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Toshiba Semiconductor and Storage DF3A6.2LFV,L3F
- Part No.:
- DF3A6.2LFV,L3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SOT-723
- Datasheet:
-
DF3A6.2LFV,L3F.pdf
- Description:
- TVS DIODE VESM
- Quantity:
- Payment:
- Shipping:
Inventory:9,647
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Product details
Overview
DF3A6.2LFV from TOSHIBA is a dual-channel ESD protection diode array designed for high-speed data lines in portable electronics, featuring 6.2 V nominal Zener voltage, 6.5 pF typical terminal capacitance, ±8 kV IEC61000-4-2 contact discharge immunity, and ultra-compact VESM package with three terminals (CATHODE1, CATHODE2, ANODE).
For engineers reviewing the DF3A6.2LFV datasheet, DF3A6.2LFV pinout, DF3A6.2LFV application, or DF3A6.2LFV equivalent, key selection criteria include low-capacitance signal-line protection, dual-diode configuration for bidirectional line shielding, ESD robustness without clamping voltage compromise, and compatibility with space-constrained USB/USB-C, HDMI, and audio interface layouts.
Technical Context
This device implements two independent Zener-type ESD protection elements sharing a common anode in a single VESM package, enabling compact dual-line protection without discrete component duplication. Its design targets transient suppression on high-frequency interfaces where capacitance must remain below 7 pF to avoid signal integrity degradation.
The DF3A6.2LFV operates exclusively as an ESD clamp-its 5.9–6.5 V Zener voltage range at 5 mA ensures reliable turn-on during electrostatic events while avoiding interference with normal 5 V logic or USB signaling. It is not rated for continuous voltage regulation or power dissipation beyond 150 mW under defined FR4 mounting conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener voltage | 5.9–6.5 V at IZ = 5 mA: defines clamping threshold for ESD transients on protected lines |
| Terminal capacitance | 6.5 pF typ. at VR = 0 V, f = 1 MHz: enables use on USB 2.0 and audio differential pairs without signal distortion |
| ESD immunity | ±8 kV per IEC61000-4-2 contact discharge: meets industrial-grade ESD robustness requirements |
| Power dissipation | 150 mW max on FR4 board (25.4 mm × 25.4 mm × 1.6 mm): limits thermal stress during repeated ESD events |
| Junction temperature | 150 °C max: sets upper thermal boundary for reliability in sealed handheld enclosures |
| Reverse current | 2.5 μA max at VR = 5 V: ensures minimal leakage loading on 3.3 V/5 V data lines during normal operation |
Pinout & Package
VESM package (TOSHIBA code 1-1Q1B), dimensions 1.2 × 0.8 × 0.4 mm, weight 0.0015 g, JEITA-compliant ultra-miniature surface-mount outline.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CATHODE1 | First ESD protection path anode-referenced cathode; connects to Line 1 (e.g., USB D+) |
| 2 | CATHODE2 | Second ESD protection path anode-referenced cathode; connects to Line 2 (e.g., USB D−) |
| 3 | ANODE | Common anode tied to system ground or low-impedance return; enables dual-diode shared return architecture |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel ESD protection in one package | Reduces PCB area by ~40% vs. two discrete 0201 diodes and eliminates routing asymmetry between protected lines |
| 6.5 pF typical capacitance | Preserves signal rise/fall times on 480 Mbps USB 2.0 channels with <1% eye diagram degradation |
| ±8 kV IEC61000-4-2 rating | Validated immunity against real-world human-body model discharges without parametric shift or failure |
| Common-anode configuration | Enables symmetrical clamping for differential pairs while minimizing ground loop inductance via single-point return |
Applications
| USB 2.0 Interface Protection | HDMI DDC Channel Protection |
|---|---|
Use Scenario: Protecting USB D+/D− lines in smartphones and OTG adapters from user-handling ESD events. IC Role / Device Role / Timing Role: Dual-channel transient voltage suppressor with shared ground return, placed immediately before connector. Use Value: Prevents latch-up or damage to USB PHY ICs while maintaining <100 ps propagation delay due to sub-7 pF loading. | Use Scenario: Shielding HDMI DDC clock/data lines (SCL/SDA) in monitors and set-top boxes. IC Role / Device Role / Timing Role: Low-capacitance bidirectional ESD clamp ensuring I²C timing compliance up to 400 kHz. Use Value: Avoids false ACK/NACK errors caused by capacitive loading exceeding 10 pF limit of standard I²C bus. |
| Smartphone Audio Jack Protection | Industrial Sensor Interface Protection |
Use Scenario: Safeguarding 3.5 mm TRRS microphone and headset lines in mobile handsets. IC Role / Device Role / Timing Role: Ground-referenced dual-Zener array suppressing ±8 kV discharges from headphone insertion/removal. Use Value: Maintains analog audio fidelity by limiting capacitance to 6.5 pF-well below 15 pF threshold for 20 kHz bandwidth preservation. | Use Scenario: Protecting RS-485 or CAN FD transceiver I/O pins in factory automation gateways. IC Role / Device Role / Timing Role: Secondary-level ESD guard on differential bus lines upstream of primary TVS arrays. Use Value: Adds localized clamping at connector entry point without degrading 12 Mbps CAN FD edge rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NZQ200004HT1G | Single-channel, 5.6 V Zener, 12 pF capacitance, SOD-923 package | Requires two devices for dual-line protection; higher capacitance limits use to lower-speed interfaces | Select when only one line needs protection or board layout allows separate placement |
| Diodes Incorporated D3V3Z5U-7 | Dual-channel, 3.3 V Zener, 15 pF capacitance, SOT-563 package | Lower clamping voltage suits 3.3 V I/O but higher capacitance restricts to ≤100 Mbps data rates | Prefer for 3.3 V logic domains where tighter voltage margin outweighs speed penalty |
Compared with NZQ200004HT1G and D3V3Z5U-7, the DF3A6.2LFV uniquely balances dual-line integration, 6.2 V clamping for 5 V-tolerant interfaces, and 6.5 pF capacitance-making it optimal for space-constrained, high-speed USB/audio designs where both channel matching and signal integrity are critical.
Availability
DF3A6.2LFV is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI DDC channel safeguarding, and smartphone audio jack ESD mitigation requiring stable component supply across consumer electronics production cycles.
Supply support for DF3A6.2LFV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on efficiency, miniaturization, and reliability for consumer, industrial, and automotive systems.
The DF3A6.2LFV belongs to Toshiba's ESD protection diode family engineered specifically for ultra-low-capacitance, dual-line transient suppression in portable high-speed digital interfaces.
FAQ
What is the primary function of the DF3A6.2LFV?
The DF3A6.2LFV is a dual-channel ESD protection diode array with a common anode, designed solely to suppress electrostatic discharge transients on high-speed data lines. It is not intended for voltage regulation or continuous power handling. Its 6.2 V Zener voltage and 6.5 pF capacitance make DF3A6.2LFV suitable for protecting USB, HDMI DDC, and audio interfaces without compromising signal integrity.
Can DF3A6.2LFV be used as a Zener regulator?
No. The DF3A6.2LFV is explicitly designated by Toshiba for ESD protection only and must not be used as a constant-voltage Zener diode. Its absolute maximum ratings and electrical characteristics are validated only for transient suppression-not steady-state DC operation. Using DF3A6.2LFV as a voltage regulator violates its specified use case and may result in premature failure or unreliable performance.
What does the "LFV" suffix indicate in DF3A6.2LFV?
The "LFV" suffix denotes Toshiba's VESM (Very-small Surface Mount) package variant-specifically the 1-1Q1B footprint with 1.2 × 0.8 × 0.4 mm dimensions and 0.0015 g mass. This marking distinguishes DF3A6.2LFV from older or alternate-package versions (e.g., DF3A6.2L) and confirms compliance with JEITA standards for ultra-compact mounting.
How is the DF3A6.2LFV pinout configured for differential signal protection?
The DF3A6.2LFV uses a three-terminal configuration: Pin 1 (CATHODE1) and Pin 2 (CATHODE2) connect to the two signal lines (e.g., D+ and D−), while Pin 3 (ANODE) connects to a low-inductance ground plane. This common-anode arrangement provides matched clamping paths essential for differential pair ESD protection, and DF3A6.2LFV's symmetric layout minimizes skew between protected lines.
Is DF3A6.2LFV compliant with RoHS and REACH regulations?
Yes. DF3A6.2LFV meets EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006 requirements for hazardous substance restrictions. Toshiba confirms lead-free termination and halogen-free molding compound for DF3A6.2LFV, and full compliance documentation is available through authorized distributors upon request.
DF3A6.2LFV,L3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SOT-723
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 5.9V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 6.5pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- VESM
DF3A6.2LFV,L3F FAQ
1.How can I place an order for DF3A6.2LFV,L3F through Aetrix?
Please submit a Request for Quotation (RFQ) for DF3A6.2LFV,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF3A6.2LFV,L3F reliable?
The price and inventory of DF3A6.2LFV,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3A6.2LFV,L3F is usually 5 days.
3.What payment methods are accepted for DF3A6.2LFV,L3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3A6.2LFV,L3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF3A6.2LFV,L3F?
DF3A6.2LFV,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF3A6.2LFV,L3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF3A6.2LFV,L3F?
For technical support, including DF3A6.2LFV,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3A6.2LFV,L3F requirements.
6.How does Aetrix verify that DF3A6.2LFV,L3F is sourced from the original manufacturer or authorized distributors?
All DF3A6.2LFV,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3A6.2LFV,L3F meets industry standards.
7.What is the process for return or replacement of DF3A6.2LFV,L3F?
All DF3A6.2LFV,L3F units undergo pre-shipment inspection (PSI). If there is an issue with DF3A6.2LFV,L3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF3A6.2LFV,L3F part is unused and in its original packaging.
Return procedure for DF3A6.2LFV,L3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF3A6.2LFV,L3F Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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