61000-4-2 parameters may degrade or destroy the DF2S5.6CT.
What package type does the DF2S5.6CT use, and what are its dimensions?
The DF2S5.6CT uses the CST2 package (Toshiba designation: 1-1P1S), measuring 1.0 mm × 0.6 mm × 0.35 mm with a typical weight of 0.7 mg. Its two-terminal surface-mount construction and standardized land pattern support automated assembly in high-density portable electronics - a key mechanical attribute of the DF2S5.6CT for space-constrained designs.
DF2S5.6CT,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SOD-882
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.5V
- Voltage - Breakdown (Min):
- 5.3V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 40pF @ 1MHz
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- CST2
DF2S5.6CT,L3F FAQ
1.How can I place an order for DF2S5.6CT,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2S5.6CT,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2S5.6CT,L3F reliable?
The price and inventory of DF2S5.6CT,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S5.6CT,L3F is usually 5 days.
3.What payment methods are accepted for DF2S5.6CT,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S5.6CT,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2S5.6CT,L3F?
DF2S5.6CT,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2S5.6CT,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2S5.6CT,L3F?
For technical support, including DF2S5.6CT,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S5.6CT,L3F requirements.
6.How does Aetrix verify that DF2S5.6CT,L3F is sourced from the original manufacturer or authorized distributors?
All DF2S5.6CT,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S5.6CT,L3F meets industry standards.
7.What is the process for return or replacement of DF2S5.6CT,L3F?
All DF2S5.6CT,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S5.6CT,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2S5.6CT,L3F part is unused and in its original packaging.
Return procedure for DF2S5.6CT,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2S5.6CT,L3F Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
