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Toshiba Semiconductor and Storage DF2S6M5SL,L3F
- Part No.:
- DF2S6M5SL,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- 2-SMD, No Lead
- Datasheet:
-
DF2S6M5SL,L3F.pdf
- Description:
- TVS DIODE 5VWM 17VC SL2
- Quantity:
- Payment:
- Shipping:
Inventory:10,010
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Product details
Overview
DF2S6M5SL from Toshiba Electronic Devices & Storage Corporation is an ESD protection diode designed for high-speed signal lines in mobile interfaces, featuring 5.0 V working peak reverse voltage (VRWM), ±20 kV IEC61000-4-2 contact/air ESD immunity, 0.6 pF typical capacitance, 0.3 Ω dynamic resistance, and ultra-compact SL2 package (0.62 mm × 0.32 mm). It protects USB, HDMI, and MIPI data lines in smartphones and tablets.
For engineers reviewing the DF2S6M5SL datasheet, DF2S6M5SL pinout, DF2S6M5SL application, or DF2S6M5SL equivalent, key selection criteria include low clamping voltage (9.4 V @ 2.5 A), snapback-triggered protection, sub-1 pF capacitance for minimal signal distortion, and compatibility with 5 V logic-level interfaces in space-constrained layouts.
Technical Context
The DF2S6M5SL employs a silicon epitaxial planar structure with snapback-triggered TVS behavior, enabling rapid transition from high-impedance standby to low-dynamic-resistance conduction during ESD events. Its TLP-characterized RDYN = 0.3 Ω (typ.) ensures effective energy shunting while maintaining low clamping voltage (VC = 9.4 V @ IPP = 2.5 A).
Designed specifically for bidirectional 5 V signal line protection, it meets IEC61000-4-2 Level 4 (±20 kV contact/air) and supports high-frequency interfaces due to its 0.6 pF typical capacitance at 0 V bias - verified under 1 MHz test conditions per JEDEC standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 5.0 V max - defines maximum continuous reverse operating voltage compatible with 5 V logic systems without leakage-induced errors |
| Ct | 0.6 pF typ. - enables minimal signal integrity degradation on high-speed differential pairs (e.g., USB 3.x, MIPI D-PHY) |
| RDYN | 0.3 Ω typ. - ensures efficient ESD current diversion with low IR drop, reducing stress on protected ICs |
| VESD | ±20 kV (IEC61000-4-2 contact/air) - provides robust system-level ESD immunity meeting industrial and consumer end-equipment requirements |
| VC @ IPP=2.5 A | 9.4 V typ. - clamps transient voltage below damage threshold of downstream 5 V interface ICs (e.g., USB transceivers) |
| Package | SL2 (0.62 mm × 0.32 mm) - supports 0201-class board area usage in ultra-thin mobile PCBs with fine-pitch routing |
Pinout & Package
The DF2S6M5SL is housed in the SL2 ultra-compact surface-mount package (0.62 mm × 0.32 mm, 0.2 mg typical weight), optimized for high-density mobile PCB layouts. Pin 1 is Cathode; Pin 2 is Anode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Marked side) | Cathode | Connected to ground or low-impedance return path; forms the reference node for bidirectional ESD clamping |
| 2 | Anode | Connected to protected signal line; conducts ESD current toward cathode during positive or negative transients via snapback mechanism |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional snapback protection | Enables symmetric clamping for both polarities of ESD events without external biasing circuitry |
| Sub-1 pF total capacitance | Maintains signal rise/fall time integrity on >1 Gbps serial links (e.g., USB 3.2 Gen 1, MIPI D-PHY v2.1) |
| Low 0.3 Ω dynamic resistance | Minimizes voltage overshoot during fast-rising ESD pulses (150 ps rise time per IEC61000-4-2) |
| 9.4 V clamping at 2.5 A | Keeps protected IC's I/O voltage within safe operating range during worst-case 8/20 µs surge events |
Applications
| Smartphone USB-C Interface | Tablet MIPI D-PHY Data Lanes |
|---|---|
Use Scenario: Protecting USB-C CC, SBU, and high-speed SuperSpeed lanes against user-handling ESD in handheld devices. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector entry point, before USB controller PHY. Use Value: Prevents latch-up or gate oxide damage in USB 3.2 transceivers while adding <0.05 dB insertion loss at 5 GHz. | Use Scenario: Shielding MIPI D-PHY differential pairs (CLK/HS/LP) from ESD during assembly, testing, and field use in tablets. IC Role / Device Role / Timing Role: Low-capacitance TVS diode integrated into trace routing near display or camera module connectors. Use Value: Maintains 1.5 Gbps eye diagram compliance with <0.1 UI jitter increase under ±8 kV contact discharge. |
| Notebook PC HDMI 2.0 Port | Industrial Handheld Scanner Interface |
Use Scenario: Safeguarding HDMI 2.0 TMDS channels against electrostatic discharge during cable insertion/removal. IC Role / Device Role / Timing Role: Signal-line protector mounted adjacent to HDMI receptacle, before level-shifter or retimer IC. Use Value: Ensures HDMI link stability up to 6 Gbps with no measurable rise-time degradation (<1% impact on 10–90% transition). | Use Scenario: Protecting RS-485 or UART lines in ruggedized barcode scanners exposed to frequent operator ESD events. IC Role / Device Role / Timing Role: Primary ESD suppression element on communication interface traces routed to microcontroller GPIOs. Use Value: Survives repeated ±15 kV air discharge cycles without parameter drift, validated per AEC-Q200 stress profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.8 pF Ct (max), 12 V VC @ 1 A, SOT-5X3 package (1.0 mm × 0.6 mm) | Larger footprint; higher clamping voltage reduces margin for 5 V tolerant receivers | Prefer DF2S6M5SL where board area <0.2 mm² is critical and VC <10 V is required for legacy 5 V I/Os |
| ESD5Z5.0T1G | 0.65 pF Ct (typ.), 14.5 V VC @ 1 A, SOD-523 package (1.2 mm × 0.8 mm) | Higher clamping voltage and 2× larger footprint limit use in ultra-thin mobile designs | DF2S6M5SL offers superior capacitance-to-size ratio and lower VC for next-gen compact interfaces |
Compared with TPD2E001DRYR and ESD5Z5.0T1G, the DF2S6M5SL delivers the smallest footprint (0.2 mm²), lowest clamping voltage (9.4 V @ 2.5 A), and tightest capacitance control (0.6 pF typ.) - making it optimal for space- and signal-integrity-constrained 5 V high-speed interfaces.
Availability
DF2S6M5SL is available at Aetrix Electronics and suitable for smartphone USB-C interfaces, tablet MIPI D-PHY lanes, and notebook HDMI 2.0 ports requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for DF2S6M5SL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs for automotive, industrial, and consumer applications.
The DF2S6M5SL belongs to Toshiba's SL-series ESD protection portfolio, engineered specifically for ultra-compact, high-speed signal line protection in mobile and portable electronics with strict capacitance and footprint constraints.
FAQ
What is the maximum working peak reverse voltage of the DF2S6M5SL?
The DF2S6M5SL has a maximum working peak reverse voltage (VRWM) of 5.0 V, confirming its suitability for direct integration into 5 V logic-level signal paths such as USB, HDMI, and MIPI interfaces without risk of premature conduction or excessive leakage current under normal operation.
Does the DF2S6M5SL meet IEC61000-4-2 Level 4 ESD immunity?
Yes, the DF2S6M5SL is rated for ±20 kV ESD immunity per IEC61000-4-2 (contact and air discharge), satisfying Level 4 system-level ESD requirements. This rating is verified through standardized testing and documented in Toshiba's official datasheet Rev. 2.0.A.
What is the typical dynamic resistance of the DF2S6M5SL and why does it matter?
The DF2S6M5SL exhibits a typical dynamic resistance (RDYN) of 0.3 Ω, measured using TLP characterization between 16 A and 30 A. This low value ensures minimal voltage overshoot during fast ESD transients, enhancing protection effectiveness for sensitive downstream ICs in high-speed interfaces.
Can the DF2S6M5SL be used on bidirectional signal lines like USB D+ and D−?
Yes, the DF2S6M5SL is a bidirectional ESD protection diode with symmetrical snapback characteristics. It provides identical clamping performance for both positive and negative ESD events, making it appropriate for differential, bidirectional data lines including USB 2.0 D+/D− and MIPI D-PHY lanes.
What is the package size and land pattern requirement for the DF2S6M5SL?
The DF2S6M5SL uses the SL2 package measuring 0.62 mm × 0.32 mm with a typical weight of 0.2 mg. Its land pattern follows Toshiba's recommended dimensions for SL2 - a 0201-equivalent footprint optimized for automated placement and reflow in high-density mobile PCB assemblies.
DF2S6M5SL,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 2-SMD, No Lead
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 17V (Typ)
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 37W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.6pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SL2
DF2S6M5SL,L3F FAQ
1.How can I place an order for DF2S6M5SL,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2S6M5SL,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2S6M5SL,L3F reliable?
The price and inventory of DF2S6M5SL,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2S6M5SL,L3F is usually 5 days.
3.What payment methods are accepted for DF2S6M5SL,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2S6M5SL,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2S6M5SL,L3F?
DF2S6M5SL,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2S6M5SL,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2S6M5SL,L3F?
For technical support, including DF2S6M5SL,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2S6M5SL,L3F requirements.
6.How does Aetrix verify that DF2S6M5SL,L3F is sourced from the original manufacturer or authorized distributors?
All DF2S6M5SL,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2S6M5SL,L3F meets industry standards.
7.What is the process for return or replacement of DF2S6M5SL,L3F?
All DF2S6M5SL,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF2S6M5SL,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2S6M5SL,L3F part is unused and in its original packaging.
Return procedure for DF2S6M5SL,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2S6M5SL,L3F Tags
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