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Toshiba Semiconductor and Storage DF3D36FU,LF
- Part No.:
- DF3D36FU,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- TVS Diodes
- Package:
- SC-70, SOT-323
- Datasheet:
-
DF3D36FU,LF.pdf
- Description:
- TVS DIODE 28VWM USM
- Quantity:
- Payment:
- Shipping:
Inventory:6,751
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Product details
Overview
DF3D36FU,LF from Toshiba Electronic Devices & Storage Corporation is a unidirectional ESD protection diode in USM package, rated for 28 V working peak reverse voltage, ±20 kV IEC61000-4-2 contact ESD immunity, and 6.5 pF typical capacitance-designed to safeguard high-speed USB 2.0 data lines against electrostatic discharge events.
For engineers reviewing the DF3D36FU,LF datasheet, DF3D36FU,LF pinout, DF3D36FU,LF application, or DF3D36FU,LF equivalent, key selection criteria include clamping voltage at 2.5 A (≤60 V), dynamic resistance (≤8 Ω), low leakage (<0.1 µA at 28 V), and compatibility with compact portable electronics requiring minimal signal distortion.
Technical Context
The DF3D36FU,LF employs a silicon epitaxial planar structure optimized for fast transient response and low capacitance. It operates as a single-channel unidirectional TVS diode with grounded cathode configuration, supporting IEC61000-4-2 and ISO10605 compliance via defined clamp behavior under 8/20 µs surge pulses.
Its electrical behavior is characterized by a sharp reverse breakdown at 36 V (typ.), clamping to ≤60 V at 2.5 A peak pulse current, and maintaining ≤6.5 pF total capacitance at 0 V-enabling integration into 480 Mbps USB 2.0 interfaces without signal integrity degradation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 28 V - Maximum continuous DC or peak AC voltage applied without conduction. |
| Reverse Breakdown Voltage | 36 V (typ.) - Voltage at which device enters avalanche conduction during ESD event. |
| Clamp Voltage @ 2.5 A | ≤60 V - Maximum voltage seen by protected line during 8/20 µs surge, limiting IC stress. |
| Total Capacitance | 6.5 pF (typ.) - Enables use on USB 2.0 (480 Mbps) and other high-speed digital lines. |
| ESD Immunity | ±20 kV (IEC61000-4-2 contact) - Meets industrial-grade ESD robustness requirements. |
| Dynamic Resistance | ≤8 Ω - Ensures rapid voltage clamping and low energy dissipation during transients. |
| Leakage Current | ≤0.1 µA @ 28 V - Prevents signal loading or battery drain in always-on interfaces. |
Pinout & Package
DF3D36FU,LF is housed in the USM (Ultra Small Mold) package-a 3-pin surface-mount device with dimensions of 1.2 × 0.8 × 0.37 mm (L × W × H) and typical weight of 6.0 mg. Pin 1 and Pin 2 are anode and cathode terminals respectively; Pin 3 is GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Input terminal for protected signal line (e.g., USB D+ or D−). |
| Pin 2 | Cathode | Connected to system ground through low-inductance path for ESD current shunting. |
| Pin 3 | GND | Dedicated ground terminal-ensures stable reference and minimizes ground bounce during clamping. |
Key Features
| Feature | Design Value |
|---|---|
| Low Clamping Voltage | ≤60 V at 2.5 A ensures downstream ICs remain within safe operating voltage limits during ESD. |
| Ultra-Low Capacitance | 6.5 pF (typ.) preserves signal rise/fall times and eye diagram integrity on 480 Mbps USB 2.0 links. |
| High ESD Robustness | ±20 kV contact discharge per IEC61000-4-2 enables reliable operation in handheld and industrial environments. |
| Grounded Cathode Architecture | Pin 2–Pin 3 connection simplifies PCB layout and improves return path inductance control. |
| USM Package Footprint | 1.2 × 0.8 mm land pattern supports ultra-compact designs in space-constrained mobile applications. |
Applications
| USB 2.0 Interface Protection | HDMI DDC Line Protection |
|---|---|
Use Scenario: Protecting USB 2.0 data lines (D+, D−) in smartphones, tablets, and docking stations from user-handling ESD events. IC Role / Device Role / Timing Role: Unidirectional ESD suppressor placed directly at connector, clamping transients before reaching USB transceiver. Use Value: Maintains 480 Mbps data integrity with <6.5 pF loading and limits voltage to ≤60 V during ±15 kV contact discharge. | Use Scenario: Safeguarding HDMI Display Data Channel (DDC) lines (SCL/SDA) in monitors and set-top boxes. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on 5 V-tolerant I²C bus lines operating at ≤100 kHz. Use Value: Prevents latch-up or damage to HDMI source/sink controllers while adding <0.1 µA leakage at 5 V. |
| Industrial Sensor Interface | Automotive Infotainment USB Port |
Use Scenario: ESD protection for RS-485 or CAN FD transceiver I/O pins in factory automation equipment. IC Role / Device Role / Timing Role: Secondary-level protection stage after primary common-mode choke, handling residual fast transients. Use Value: Delivers ±20 kV air-gap ESD immunity without degrading differential signal timing due to low Ct. | Use Scenario: Front-panel USB charging/data ports in automotive head units exposed to dry-climate ESD. IC Role / Device Role / Timing Role: First-line ESD defense on USB lines meeting ISO10605 (±20 kV contact) requirements. Use Value: Validated clamp performance at −40 °C to +125 °C ambient, supporting AEC-Q200-relevant reliability screening. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | Bi-directional configuration; 10 pF typical capacitance; lower 12 V VRWM. | Suitable for bidirectional signal lines (e.g., USB ID pin, audio jack); not rated for 28 V working voltage. | Select when protecting symmetric analog/digital signals where polarity reversal may occur. |
| ESD9X3.3SFT5G | Unidirectional; 3.3 V VRWM; 12 pF capacitance; higher 15 kV IEC61000-4-2 rating. | Optimized for 3.3 V logic rails (e.g., SDIO, eMMC); insufficient for 28 V USB VBUS-adjacent placement. | Prefer for low-voltage I/O protection where VRWM < 5 V and capacitance tolerance >10 pF is acceptable. |
Compared with TPD2E001DRYR and ESD9X3.3SFT5G, the DF3D36FU,LF uniquely balances 28 V VRWM, ±20 kV ESD rating, and 6.5 pF capacitance-making it optimal for high-speed, medium-voltage data lines where unidirectional clamping and minimal signal loading are critical.
Availability
DF3D36FU,LF is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI DDC line safeguarding, and industrial sensor I/O hardening requiring stable component supply across production lifecycles.
Supply support for DF3D36FU,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, efficiency, and miniaturization.
The DF3D36FU,LF belongs to Toshiba's DF3 series of ultra-small ESD protection diodes, engineered specifically for high-density portable electronics demanding low capacitance, high ESD immunity, and USM footprint compatibility.
FAQ
What is the maximum working voltage supported by DF3D36FU,LF?
The DF3D36FU,LF has a working peak reverse voltage (VRWM) of 28 V, meaning it can continuously block up to 28 V DC or peak AC voltage without entering breakdown. This makes DF3D36FU,LF suitable for protecting circuits operating near 24 V industrial buses or USB VBUS-adjacent signal lines, provided transient clamping remains within its 60 V limit at 2.5 A.
Does DF3D36FU,LF meet automotive ESD standards?
DF3D36FU,LF is rated for ±20 kV per IEC61000-4-2 (contact) and ISO10605 (contact), both referenced in automotive EMC test plans. While DF3D36FU,LF itself is not AEC-Q200 qualified, its electrical performance and thermal stability (−55 °C to +150 °C storage) support use in automotive infotainment USB ports when combined with appropriate system-level validation.
How does the USM package of DF3D36FU,LF affect PCB layout?
The USM package (1.2 × 0.8 mm) of DF3D36FU,LF requires precise land pattern alignment per Toshiba's recommended dimensions (Fig. 6.1). Its three-terminal layout-Pin 1 (anode), Pin 2 (cathode), Pin 3 (GND)-demands short, low-inductance traces to ground to maintain clamping speed; DF3D36FU,LF must be placed within 3 mm of the protected connector for optimal ESD suppression.
Can DF3D36FU,LF be used for bidirectional signal lines like USB ID or audio jack detection?
No-DF3D36FU,LF is a unidirectional ESD diode, configured with anode and cathode terminals referenced to GND. It only clamps positive transients on the anode relative to ground. For bidirectional lines such as USB ID or headset detection, a bi-directional device like TPD2E001DRYR is required; DF3D36FU,LF would not protect negative-going surges on those nodes.
What is the typical dynamic resistance of DF3D36FU,LF and why does it matter?
DF3D36FU,LF has a dynamic resistance (RDYN) of ≤8 Ω, measured using TLP with 8–16 A current range. This low value ensures rapid voltage stabilization during ESD events, minimizing overshoot and reducing energy dissipated in the protected IC. In practice, this means DF3D36FU,LF delivers tighter clamping control than higher-RDYN alternatives, enhancing system-level robustness.
DF3D36FU,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- SC-70, SOT-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 28V
- Voltage - Breakdown (Min):
- 32V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 7pF @ 1MHz
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- USM
DF3D36FU,LF FAQ
1.How can I place an order for DF3D36FU,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for DF3D36FU,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF3D36FU,LF reliable?
The price and inventory of DF3D36FU,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3D36FU,LF is usually 5 days.
3.What payment methods are accepted for DF3D36FU,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3D36FU,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF3D36FU,LF?
DF3D36FU,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF3D36FU,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF3D36FU,LF?
For technical support, including DF3D36FU,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3D36FU,LF requirements.
6.How does Aetrix verify that DF3D36FU,LF is sourced from the original manufacturer or authorized distributors?
All DF3D36FU,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3D36FU,LF meets industry standards.
7.What is the process for return or replacement of DF3D36FU,LF?
All DF3D36FU,LF units undergo pre-shipment inspection (PSI). If there is an issue with DF3D36FU,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF3D36FU,LF part is unused and in its original packaging.
Return procedure for DF3D36FU,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF3D36FU,LF Tags
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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