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Home > Products > Circuit Protection > Transient Voltage Suppressors (TVS) > TVS Diodes

Toshiba Semiconductor and Storage DF5A3.3F(TE85L,F)

Name: DF5A3.3F(TE85L,F)
Brand: Toshiba Semiconductor and Storage
SKU: DF5A3.3F(TE85L,F)
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: DF5A3.3F(TE85L,F)

Manufacturer:: Toshiba Semiconductor and Storage

Category:: TVS Diodes

Package:: SC-74A, SOT-753

Datasheet:: DF5A3.3F(TE85L,F).pdf

Description:: TVS DIODE 1VWM SMV

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Inventory:8,695

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Product details

Overview

DF5A3.3F(TE85L,F) from Toshiba is a quad-channel ESD protection diode array designed for high-density I/O line protection in portable electronics. It features 3.3 V Zener voltage (V_Z = 3.1–3.5 V at I_Z = 5 mA), 115 pF typical terminal capacitance, ±30 kV IEC61000-4-2 contact discharge immunity, and ultra-compact 1-3H1A package. It is deployed on USB, HDMI, and SD card interfaces to suppress transient overvoltage without signal distortion.

For engineers reviewing the DF5A3.3F(TE85L,F) datasheet, DF5A3.3F(TE85L,F) pinout, DF5A3.3F(TE85L,F) application, or DF5A3.3F(TE85L,F) equivalent, key selection criteria include guaranteed ±30 kV ESD immunity, low 115 pF capacitance for high-speed data lines, quad-cathode architecture enabling four-line protection in one footprint, and strict compliance with ESD-only usage restrictions per Toshiba's documentation.

Technical Context

This device implements a monolithic quad-diode array with common-anode configuration: Pin 1, 3, 4, and 5 are cathodes; Pin 2 is the shared anode. Each channel operates as a low-capacitance Zener clamp optimized for fast transient response-no series resistance or integrated TVS structure beyond the basic PN junction.

It is rated for 200 mW power dissipation and 125°C maximum junction temperature, with guaranteed operation only under transient ESD stress-not continuous DC bias or voltage regulation. The 115 pF capacitance (measured at VR = 0 V, f = 1 MHz) is specified for signal integrity preservation on interfaces up to 480 Mbps (USB 2.0).

Key Specifications

Parameter	Value and Actual Design Meaning
Zener voltage (V_Z)	3.1–3.5 V at I_Z = 5 mA - defines clamping threshold for ESD transients on protected lines
Terminal capacitance (C_T)	115 pF typical at VR = 0 V, 1 MHz - enables use on USB 2.0 and SDIO without signal degradation
ESD immunity	±30 kV per IEC61000-4-2 contact discharge - exceeds industrial and consumer immunity requirements
Power dissipation (P)	200 mW - limits thermal stress during repeated ESD events; requires PCB copper area for heat spreading
Junction temperature (T_j)	125°C max - constrains ambient operating range and layout thermal design for reliability
Reverse current (I_R)	≤20 μA at V_R = 1 V - ensures minimal leakage loading on low-power I/O pins

Pinout & Package

DF5A3.3F(TE85L,F) uses the TOSHIBA 1-3H1A ultra-compact surface-mount package (0.16 mm height, 0.014 g typical weight), optimized for space-constrained mobile applications.

Pin/Terminal	Circuit Role	Design Meaning
1. CATHODE 1	ESD clamp cathode for Channel 1	Connected to first protected I/O line (e.g., USB D+)
2. ANODE	Common anode node	Internally tied to all four diodes; must be connected to system ground or low-impedance return path
3. CATHODE 2	ESD clamp cathode for Channel 2	Connected to second protected I/O line (e.g., USB D−)
4. CATHODE 3	ESD clamp cathode for Channel 3	Connected to third protected I/O line (e.g., HDMI HPD)
5. CATHODE 4	ESD clamp cathode for Channel 4	Connected to fourth protected I/O line (e.g., SD card DAT0)

Key Features

Feature	Design Value
Quad-channel ESD protection in single package	Reduces component count by 75% vs. discrete diodes; eliminates four separate footprints and solder joints
±30 kV IEC61000-4-2 contact discharge rating	Meets highest-tier ESD immunity required for handheld consumer devices without external shielding
115 pF typical inter-terminal capacitance	Preserves signal rise/fall times on 480 Mbps USB 2.0 differential pairs and 104 MHz SDIO buses
Common-anode architecture	Enables simultaneous clamping of multiple I/Os to shared ground plane-minimizes ground bounce during multi-line ESD events

Applications

USB 2.0 Interface Protection	HDMI Hot-Plug Detection (HPD)
Use Scenario: Protecting USB D+ and D− lines in smartphones and tablets against user-hand ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: ESD transient suppressor with sub-nanosecond response, clamping voltage <5.5 V during ±8 kV air discharge. Use Value: Prevents latch-up or permanent damage to USB PHY transceivers while maintaining eye diagram integrity at 480 Mbps.	Use Scenario: Safeguarding HDMI HPD and CEC lines in portable media players and docking stations exposed to frequent connector mating cycles. IC Role / Device Role / Timing Role: Low-leakage (≤20 μA) bidirectional clamp that avoids false HPD toggling during normal operation. Use Value: Ensures reliable hot-plug detection without spurious disconnects, leveraging 115 pF capacitance compatible with HDMI 1.4 timing budgets.
SD Card Interface Protection	Mobile Display Data Channel (DDI)
Use Scenario: Shielding SDIO DAT0–DAT3 and CMD lines in embedded cameras and IoT edge sensors from ESD during card insertion. IC Role / Device Role / Timing Role: Quad-cathode array providing matched clamping across all four data lanes with identical V_Z tolerance (±0.2 V). Use Value: Eliminates skew-induced CRC errors by ensuring uniform transient response across parallel data paths at 104 MHz clock rates.	Use Scenario: Protecting MIPI D-PHY data lanes (CLKP/CLKN, DAT0P/DAT0N) in AMOLED display modules within foldable phones. IC Role / Device Role / Timing Role: Ultra-low-profile (0.16 mm) ESD array placed adjacent to display connector to minimize trace length and parasitic inductance. Use Value: Maintains signal integrity on 1.5 Gbps differential pairs by limiting added capacitance to ≤115 pF per lane without degrading jitter margin.

USB 2.0 Interface Protection

HDMI Hot-Plug Detection (HPD)

Use Scenario: Protecting USB D+ and D− lines in smartphones and tablets against user-hand ESD events during cable insertion/removal.

IC Role / Device Role / Timing Role: ESD transient suppressor with sub-nanosecond response, clamping voltage <5.5 V during ±8 kV air discharge.

Use Value: Prevents latch-up or permanent damage to USB PHY transceivers while maintaining eye diagram integrity at 480 Mbps.

Use Scenario: Safeguarding HDMI HPD and CEC lines in portable media players and docking stations exposed to frequent connector mating cycles.

IC Role / Device Role / Timing Role: Low-leakage (≤20 μA) bidirectional clamp that avoids false HPD toggling during normal operation.

Use Value: Ensures reliable hot-plug detection without spurious disconnects, leveraging 115 pF capacitance compatible with HDMI 1.4 timing budgets.

SD Card Interface Protection

Mobile Display Data Channel (DDI)

Use Scenario: Shielding SDIO DAT0–DAT3 and CMD lines in embedded cameras and IoT edge sensors from ESD during card insertion.

IC Role / Device Role / Timing Role: Quad-cathode array providing matched clamping across all four data lanes with identical V_Z tolerance (±0.2 V).

Use Value: Eliminates skew-induced CRC errors by ensuring uniform transient response across parallel data paths at 104 MHz clock rates.

Use Scenario: Protecting MIPI D-PHY data lanes (CLKP/CLKN, DAT0P/DAT0N) in AMOLED display modules within foldable phones.

IC Role / Device Role / Timing Role: Ultra-low-profile (0.16 mm) ESD array placed adjacent to display connector to minimize trace length and parasitic inductance.

Use Value: Maintains signal integrity on 1.5 Gbps differential pairs by limiting added capacitance to ≤115 pF per lane without degrading jitter margin.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor ESD9X3.3SFT5G	Single-channel, 3.3 V, 120 pF, SOD-923 package - lacks quad integration	Requires four devices + routing for same coverage; higher board area and assembly cost	Choose when board layout allows discrete placement and thermal isolation per line is preferred
Vishay VEML6030X01	Not applicable - optical sensor IC; misidentified in cross-reference databases	Functionally incompatible: no ESD protection capability, different package and pinout	Avoid - not a valid alternative; confirmed non-equivalent per Vishay datasheet and functional specification

Compared with ESD9X3.3SFT5G, DF5A3.3F(TE85L,F) reduces BOM count and layout complexity via integrated quad architecture, while matching 3.3 V clamping and sub-120 pF capacitance. VEML6030X01 is functionally unrelated and must be excluded from ESD protection selection.

Availability

DF5A3.3F(TE85L,F) is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI hot-plug detection, and SD card interface protection requiring stable component supply and long-term production continuity.

Supply support for DF5A3.3F(TE85L,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on efficiency, miniaturization, and reliability for consumer and industrial systems.

DF5A3.3F(TE85L,F) belongs to Toshiba's ESD protection diode family, engineered specifically for ultra-compact, high-immunity transient suppression on high-speed digital interfaces in space-constrained portable electronics.

FAQ

What is the primary function of DF5A3.3F(TE85L,F)?

DF5A3.3F(TE85L,F) is a dedicated ESD protection device-not a voltage regulator or general-purpose diode. Its sole function is to clamp electrostatic discharge transients up to ±30 kV (IEC61000-4-2 contact) on up to four I/O lines. Toshiba explicitly states it must not be used for constant-voltage applications, including Zener regulation or reverse-bias DC blocking.

Can DF5A3.3F(TE85L,F) be used for USB 3.0 or PCIe Gen2+ interfaces?

No. DF5A3.3F(TE85L,F) has 115 pF typical capacitance, which exceeds the ≤1.5 pF requirement for SuperSpeed USB 3.0 and PCIe Gen2+ differential signaling. It is validated only for USB 2.0 (480 Mbps), SDIO (104 MHz), and HDMI 1.4 (HPD/CEC) where its 115 pF value maintains acceptable signal integrity.

What does the marking "3.3" on DF5A3.3F(TE85L,F) indicate?

The "3.3" in DF5A3.3F(TE85L,F) denotes the nominal Zener voltage of 3.3 V, with a guaranteed range of 3.1–3.5 V at I_Z = 5 mA. This value defines the clamping voltage threshold during ESD events and is measured per JEITA ED-4701 standard test conditions-not a DC regulation point.

Is DF5A3.3F(TE85L,F) RoHS compliant?

Yes. DF5A3.3F(TE85L,F) complies with EU RoHS Directive 2011/65/EU. Toshiba confirms lead-free termination and halogen-free molding compound in its official environmental compliance documentation, and the device carries the "RoHS compliant" marking on packaging labels per TOSHIBA's product change notices.

Why does DF5A3.3F(TE85L,F) have five pins but only four protection channels?

DF5A3.3F(TE85L,F) uses a common-anode architecture: Pins 1, 3, 4, and 5 are individual cathodes for Channels 1–4, while Pin 2 is the shared anode connected internally to all four diodes. This 5-pin configuration enables compact quad integration with a single ground reference, reducing layout complexity versus four independent diodes.

DF5A3.3F(TE85L,F) Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Package/Case:: SC-74A, SOT-753

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Zener

Unidirectional Channels:: 4

Bidirectional Channels:: -

Voltage - Reverse Standoff (Typ):: 1V

Voltage - Breakdown (Min):: 3.1V

Voltage - Clamping (Max) @ Ipp:: -

Current - Peak Pulse (10/1000µs):: -

Power - Peak Pulse:: -

Power Line Protection:: No

Applications:: General Purpose

Capacitance @ Frequency:: 115pF @ 1MHz

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SMV

DF5A3.3F(TE85L,F) FAQ

1.How can I place an order for DF5A3.3F(TE85L,F) through Aetrix?

Please submit a Request for Quotation (RFQ) for DF5A3.3F(TE85L,F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF5A3.3F(TE85L,F) reliable?

The price and inventory of DF5A3.3F(TE85L,F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF5A3.3F(TE85L,F) is usually 5 days.

3.What payment methods are accepted for DF5A3.3F(TE85L,F)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF5A3.3F(TE85L,F) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF5A3.3F(TE85L,F)?

DF5A3.3F(TE85L,F) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF5A3.3F(TE85L,F) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF5A3.3F(TE85L,F)?

For technical support, including DF5A3.3F(TE85L,F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF5A3.3F(TE85L,F) requirements.

6.How does Aetrix verify that DF5A3.3F(TE85L,F) is sourced from the original manufacturer or authorized distributors?

All DF5A3.3F(TE85L,F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF5A3.3F(TE85L,F) meets industry standards.

7.What is the process for return or replacement of DF5A3.3F(TE85L,F)?

All DF5A3.3F(TE85L,F) units undergo pre-shipment inspection (PSI). If there is an issue with DF5A3.3F(TE85L,F), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF5A3.3F(TE85L,F) part is unused and in its original packaging.

Return procedure for DF5A3.3F(TE85L,F):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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