My Inquiry
My Account
Toshiba Semiconductor and Storage DF3D29FU,LXHF
- Part No.:
- DF3D29FU,LXHF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-70, SOT-323
- Datasheet:
-
DF3D29FU,LXHF.pdf
- Description:
- AUTO AEC-Q BIDIRECTIONAL ESD PRO
- Quantity:
- Payment:
- Shipping:
Inventory:5,493
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF3D29FU,LXHF from Toshiba Electronic Devices & Storage Corporation is an AEC-Q101-qualified ESD protection diode in USM package, designed for bidirectional transient suppression on high-speed data lines. It provides ±25 kV IEC61000-4-2 contact ESD immunity, 24 V working peak reverse voltage, and clamps to ≤47 V at 3 A peak pulse current - deployed in automotive infotainment USB interfaces.
For engineers reviewing the DF3D29FU,LXHF datasheet, DF3D29FU,LXHF pinout, DF3D29FU,LXHF application, or DF3D29FU,LXHF equivalent, key selection criteria include IEC/ISO ESD rating compliance, low dynamic resistance (≤10 Ω), sub-10 pF capacitance for signal integrity, and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
This device implements a silicon epitaxial planar TVS structure optimized for fast response to ESD transients. Its bidirectional clamping architecture delivers symmetrical protection with 26–32 V reverse breakdown voltage and ≤1.1 Ω typical dynamic resistance under TLP testing (8–16 A range).
Designed specifically for high-frequency signal lines, it maintains ≤9 pF total capacitance at 0 V bias and achieves ≤47 V clamp voltage at 3 A (IEC61000-4-5 8/20 µs), enabling use on USB 2.0, HDMI, and automotive CAN FD data paths without signal degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC61000-4-2 Contact) | ±25 kV - meets automotive-level ESD immunity requirements for exposed connectors |
| Working Peak Reverse Voltage | 24 V - supports 24 V automotive supply rails and 5 V/3.3 V data line protection |
| Clamp Voltage @ 3 A | ≤47 V - limits downstream IC stress during ISO10605 330 pF/2 kΩ discharge events |
| Total Capacitance | ≤9 pF - preserves signal integrity on USB 2.0 (480 Mbps) and CAN FD (5 Mbps) buses |
| Dynamic Resistance | ≤10 Ω - ensures rapid voltage clamping with minimal overshoot during fast ESD pulses |
| AEC-Q101 Qualified | Yes - validated for automotive temperature cycling, humidity, and mechanical shock per AEC standard |
Pinout & Package
DF3D29FU,LXHF uses the USM (Ultra Small Mold) surface-mount package (1.6 × 1.6 × 0.55 mm, 6.0 mg), featuring a 3-pin configuration with GND as common terminal and two symmetrical I/O pins for bidirectional protection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode of Diode D1 | Connects to protected signal line (e.g., USB D+); forms one leg of bidirectional clamp path |
| Pin 2 | Anode of Diode D2 | Connects to protected signal line (e.g., USB D−); mirrors Pin 1 for symmetrical ESD handling |
| Pin 3 | Cathode Common (GND) | Reference node for both diodes; must be tied to low-inductance system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD Clamping | Enables single-device protection of differential pairs without polarity constraints |
| Low Capacitance (≤9 pF) | Minimizes insertion loss and reflection on high-speed serial links up to 480 Mbps |
| AEC-Q101 Qualification | Validated for automotive under-hood and cabin environments (-40°C to +125°C junction) |
| Fast Response Time | Sub-nanosecond turn-on ensures clamping before sensitive ICs experience overvoltage damage |
Applications
| USB 2.0 Interface Protection | Automotive Infotainment Display Link |
|---|---|
Use Scenario: Protecting USB 2.0 D+/D− lines in vehicle head units against hot-plug ESD and cable discharge events. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point. Use Value: Maintains <9 pF loading to preserve eye diagram integrity while delivering ±25 kV IEC61000-4-2 immunity. | Use Scenario: Shielding LVDS or FPD-Link II video data lanes between MCU and TFT display in automotive dashboards. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each differential pair to prevent latch-up in timing-critical pixel clock paths. Use Value: ≤47 V clamping at 3 A prevents damage to display driver ICs during assembly ESD events. |
| CAN FD Data Line Protection | Industrial HMI Touch Controller Interface |
Use Scenario: Safeguarding CAN FD transceiver I/O pins (CANH/CANL) in ADAS domain controllers exposed to chassis-ground transients. IC Role / Device Role / Timing Role: Secondary ESD protection stage after common-mode choke, referenced to isolated CAN ground. Use Value: AEC-Q101 qualification ensures operation across -40°C to +125°C ambient with no derating required. | Use Scenario: Protecting I²C or SPI lines between microcontroller and capacitive touch controller in factory HMIs subject to operator ESD. IC Role / Device Role / Timing Role: Point-of-entry TVS on SDA/SCL or MOSI/MISO lines to prevent firmware lockup during maintenance. Use Value: ≤0.1 µA reverse leakage at 24 V enables battery-powered operation without measurable quiescent drain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor SZ1.5SMC24AT3G | Unidirectional, higher capacitance (15 pF), larger SMC package (7.1 × 6.2 mm) | Suitable for board-level power rail protection, not high-speed data lines | Select only when protecting DC supply lines with lower frequency content and no signal integrity constraints |
| Infineon ESD204-B1-02EL | Bidirectional, 5.5 pF capacitance, but rated only to ±15 kV IEC61000-4-2 contact | Lacks AEC-Q101 qualification; limited to consumer-grade industrial applications | Choose for cost-sensitive non-automotive designs where ESD threat level is moderate and space allows USP-4 package |
Compared with SZ1.5SMC24AT3G and ESD204-B1-02EL, DF3D29FU,LXHF uniquely balances automotive qualification, ultra-low capacitance, and bidirectional ±25 kV ESD robustness in a 1.6 mm footprint - making it optimal for space-constrained, safety-critical data interface protection.
Availability
DF3D29FU,LXHF is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial HMI interfaces, and high-speed USB 2.0 peripheral designs requiring stable component supply and long-term lifecycle assurance.
Supply support for DF3D29FU,LXHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures semiconductor solutions for automotive, industrial, and consumer applications, with emphasis on reliability, efficiency, and system integration.
The DF3D29FU,LXHF belongs to Toshiba's AEC-Q101-qualified ESD protection diode product line, engineered specifically for high-speed data line immunity in harsh automotive environments.
FAQ
What is the maximum clamping voltage of DF3D29FU,LXHF at 3 A peak pulse current?
The DF3D29FU,LXHF clamps to a maximum of 47 V at 3 A peak pulse current (IEC61000-4-5 8/20 µs waveform). This value is guaranteed per datasheet specifications and ensures downstream ICs remain within safe operating voltage margins during standardized surge events. The DF3D29FU,LXHF achieves this with ≤10 Ω dynamic resistance, minimizing voltage overshoot beyond the clamp threshold.
Is DF3D29FU,LXHF qualified for automotive applications?
Yes, DF3D29FU,LXHF is explicitly AEC-Q101 qualified, as confirmed in Toshiba's orderable part number documentation. This qualification covers temperature cycling, high-temperature operating life, and mechanical shock testing required for automotive under-hood and cabin modules. DF3D29FU,LXHF is intended for automotive use cases including infotainment, ADAS, and body control units.
What is the total capacitance of DF3D29FU,LXHF and why does it matter?
The DF3D29FU,LXHF has a maximum total capacitance of 9 pF at 0 V bias and 1 MHz. This low value is critical for preserving signal integrity on high-speed interfaces like USB 2.0 and CAN FD, where excessive capacitance causes rise-time degradation, jitter, and bit errors. DF3D29FU,LXHF's ≤9 pF enables placement directly at connectors without equalization or layout compensation.
Does DF3D29FU,LXHF support bidirectional ESD protection?
Yes, DF3D29FU,LXHF is a bidirectional ESD protection diode, with symmetrical clamping behavior on both pins relative to GND. Its structure allows identical ±25 kV IEC61000-4-2 contact ESD performance on either I/O terminal, making it ideal for differential signal pairs such as USB D+/D− or CANH/CANL without polarity concerns during PCB layout.
What package type does DF3D29FU,LXHF use and what are its dimensions?
DF3D29FU,LXHF uses the USM (Ultra Small Mold) package measuring 1.6 × 1.6 × 0.55 mm with a typical weight of 6.0 mg. This 3-pin surface-mount package features a compact footprint optimized for dense automotive PCBs and includes exposed pad thermal enhancement. The USM package is compatible with standard reflow profiles and automated optical inspection (AOI) processes.
DF3D29FU,LXHF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-70, SOT-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 24V (Max)
- Voltage - Breakdown (Min):
- 26V
- Voltage - Clamping (Max) @ Ipp:
- 47V
- Current - Peak Pulse (10/1000µs):
- 3A (8/20µs)
- Power - Peak Pulse:
- 140W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 9pF @ 1MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-70
DF3D29FU,LXHF FAQ
1.How can I place an order for DF3D29FU,LXHF through Aetrix?
Please submit a Request for Quotation (RFQ) for DF3D29FU,LXHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF3D29FU,LXHF reliable?
The price and inventory of DF3D29FU,LXHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3D29FU,LXHF is usually 5 days.
3.What payment methods are accepted for DF3D29FU,LXHF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3D29FU,LXHF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF3D29FU,LXHF?
DF3D29FU,LXHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF3D29FU,LXHF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF3D29FU,LXHF?
For technical support, including DF3D29FU,LXHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3D29FU,LXHF requirements.
6.How does Aetrix verify that DF3D29FU,LXHF is sourced from the original manufacturer or authorized distributors?
All DF3D29FU,LXHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3D29FU,LXHF meets industry standards.
7.What is the process for return or replacement of DF3D29FU,LXHF?
All DF3D29FU,LXHF units undergo pre-shipment inspection (PSI). If there is an issue with DF3D29FU,LXHF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF3D29FU,LXHF part is unused and in its original packaging.
Return procedure for DF3D29FU,LXHF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF3D29FU,LXHF Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
