Analog Devices Inc./Maxim Integrated DS9502P
- Part No.:
- DS9502P
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- TVS Diodes
- Package:
- 6-SMD, J-Lead
- Datasheet:
-
DS9502P.pdf
- Description:
- TVS DIODE 7.5VWM 6TSOC
- Quantity:
- Payment:

- Shipping:

Inventory:3,228
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Product details
Overview
DS9502P from Dallas Semiconductor (now Texas Instruments) is a symmetric dual-port bidirectional ESD protection diode in a 6-lead TSOC surface-mount package, designed for SRAM-based battery-buffered portable memory modules. It features 7.5V Zener clamping, snapback-triggered ESD suppression (27 kV IEC 801-2), 55 pF junction capacitance at 5 V, ≤100 nA leakage at 7.0 V, and industrial temperature range (–40°C to +85°C).
For engineers reviewing the DS9502P datasheet, DS9502P pinout, DS9502P application, or DS9502P equivalent, key selection considerations include its bidirectional snapback behavior, low-capacitance interface protection for high-speed memory I/O lines, avalanche voltage stability (7.4–7.8 V), holding voltage (5.5 V), and compatibility with all 5 V logic families without signal attenuation.
Technical Context
The DS9502P operates as a bidirectional Zener-based transient suppressor with symmetric dual-port bondout-pins 1&6 and 2&5 are internally paired to maximize energy dissipation across both ports. Its snapback characteristic initiates at 9.0–9.5 V trigger voltage and sustains conduction at 5.5 V holding voltage with ≥30 mA holding current.
It delivers 2.0 A peak pulse current (8/20 µs), supports ±160 mA continuous bidirectional current, and maintains ≤100 nA leakage at 7.0 V while exhibiting 55 pF capacitance at 5 V bias-critical for preserving signal integrity on memory data/address buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Avalanche Voltage | 7.4–7.8 V - defines clamping threshold during sustained overvoltage events |
| Trigger Voltage | 9.0–9.5 V - initiates snapback transition to low-voltage conduction mode |
| Holding Voltage | 5.5 V - stable clamping level maintained during ESD pulse discharge |
| Junction Capacitance @ 5 V | 55 pF - minimizes signal distortion on high-speed memory I/O lines |
| Leakage Current @ 7.0 V | ≤100 nA - ensures negligible standby power draw and no logic-level interference |
| Peak Pulse Current | 2.0 A (8/20 µs) - meets IEC 801-2 Level 4 (27 kV contact discharge) requirement |
| Operating Temperature | –40°C to +85°C - supports industrial-grade portable memory module deployment |
Pinout & Package
DS9502P uses a 6-lead TSOC surface-mount package (3.7 × 4.0 × 1.5 mm), optimized for low inductance and space-constrained PCB layouts in portable memory modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 & 6 | Anode/Cathode pair (Port A) | Internally bonded symmetric port for bidirectional ESD current path; pins tied together in layout |
| 2 & 5 | Anode/Cathode pair (Port B) | Second symmetric port enabling dual-line protection with balanced energy dissipation |
| 3 & 4 | Package substrate / thermal pad | Not electrically connected; provides mechanical stability and thermal relief via soldered pad |
Key Features
| Feature | Design Value |
|---|---|
| Zener snapback clamping | Enables low-voltage (5.5 V) sustained conduction after 9.0–9.5 V trigger-reducing stress on downstream memory I/O |
| Symmetric dual-port bondout | Equal current sharing between two independent I/O paths (e.g., data bus lanes), improving thermal balance and reliability |
| Low 55 pF junction capacitance | Preserves signal rise/fall times on 5 V SRAM interfaces up to ~100 MHz without measurable degradation |
| Industrial temperature operation | Validated performance from –40°C to +85°C-suitable for battery-buffered modules in uncontrolled environments |
| 5 V logic family compatibility | No level-shifting required; integrates directly with TTL, CMOS, and LVTTL memory controllers and buffers |
Applications
| Portable SRAM Memory Modules | Industrial Data Loggers |
|---|---|
Use Scenario: Battery-backed SRAM modules used in handheld test equipment require robust ESD immunity during field handling and hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed inline on address/data bus lines upstream of SRAM die. Use Value: Raises system-level ESD rating to >27 kV (IEC 801-2), preventing latch-up or gate oxide damage to memory I/O cells. | Use Scenario: Remote environmental sensors log data to nonvolatile SRAM with periodic battery replacement and field maintenance. IC Role / Device Role / Timing Role: Standby-mode ESD protector on memory control lines exposed to operator-accessible connectors. Use Value: Maintains <100 nA leakage at 7.0 V, eliminating battery drain while delivering fail-safe short-circuit failure mode. |
| Medical Diagnostic Handhelds | Avionics Data Recorders |
Use Scenario: Portable ultrasound or ECG units store waveform snapshots in battery-buffered SRAM before upload. IC Role / Device Role / Timing Role: Low-capacitance (55 pF) transient suppressor on parallel memory bus to preserve timing margins. Use Value: Prevents signal attenuation and timing skew on multi-bit data paths operating near 50–80 MHz clock rates. | Use Scenario: Flight data recorders use SRAM caches for real-time buffering prior to EEPROM write cycles. IC Role / Device Role / Timing Role: Dual-port protection device guarding both read and write control lines against aircraft static discharge. Use Value: Symmetric bondout ensures equal energy absorption across critical control signals, avoiding single-point failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4105MR6T1G | Quad-channel 5.5 V unidirectional TVS; 30 pF @ 0 V; 30 kV ESD rating; SOT-563 package | Designed for general-purpose I/O line protection-not optimized for symmetric dual-port memory bus clamping | Preferred where board space allows discrete per-line protection and lower capacitance is prioritized over dual-port integration |
| Vishay SMAJ5.0A | Single-channel 5.0 V unidirectional TVS; 500 pF @ 0 V; 30 kW peak power; DO-214AC package | Larger footprint, higher capacitance, and unidirectional response limit suitability for bidirectional memory bus use | Applicable only for low-speed, non-multiplexed control lines where size and capacitance are secondary concerns |
Compared with NUP4105MR6T1G and SMAJ5.0A, the DS9502P uniquely delivers symmetric dual-port snapback clamping in a compact TSOC package-enabling matched protection for parallel memory buses without adding channel count or layout complexity.
Availability
DS9502P is available at Aetrix Electronics and suitable for portable SRAM memory modules, industrial data loggers, and medical diagnostic handhelds requiring stable component supply and long-term lifecycle support.
Supply support for DS9502P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Dallas Semiconductor, acquired by Maxim Integrated in 2001 and later by Analog Devices in 2021, specialized in precision analog, timing, and interface solutions for industrial and embedded systems.
The DS9502P belongs to Dallas' ESD protection diode product line, engineered specifically to augment built-in memory I/O protection in battery-buffered SRAM modules with fail-safe snapback behavior and minimal signal impact.
FAQ
What is the primary function of the DS9502P in a memory module design?
The DS9502P serves as a bidirectional ESD protection diode that augments the internal ESD structures of SRAM chips in battery-buffered portable memory modules. It triggers into snapback mode above 9.0 V, clamping transients to 5.5 V while sustaining 2.0 A peak current-raising system-level immunity to over 27 kV per IEC 801-2. The DS9502P fails short-circuit under overstress, protecting downstream memory I/O.
How does the DS9502P differ from standard unidirectional TVS diodes?
Unlike unidirectional TVS diodes, the DS9502P features symmetric dual-port bondout (pins 1&6 and 2&5) enabling true bidirectional clamping with matched characteristics in both directions. Its Zener-based snapback behavior-triggering at 9.0–9.5 V and holding at 5.5 V-provides lower clamping voltage than typical avalanche TVS devices. The DS9502P also exhibits only 55 pF capacitance at 5 V, significantly less than most unidirectional alternatives.
What is the significance of the DS9502P's 55 pF junction capacitance value?
The DS9502P's 55 pF junction capacitance at 5 V bias minimizes loading on high-speed memory data and address lines, preserving signal integrity and timing margins in SRAM interfaces operating up to ~100 MHz. This low capacitance prevents excessive rise/fall time degradation and avoids false triggering or data corruption-critical for reliable operation in portable memory modules. The DS9502P achieves this without compromising ESD robustness.
Does the DS9502P require external biasing or control circuitry?
No, the DS9502P operates passively and requires no external biasing, control signals, or power supply. During normal operation, it presents ≤100 nA leakage at 7.0 V and behaves like a standard 7.5 V Zener diode. It automatically transitions into snapback mode when voltage exceeds 9.0 V and returns to high-impedance state once current falls below 30 mA. The DS9502P integrates seamlessly into existing memory bus layouts without design overhead.
What failure mode does the DS9502P exhibit under extreme ESD overstress?
Under ESD events exceeding its absolute maximum ratings, the DS9502P fails in a short-circuit mode-thereby diverting subsequent transients away from sensitive SRAM I/O structures and preventing further damage to the memory module. This fail-safe behavior is explicitly designed into the DS9502P and documented in its datasheet. The DS9502P's controlled short-circuit failure preserves system-level functionality longer than open-failure protectors.
DS9502P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 6-SMD, J-Lead
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 7.5V
- Voltage - Breakdown (Min):
- 9V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOC
DS9502P FAQ
1.How can I place an order for DS9502P through Aetrix?
Please submit a Request for Quotation (RFQ) for DS9502P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS9502P reliable?
The price and inventory of DS9502P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS9502P is usually 5 days.
3.What payment methods are accepted for DS9502P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS9502P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS9502P?
DS9502P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS9502P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS9502P?
For technical support, including DS9502P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS9502P requirements.
6.How does Aetrix verify that DS9502P is sourced from the original manufacturer or authorized distributors?
All DS9502P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS9502P meets industry standards.
7.What is the process for return or replacement of DS9502P?
All DS9502P units undergo pre-shipment inspection (PSI). If there is an issue with DS9502P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS9502P part is unused and in its original packaging.
Return procedure for DS9502P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS9502P Tags

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Toshiba Semiconductor and Storage

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Diodes Incorporated
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