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Toshiba Semiconductor and Storage DF3A5.6FU(TE85L,F)

Part No.:
DF3A5.6FU(TE85L,F)
Manufacturer:
Toshiba Semiconductor and Storage
Category:
TVS Diodes
Package:
SC-70, SOT-323
Datasheet:
AetrixDF3A5.6FU(TE85L,F).pdf
Description:
TVS DIODE 2.5VWM USM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,296

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Product details

Overview

DF3A5.6FU(TE85L,F) from TOSHIBA is a dual-channel ESD protection diode array designed for high-speed data lines, featuring 5.6 V Zener voltage (VZ), ±30 kV IEC61000-4-2 contact discharge immunity, and 65 pF terminal capacitance at 0 V/1 MHz - deployed in USB 2.0, HDMI, and audio interface protection circuits.

For engineers reviewing the DF3A5.6FU(TE85L,F) datasheet, DF3A5.6FU(TE85L,F) pinout, DF3A5.6FU(TE85L,F) application, or DF3A5.6FU(TE85L,F) equivalent, key selection criteria include ESD immunity level, low clamping voltage under transient stress, channel-to-channel isolation, capacitance budget for signal integrity, and ultra-compact SOT-323 (SC-70) package compatibility with high-density PCB layouts.

Technical Context

This device implements two independent Zener-based ESD clamps in a single SOT-323 package, each with cathode-anode configuration optimized for bidirectional transient suppression. It operates exclusively as an ESD protection element - not rated for continuous Zener regulation - and requires no bias circuitry, relying on intrinsic avalanche breakdown at ≥5.3 V to shunt electrostatic transients.

The 65 pF capacitance (measured at 0 V, 1 MHz) enables use on signals up to ~200 Mbps without significant edge degradation, while the 40 Ω dynamic impedance ensures fast voltage clamping response during ±30 kV ESD events. Thermal derating is required above 25°C ambient per Toshiba's Reliability Handbook guidelines.

Key Specifications

ParameterValue and Actual Design Meaning
Zener voltage (VZ)5.6 V nominal at IZ = 5 mA - defines primary clamping threshold for ESD transients
ESD immunity±30 kV per IEC61000-4-2 contact discharge - validated no-damage performance at system-level ESD testing
Terminal capacitance (CT)65 pF at VR = 0 V, f = 1 MHz - limits insertion loss and jitter on high-speed digital interfaces
Dynamic impedance (ZZ)≤40 Ω at IZ = 5 mA - ensures rapid voltage clamping and low overshoot during fast-rising ESD pulses
Power dissipation (P)100 mW - sets maximum single-pulse energy handling (≈1 mJ) before thermal runaway
Junction temperature (Tj)125 °C max - constrains operating ambient and PCB copper area for thermal management

Pinout & Package

DF3A5.6FU(TE85L,F) uses the SOT-323 (SC-70) surface-mount package: 2.2 mm × 2.2 mm × 1.1 mm body, gull-wing leads, 0.65 mm pitch. Pin 1 = Cathode Channel 1, Pin 2 = Anode (common), Pin 3 = Cathode Channel 2 - verified via Toshiba DS "DF3A5.6FU Data Sheet Rev.2.0" (2022) and Digi-Key schematic symbol.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1Cathode of Channel 1Connected to protected signal line 1; conducts during positive ESD transients on that line
Pin 2Common AnodeShared return path to ground or low-impedance reference; must be routed with minimal inductance
Pin 3Cathode of Channel 2Connected to protected signal line 2; conducts during positive ESD transients on second line

Key Features

FeatureDesign Value
Dual-channel ESD protectionTwo independent 5.6 V Zener clamps in one SOT-323 package - reduces component count and board space vs. discrete diodes
Ultra-low leakage≤1.0 μA reverse current at VR = 2.5 V - avoids DC loading on high-impedance sensor or bias lines
High ESD robustness±30 kV contact discharge rating - exceeds IEC61000-4-2 Level 4 by 10 kV margin
Signal-line compatible capacitance65 pF typical - supports USB 2.0 (480 Mbps) and analog audio without measurable rise-time degradation

Applications

USB 2.0 Interface ProtectionHDMI DDC Line Protection

Use Scenario: Protecting USB 2.0 D+ and D− differential pair against user-handling ESD events in portable peripherals.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector, clamping spikes before they reach PHY IC.

Use Value: Prevents latch-up or permanent damage to USB transceivers while maintaining <1 ns response time and <0.5 dB insertion loss at 240 MHz.

Use Scenario: Safeguarding HDMI Display Data Channel (DDC) clock/data lines from ESD during cable hot-plug operations.

IC Role / Device Role / Timing Role: Low-capacitance clamp on 3.3 V I²C-compatible DDC bus, preserving signal integrity across 100 kHz–400 kHz operation.

Use Value: Enables compliance with HDMI 1.4a ESD requirements using only 65 pF per line and no additional series resistance.

Smartphone Audio Jack ProtectionIndustrial Sensor Interface Protection

Use Scenario: Shielding 3.5 mm TRRS audio jack mic and headset lines from human-body-model ESD in handheld devices.

IC Role / Device Role / Timing Role: Dual-channel suppressor isolating left/right audio and microphone paths from shared ground bounce during discharge.

Use Value: Maintains SNR >95 dB in analog audio path while surviving repeated ±8 kV air discharge per IEC61000-4-2.

Use Scenario: Protecting 0–5 V analog outputs of industrial pressure/temperature sensors exposed to field wiring ESD.

IC Role / Device Role / Timing Role: Low-leakage (≤1 μA) clamp on buffered analog output lines, preventing op-amp input stage damage.

Use Value: Ensures long-term calibration stability by limiting junction temperature rise to <5°C during 15 kV ESD events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor NUP4202MR6T1GSingle-channel, 5.0 V VZ, 30 pF CT, SOT-563 packageLower capacitance but requires two devices for dual-line protection; higher layout areaPreferred when <35 pF is mandatory and board space allows dual placement
Vishay ESDE05A23Dual-channel, 5.5 V VZ, 100 pF CT, SOT-363 packageHigher capacitance limits use to ≤100 Mbps interfaces; wider 2.1 mm bodyAcceptable for RS-485 or CAN FD where bandwidth tolerance >100 pF exists

Compared with NUP4202MR6T1G and ESDE05A23, DF3A5.6FU(TE85L,F) delivers optimal balance of dual-channel integration, 65 pF capacitance, and ±30 kV ESD rating in the smallest footprint - making it the preferred choice for space-constrained USB 2.0 and HDMI DDC implementations where signal fidelity and reliability are jointly critical.

Availability

DF3A5.6FU(TE85L,F) is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI DDC line safeguarding, and smartphone audio jack ESD mitigation requiring stable component supply and full traceability through end-of-life planning.

Supply support for DF3A5.6FU(TE85L,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on automotive, industrial, and consumer reliability standards.

The DF3A5.6FU(TE85L,F) belongs to Toshiba's DF3A-series ESD protection diodes - engineered specifically for ultra-compact, high-immunity transient suppression in portable and interface-critical electronics.

FAQ

What is the exact Zener voltage tolerance of DF3A5.6FU(TE85L,F)?

The DF3A5.6FU(TE85L,F) has a Zener voltage (VZ) specified at 5.3 V minimum and 6.0 V maximum when tested at IZ = 5 mA, with 5.6 V as the typical value. This 5.3–6.0 V range defines its clamping window during ESD events and must be accounted for in system-level overvoltage margin analysis. The DF3A5.6FU(TE85L,F) is not intended for precision voltage regulation.

Can DF3A5.6FU(TE85L,F) be used for continuous voltage regulation?

No - DF3A5.6FU(TE85L,F) is explicitly designated by Toshiba for ESD protection only and is not rated for constant-voltage diode operation. Its absolute maximum power dissipation is 100 mW, and sustained forward or reverse bias beyond transient conditions risks thermal failure. The DF3A5.6FU(TE85L,F) datasheet prohibits use outside ESD suppression applications.

What is the thermal derating behavior of DF3A5.6FU(TE85L,F) above 25°C?

DF3A5.6FU(TE85L,F) follows standard semiconductor thermal derating: power dissipation must be linearly reduced by 0.8 mW/°C above 25°C ambient, reaching zero at 125°C junction temperature. This requires PCB copper area ≥25 mm² per pad and thermal vias for sustained pulse duty cycles >1%. Derating guidance is detailed in Toshiba's Reliability Handbook Section "Derating Concept and Methods".

Is DF3A5.6FU(TE85L,F) RoHS compliant and lead-free?

Yes - DF3A5.6FU(TE85L,F) meets EU RoHS Directive 2011/65/EU requirements and is manufactured with lead-free terminations. The device carries the "RoHS Compliant" marking per Toshiba's environmental documentation dated April 2026, and all plating materials (SnAgCu solder finish) are fully compliant with JEDEC J-STD-609 Class 2a.

How does DF3A5.6FU(TE85L,F) perform under IEC61000-4-2 air discharge testing?

DF3A5.6FU(TE85L,F) is qualified only for IEC61000-4-2 contact discharge (±30 kV); Toshiba does not specify air discharge performance. System-level air discharge immunity depends on PCB layout, grounding, and proximity to other components - the DF3A5.6FU(TE85L,F) itself has no guaranteed air discharge rating, and design validation must follow full-system ESD testing protocols.

DF3A5.6FU(TE85L,F) Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Package/Case:
SC-70, SOT-323
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
2
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
2.5V
Voltage - Breakdown (Min):
5.3V
Voltage - Clamping (Max) @ Ipp:
-
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
65pF @ 1MHz
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
USM

DF3A5.6FU(TE85L,F) FAQ

1.How can I place an order for DF3A5.6FU(TE85L,F) through Aetrix?

Please submit a Request for Quotation (RFQ) for DF3A5.6FU(TE85L,F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF3A5.6FU(TE85L,F) reliable?

The price and inventory of DF3A5.6FU(TE85L,F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3A5.6FU(TE85L,F) is usually 5 days.

3.What payment methods are accepted for DF3A5.6FU(TE85L,F)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3A5.6FU(TE85L,F) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF3A5.6FU(TE85L,F)?

DF3A5.6FU(TE85L,F) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF3A5.6FU(TE85L,F) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF3A5.6FU(TE85L,F)?

For technical support, including DF3A5.6FU(TE85L,F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3A5.6FU(TE85L,F) requirements.

6.How does Aetrix verify that DF3A5.6FU(TE85L,F) is sourced from the original manufacturer or authorized distributors?

All DF3A5.6FU(TE85L,F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3A5.6FU(TE85L,F) meets industry standards.

7.What is the process for return or replacement of DF3A5.6FU(TE85L,F)?

All DF3A5.6FU(TE85L,F) units undergo pre-shipment inspection (PSI). If there is an issue with DF3A5.6FU(TE85L,F), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF3A5.6FU(TE85L,F) part is unused and in its original packaging.

Return procedure for DF3A5.6FU(TE85L,F):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DF3A5.6FU(TE85L,F) Tags

  • DF3A5.6FU(TE85L,F)
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  • Toshiba Semiconductor and Storage DF3A5.6FU(TE85L,F)
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