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Analog Devices Inc./Maxim Integrated DS9503P+

Part No.:
DS9503P+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
TVS Diodes
Package:
6-SMD, J-Lead
Datasheet:
AetrixDS9503P+.pdf
Description:
TVS DIODE 7.5VWM 6TSOC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:10,278

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Product details

Overview

DS9503P+ from Maxim Integrated is a monolithic ESD protection diode with integrated 5Ω anode/cathode isolation resistors, designed specifically for 1-Wire MicroLAN interfaces. It features snap-back Zener behavior (VTRIGGER = 10–11 V), low leakage (≤100 nA), low capacitance (CJ5 = 40 pF), and industrial temperature operation (–40°C to +85°C) to safeguard bidirectional data lines in embedded sensor networks.

For engineers reviewing the DS9503P+ datasheet, DS9503P+ pinout, DS9503P+ application, or DS9503P+ equivalent, key selection criteria include snap-back voltage stability, on-chip 5Ω isolation resistance, IEC 801-2-level ESD robustness (>27 kV when paired with port-level protection), and TSOC package compatibility with 1-Wire bus timing constraints.

Technical Context

The DS9503P+ implements a Zener-based snap-back clamping architecture where conduction initiates at VTRIGGER (10–11 V), transitions to low-voltage holding mode (VHOLD = 5.5 V) above IHOLD (11 mA), and sustains up to 2.0 A peak current (IPP) during ESD transients. Its dual 5Ω on-die resistors isolate protected circuitry without degrading 1-Wire signal integrity under normal operation.

It operates as a bidirectional device referenced cathode-to-anode, with avalanche voltage (VAV) specified from 7.4 V to 11.05 V and junction capacitance of 40 pF at 5 V bias - optimized to minimize signal attenuation on low-speed, open-drain 1-Wire buses while maintaining <100 nA leakage at 7.0 V.

Key Specifications

ParameterValue and Actual Design Meaning
VTRIGGER10–11 V: Voltage threshold initiating snap-back clamping to protect against fast ESD transients on 1-Wire lines.
VHOLD5.5 V: Sustained low-voltage clamping level during ESD event, limiting downstream voltage stress.
IPP2.0 A: Maximum peak current handling capacity per IEC 61000-4-2 Level 4 testing conditions.
CJ540 pF: Junction capacitance at 5 V reverse bias - low enough to avoid distorting 1-Wire timing waveforms.
RI5 Ω: On-chip isolation resistance at both anode and cathode terminals, adding series impedance during ESD without affecting DC logic levels.
IL≤100 nA at 7.0 V: Ultra-low leakage ensures minimal standby power draw and signal loading on MicroLAN buses.
TA–40°C to +85°C: Full industrial temperature range support for deployment in harsh embedded environments.

Pinout & Package

DS9503P+ uses a 6-lead TSOC surface-mount package - compact, low-inductance, and RoHS-compliant - optimized for high-frequency ESD pulse suppression on space-constrained PCBs.

Pin/TerminalCircuit RoleDesign Meaning
1 (Anode)Anode connection of primary Zener pathInput terminal for positive ESD transients; tied internally to 5 Ω resistor before external node.
2 (Cathode)Cathode connection of primary Zener pathReference terminal for clamping; tied internally to 5 Ω resistor before external node; voltage measured cathode-to-anode.
3 (NC)No connectInternally unconnected; must remain floating per datasheet layout guidance.
4 (Anode)Anode connection of secondary Zener pathEnables bidirectional clamping; symmetric to Pin 1 with identical 5 Ω isolation.
5 (Cathode)Cathode connection of secondary Zener pathCompletes bidirectional structure; symmetric to Pin 2 with identical 5 Ω isolation.
6 (NC)No connectInternally unconnected; must remain floating per datasheet layout guidance.

Key Features

FeatureDesign Value
Snap-back Zener clampingEnables stable low-voltage hold state (5.5 V) after trigger, reducing thermal stress vs. standard Zener clamp.
Integrated 5 Ω isolation resistorsProvides additional series impedance during ESD events without requiring external components or board area.
Low 40 pF junction capacitance at 5 VPreserves rise/fall times on 1-Wire signals (typ. 15 µs) without introducing timing skew or false edge detection.
Bidirectional ESD protectionProtects against ±ESD pulses using dual symmetrical Zener paths - essential for open-drain bidirectional MicroLAN data line.
Industrial temperature ratingValidated operation from –40°C to +85°C supports deployment in automotive body electronics and industrial sensor nodes.

Applications

1-Wire Sensor NetworksEmbedded Temperature Monitoring

Use Scenario: Protecting DS18B20 or DS2401-based temperature sensors connected via long cables in HVAC or building automation systems.

IC Role / Device Role / Timing Role: Bidirectional ESD clamp on 1-Wire data line, preserving strict timing margins while absorbing contact discharge up to 27 kV.

Use Value: Prevents latch-up or permanent damage to microcontroller GPIOs during field maintenance or cable handling, extending system MTBF.

Use Scenario: Securing single-wire communication between microcontrollers and parasitically powered iButton devices in access control readers.

IC Role / Device Role / Timing Role: Low-capacitance transient suppressor placed directly at connector interface to minimize stub length and preserve 1-Wire waveform fidelity.

Use Value: Maintains reliable enumeration and read/write cycles even after repeated ESD exposure, avoiding intermittent bus failures.

Industrial MicroLAN Bus NodesAutomotive Body Electronics

Use Scenario: ESD hardening of 1-Wire slave nodes in factory floor equipment exposed to static-prone environments.

IC Role / Device Role / Timing Role: Snap-back diode with on-chip 5 Ω resistors isolating MCU I/O from transient energy while sustaining ≤100 nA leakage.

Use Value: Eliminates need for discrete resistor+diode solutions, reducing BOM count and assembly cost without sacrificing protection level.

Use Scenario: Protecting 1-Wire diagnostic ports in vehicle door modules or seat controllers subject to ISO 10605 discharge events.

IC Role / Device Role / Timing Role: RoHS-compliant TSOC-packaged ESD protector rated for –40°C to +85°C, mounted adjacent to connector for shortest possible trace path.

Use Value: Achieves >27 kV system-level ESD immunity when combined with internal MCU protection, meeting OEM qualification requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS9502P+Lacks integrated 5 Ω isolation resistors; lower ESD robustness (no >27 kV claim); same TSOC-6 package and snap-back behavior.Requires external series resistors to match DS9503P+ isolation performance; suitable only where board space allows added passives.Select DS9502P+ only if cost sensitivity outweighs need for integrated protection and higher system-level ESD margin.
TPD1E10B06DPYRSingle-channel, 1-line ESD protector with 0.5 pF capacitance and 12 kV IEC 61000-4-2 rating; no snap-back or on-die resistors.Optimized for high-speed USB/USB-C; not validated for 1-Wire timing or snap-back hold-state reliability.Use TPD1E10B06DPYR only for generic low-capacitance I/O protection - not recommended for MicroLAN bus integrity or high-energy ESD scenarios.

Compared with DS9502P+, DS9503P+ delivers superior system-level ESD immunity via integrated 5 Ω resistors and verified >27 kV performance; compared with TPD1E10B06DPYR, it provides purpose-built snap-back clamping and 1-Wire timing compliance - making DS9503P+ the only option qualified for robust MicroLAN interface protection.

Availability

DS9503P+ is available at Aetrix Electronics and suitable for 1-Wire sensor networks, embedded temperature monitoring, and industrial MicroLAN bus nodes requiring stable component supply, RoHS-compliant packaging, and guaranteed ESD resilience across full industrial temperature range.

Supply support for DS9503P+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability interface ICs for industrial, automotive, and computing applications.

The DS9503P+ belongs to Maxim's dedicated ESD protection portfolio targeting 1-Wire and low-speed digital interfaces, engineered to deliver certified system-level ESD immunity without compromising signal integrity or requiring external passive components.

FAQ

What is the primary function of the DS9503P+ in a 1-Wire system?

The DS9503P+ serves as a bidirectional ESD protection device for 1-Wire MicroLAN interfaces. It uses snap-back Zener clamping with integrated 5 Ω isolation resistors to absorb high-energy transients while preserving signal timing. Its design ensures reliable bus operation in environments prone to electrostatic discharge, such as industrial sensor nodes and embedded temperature monitoring systems using the DS9503P+.

How does the snap-back behavior of the DS9503P+ differ from standard Zener clamping?

The DS9503P+ transitions from high-impedance blocking to low-voltage conduction (VHOLD = 5.5 V) after reaching VTRIGGER (10–11 V), sustaining current up to 2.0 A. Unlike standard Zeners that exhibit gradual breakdown, this snap-back action minimizes power dissipation during ESD events. This behavior is explicitly characterized in the DS9503P+ datasheet and enables higher reliability in repetitive surge conditions.

Why does the DS9503P+ include on-chip 5 Ω resistors?

The DS9503P+ integrates 5 Ω resistors at both anode and cathode terminals to provide additional series impedance during ESD events - isolating protected circuitry without affecting normal 1-Wire communication. These resistors raise system-level ESD immunity to >27 kV (IEC 801-2) when used with circuits already featuring port-level protection. This feature is unique to the DS9503P+ versus alternatives like DS9502P+.

What is the maximum operating temperature range for the DS9503P+?

The DS9503P+ is rated for continuous operation from –40°C to +85°C, meeting industrial temperature requirements. This range is validated per Absolute Maximum Ratings and Electrical Characteristics tables in the official DS9503P+ datasheet, supporting use in automotive body electronics, factory automation, and outdoor sensor deployments where ambient extremes are expected.

Can the DS9503P+ be used in place of the DS9502P+ without layout changes?

No - although both use the same TSOC-6 package, the DS9503P+ includes two internal 5 Ω resistors absent in the DS9502P+. Substituting DS9503P+ for DS9502P+ requires verifying that the added series resistance does not affect timing margins in time-critical 1-Wire implementations. The DS9503P+ is not a drop-in replacement; its enhanced protection comes with intentional design trade-offs confirmed in Maxim's DS9503P+ application notes.

DS9503P+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Package/Case:
6-SMD, J-Lead
Series:
-
Packaging:
Tube
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
7.5V
Voltage - Breakdown (Min):
-
Voltage - Clamping (Max) @ Ipp:
-
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-TSOC

DS9503P+ FAQ

1.How can I place an order for DS9503P+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS9503P+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS9503P+ reliable?

The price and inventory of DS9503P+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS9503P+ is usually 5 days.

3.What payment methods are accepted for DS9503P+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS9503P+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS9503P+?

DS9503P+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS9503P+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS9503P+?

For technical support, including DS9503P+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS9503P+ requirements.

6.How does Aetrix verify that DS9503P+ is sourced from the original manufacturer or authorized distributors?

All DS9503P+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS9503P+ meets industry standards.

7.What is the process for return or replacement of DS9503P+?

All DS9503P+ units undergo pre-shipment inspection (PSI). If there is an issue with DS9503P+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS9503P+ part is unused and in its original packaging.

Return procedure for DS9503P+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DS9503P+ Tags

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