My Inquiry
My Account
Toshiba Semiconductor and Storage DF3D18FU,LXHF
- Part No.:
- DF3D18FU,LXHF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-70, SOT-323
- Datasheet:
-
DF3D18FU,LXHF.pdf
- Description:
- AUTO AEC-Q BIDIRECTIONAL ESD PRO
- Quantity:
- Payment:
- Shipping:
Inventory:77,865
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF3D18FU,LXHF from Toshiba Electronic Devices & Storage Corporation is an AEC-Q101-qualified ESD protection diode in USM package, featuring 12 V working peak reverse voltage, ±30 kV IEC61000-4-2 contact ESD rating, and 9 Ω dynamic resistance, designed for high-reliability automotive data-line protection.
For engineers reviewing the DF3D18FU,LXHF datasheet, DF3D18FU,LXHF pinout, DF3D18FU,LXHF application, or DF3D18FU,LXHF equivalent, key selection criteria include IEC/ISO ESD immunity levels, clamping performance at 2.5 A, low capacitance (10 pF max), and automotive-grade qualification status.
Technical Context
This device implements a silicon epitaxial planar TVS structure optimized for fast transient suppression on high-speed signal lines. It delivers bidirectional clamping with symmetrical ±30 kV ESD robustness per IEC61000-4-2 and ISO10605 standards, and supports 8/20 µs surge pulses up to 80 W peak power.
The DF3D18FU,LXHF operates with a 16.2–20.5 V reverse breakdown range at 1 mA, clamps to ≤33 V at 2.5 A peak pulse current, and maintains ≤0.1 µA leakage at 12 V, enabling low-power interface protection without signal integrity degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 12 V - Maximum continuous DC or RMS signal voltage the device blocks without conduction |
| Reverse Breakdown Voltage | 19 V (typ.) - Voltage at which device begins avalanche conduction under 1 mA test current |
| Clamp Voltage @ 2.5 A | 33 V (max) - Maximum voltage seen by protected circuit during 2.5 A IEC61000-4-5 surge event |
| Dynamic Resistance | 9 Ω (typ.) - Low impedance during clamping ensures minimal voltage overshoot under fast transients |
| Total Capacitance | 10 pF (max) - Enables use on USB 2.0, HDMI, and other >480 Mbps interfaces without signal distortion |
| ESD Rating (IEC61000-4-2) | ±30 kV contact - Meets highest industrial and automotive ESD immunity requirements |
| AEC-Q101 Qualified | Yes - Validated for automotive applications including infotainment and body control modules |
Pinout & Package
DF3D18FU,LXHF uses the USM (Ultra Small Mold) surface-mount package (2.0 × 1.25 × 0.9 mm, 6.0 mg typical), with three terminals in a single-row configuration optimized for space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode of Channel 1 | Connects to first protected signal line (e.g., USB D+) |
| Pin 2 | Anode of Channel 2 | Connects to second protected signal line (e.g., USB D−) |
| Pin 3 | Common Cathode / GND | Shared return path to system ground; must be low-inductance connection |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD protection | Enables symmetric clamping on differential pairs without polarity constraints |
| Low dynamic resistance (9 Ω typ.) | Reduces voltage overshoot during sub-nanosecond ESD events, improving system-level immunity |
| 10 pF max capacitance | Preserves signal integrity on high-speed digital interfaces up to 480 Mbps |
| AEC-Q101 qualification | Validates reliability for automotive environments including temperature cycling and humidity testing |
Applications
| USB 2.0 Interface Protection | Automotive Infotainment Data Lines |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D− lines in vehicle-mounted head units against ESD events during connector insertion or touch interaction. IC Role / Device Role / Timing Role: Bidirectional TVS diode providing low-capacitance, low-clamping-voltage transient suppression on differential data lanes. Use Value: Prevents latch-up or damage to USB transceivers while maintaining <480 Mbps signal fidelity via 10 pF max capacitance. | Use Scenario: Safeguarding LVDS or UART lines between display modules and main ECUs in automotive dashboards. IC Role / Device Role / Timing Role: AEC-Q101-qualified ESD clamp ensuring compliance with ISO10605 ±30 kV air discharge requirements. Use Value: Eliminates field failures due to ESD-induced resets or communication errors in harsh automotive cabin environments. |
| Industrial HMI Touch Panel Interfaces | Medical Handheld Device Buttons |
Use Scenario: Shielding capacitive touch controller I/O pins from operator-induced ESD in factory-floor HMIs. IC Role / Device Role / Timing Role: Low-leakage (≤0.1 µA) ESD suppressor preserving baseline capacitance sensing accuracy. Use Value: Maintains stable touch response across temperature ranges while surviving repeated ±30 kV contact discharges. | Use Scenario: Protecting tactile button inputs on battery-powered medical devices subject to frequent handling and static buildup. IC Role / Device Role / Timing Role: Ultra-small USM-packaged TVS enabling placement directly at button pads with minimal board area. Use Value: Ensures regulatory compliance (IEC61000-4-2) without compromising compact form factor or battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | Lower clamping voltage (12 V @ 1 A), higher capacitance (15 pF), SOT-553 package | Better for ultra-low-voltage logic but less suitable for 12 V signal rails | Select when lower clamping voltage outweighs capacitance penalty and board space allows larger footprint |
| ESD5Z3.3T5G | Unidirectional, 3.3 V VRWM, smaller SOD-523 package, no AEC-Q101 qualification | Limited to low-voltage non-automotive applications; lacks automotive reliability validation | Choose only for cost-sensitive consumer electronics where AEC-Q101 is not required |
Compared with TPD2E001DRYR and ESD5Z3.3T5G, DF3D18FU,LXHF uniquely combines AEC-Q101 qualification, 12 V working voltage, ±30 kV ESD rating, and USM package size-making it the only option validated for automotive signal-line protection where both reliability and miniaturization are mandatory.
Availability
DF3D18FU,LXHF is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial HMIs, and medical handheld devices requiring stable component supply and long-term lifecycle support.
Supply support for DF3D18FU,LXHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures semiconductor components with emphasis on reliability, efficiency, and automotive-grade quality assurance.
The DF3D18FU,LXHF belongs to Toshiba's ESD protection diode product line, engineered specifically for high-immunity, low-capacitance protection of high-speed data interfaces in automotive and industrial environments.
FAQ
What is the primary function of the DF3D18FU,LXHF?
The DF3D18FU,LXHF is a bidirectional ESD protection diode designed to safeguard sensitive data lines from electrostatic discharge events. It clamps transient voltages to safe levels while maintaining low capacitance and leakage. Its core function is to protect downstream ICs such as USB transceivers or UART controllers without degrading signal integrity. The DF3D18FU,LXHF achieves this through a silicon epitaxial planar structure with guaranteed ±30 kV IEC61000-4-2 contact immunity.
Is DF3D18FU,LXHF qualified for automotive applications?
Yes, DF3D18FU,LXHF is explicitly AEC-Q101 qualified, as confirmed in Toshiba's official orderable part number documentation. This qualification covers stress tests including temperature cycling, humidity bias, and mechanical shock, validating its suitability for automotive infotainment, body control, and telematics modules. DF3D18FU,LXHF meets ISO10605 ±30 kV air discharge requirements, making it appropriate for deployment in vehicles where ESD robustness is critical.
What package type does DF3D18FU,LXHF use and what are its dimensions?
DF3D18FU,LXHF uses the USM (Ultra Small Mold) package, measuring 2.0 mm × 1.25 mm × 0.9 mm with a typical weight of 6.0 mg. This three-terminal surface-mount package features a single-row pin layout (Pin 1, Pin 2, GND) and is optimized for high-density PCBs. Land pattern dimensions are provided in Toshiba's datasheet revision 5.0.A, and the package supports reflow soldering per J-STD-020 moisture sensitivity level (MSL) requirements.
What is the maximum clamping voltage of DF3D18FU,LXHF under surge conditions?
The DF3D18FU,LXHF has a maximum clamping voltage (VC) of 33 V at 2.5 A peak pulse current, as specified in Toshiba's electrical characteristics table under IEC61000-4-5 8/20 µs waveform conditions. At lower currents (e.g., 1 A), clamping drops to 9 V (typ.). This performance ensures protected circuits remain within safe operating limits during real-world ESD and surge events. The DF3D18FU,LXHF achieves this via low dynamic resistance (9 Ω typ.) and controlled avalanche behavior.
How does DF3D18FU,LXHF compare to standard zener-based TVS diodes in terms of speed and capacitance?
DF3D18FU,LXHF offers faster response (<1 ns) and lower capacitance (10 pF max) than traditional zener-based TVS diodes, which typically exceed 30–50 pF and exhibit slower turn-on due to junction capacitance and series resistance. Its silicon epitaxial planar construction enables precise breakdown control and minimal parasitic effects. For high-speed interfaces like USB 2.0, the DF3D18FU,LXHF provides superior signal fidelity and ESD margin compared to legacy solutions-without requiring design compromises.
DF3D18FU,LXHF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-70, SOT-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 12V (Max)
- Voltage - Breakdown (Min):
- 16.2V
- Voltage - Clamping (Max) @ Ipp:
- 33V
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 80W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 9pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- USM
DF3D18FU,LXHF FAQ
1.How can I place an order for DF3D18FU,LXHF through Aetrix?
Please submit a Request for Quotation (RFQ) for DF3D18FU,LXHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF3D18FU,LXHF reliable?
The price and inventory of DF3D18FU,LXHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3D18FU,LXHF is usually 5 days.
3.What payment methods are accepted for DF3D18FU,LXHF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3D18FU,LXHF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF3D18FU,LXHF?
DF3D18FU,LXHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF3D18FU,LXHF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF3D18FU,LXHF?
For technical support, including DF3D18FU,LXHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3D18FU,LXHF requirements.
6.How does Aetrix verify that DF3D18FU,LXHF is sourced from the original manufacturer or authorized distributors?
All DF3D18FU,LXHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3D18FU,LXHF meets industry standards.
7.What is the process for return or replacement of DF3D18FU,LXHF?
All DF3D18FU,LXHF units undergo pre-shipment inspection (PSI). If there is an issue with DF3D18FU,LXHF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF3D18FU,LXHF part is unused and in its original packaging.
Return procedure for DF3D18FU,LXHF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF3D18FU,LXHF Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
