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STMicroelectronics DSILC6-4F2
- Part No.:
- DSILC6-4F2
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 6-UFBGA, FCBGA
- Datasheet:
-
DSILC6-4F2.pdf
- Description:
- TVS DIODE 5VWM 6FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:2,387
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Product details
Overview
DSILC6-4F2 from STMicroelectronics is a monolithic ESD protection diode array designed for high-speed serial interfaces including USB 2.0, LVDS display/camera links, MDDI, SMIA, and MIPI. It provides 4-line bidirectional protection with 1.5–2.0 pF typical I/O-to-GND capacitance at 1.65 V bias, 6 V breakdown voltage, and 7 A peak pulse current (Flip-Chip), enabling signal integrity preservation in compact mobile and portable electronics.
For engineers reviewing the DSILC6-4F2 datasheet, DSILC6-4F2 pinout, DSILC6-4F2 application, or DSILC6-4F2 equivalent, key selection criteria include low inter-line capacitance (<1.2 pF), ESD robustness per IEC 61000-4-2 Level 4 (15 kV air), Flip-Chip footprint compatibility (1.1 × 1.57 mm), and compliance with MIPI/SMIA interface timing constraints.
Technical Context
The DSILC6-4F2 implements a quad-channel, rail-to-rail clamping diode array with dedicated VCC and GND terminals, optimized for transient suppression on differential or single-ended high-frequency data lines. Its monolithic silicon structure integrates four matched ESD protection paths with symmetric forward/reverse conduction characteristics.
Designed specifically for Flip-Chip mounting, it delivers <0.9 pF I/O-to-I/O capacitance at 1.65 V bias and maintains >2 GHz cutoff frequency across all channels-verified by S-parameter measurements (S21) up to 3 GHz-ensuring minimal insertion loss and crosstalk (<−120 dB at 100 MHz) in high-speed digital links.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Protection Lines | 4 independent I/O channels with common VCC and GND |
| Breakdown Voltage (VBR) | 6 V min at IR = 1 mA - ensures clamping activation before damage to 5 V-tolerant PHYs |
| I/O-to-GND Capacitance | 1.5–2.0 pF typ at 1.65 V bias - preserves signal rise/fall times in USB 2.0 (480 Mbps) and LVDS |
| Peak Pulse Current (IPP) | 7 A (8/20 µs waveform) - sustains full IEC 61000-4-2 Level 4 air discharge (15 kV) |
| Clamping Voltage (VCL) | 12 V max at IPP = 7 A - limits downstream IC stress below 13.3 V absolute maximum rating of most USB/LVDS receivers |
| ESD Rating | IEC 61000-4-2 Level 4: 8 kV contact / 15 kV air - certified for handheld and peripheral end-equipment |
| Package | Flip-Chip (1.1 mm × 1.57 mm, 0.5 mm pitch) - enables ultra-low-profile PCB layout with <1.5 mm² area |
Pinout & Package
DSILC6-4F2 uses a 6-terminal Flip-Chip package with bottom-side solder bumps. Pin assignment is defined by top-side marking "EI" and dot indicating Pin A1. The device requires precise stencil-defined copper pads (220 µm diameter) and solder mask openings (300 µm recommended).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O1 | Protected signal line 1 | ESD clamp path to VCC and GND; bidirectional conduction for ±15 kV transients |
| I/O2 | Protected signal line 2 | Independent clamp with matched capacitance and leakage to I/O1 for differential pair routing |
| I/O3 | Protected signal line 3 | Same electrical specs as I/O1/I/O2; supports multi-lane interfaces like MIPI D-PHY |
| I/O4 | Protected signal line 4 | Enables full-lane protection for 4-wire camera/display buses without added board area |
| VCC | Supply rail clamp terminal | Provides low-impedance path to absorb positive transients into power rail; rated for 5 V operation |
| GND | Reference ground terminal | Return path for negative transients; must be connected to clean system ground plane with minimal inductance |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low I/O-to-GND capacitance | 1.5–2.0 pF at 1.65 V bias - prevents signal degradation in 480 Mbps USB 2.0 eye diagrams |
| Flip-Chip footprint | 1.1 mm × 1.57 mm, 0.5 mm pitch - reduces PCB area by 48% vs. SOT-666 (2.9 mm² → 1.5 mm²) |
| MIPI/SMIA compliance | Validated for MDDI client/LCD controller and SMIA camera data/clock lanes - meets timing skew and jitter budgets |
| Monolithic integration | Single-die construction ensures channel-to-channel parameter matching (ΔC < 0.05 pF) for balanced differential signaling |
| Lead-free & RoHS | ECOPACK® qualified with lead-free second-level interconnect - compliant with JEDEC JESD97 marking standards |
Applications
| Mobile Camera Interface | USB 2.0 Peripheral Port |
|---|---|
Use Scenario: Protection of SMIA/MIPI D-PHY data and clock lanes between image sensor and baseband processor in smartphones. IC Role / Device Role / Timing Role: ESD clamp on bidirectional high-speed differential pairs (DATA+, DATA−, CLK+, CLK−) operating at 1–2 Gbps. Use Value: Maintains <0.1 UI jitter increase under 15 kV ESD stress due to sub-1 pF inter-line capacitance and matched channel response. | Use Scenario: ESD hardening of upstream/downstream USB 2.0 data lines (D+, D−) on OTG adapters and docking stations. IC Role / Device Role / Timing Role: Bidirectional transient suppressor placed immediately after USB connector, before transceiver PHY. Use Value: Enables full-speed (12 Mbps) and high-speed (480 Mbps) compliance with <150 mV signal distortion at 200 MHz bandwidth. |
| LCD Display Link | LVDS Video Interface |
Use Scenario: Protection of MDDI or SLIMbus lanes connecting application processor to primary/secondary LCD panels in clamshell handsets. IC Role / Device Role / Timing Role: Low-capacitance shunt clamp on strobe and data lines carrying frame-buffered video at ~300 Mbps. Use Value: Prevents pixel corruption during hot-plug events by clamping transients within 1 ns while adding <0.3 ps group delay variation. | Use Scenario: Transient suppression on LVDS pairs driving automotive infotainment displays or industrial panel PCs. IC Role / Device Role / Timing Role: Rail-to-rail ESD protection on differential video signals (TX+/TX−, RX+/RX−) operating at 650 Mbps. Use Value: Achieves >35 dB common-mode rejection at 1 GHz due to symmetrical layout and matched parasitics across all four channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DSILC6-4P6 | SOT-666 package (2.9 mm²); higher I/O-GND capacitance (1.8–2.5 pF at 0 V) | Better suited for cost-sensitive, non-space-constrained designs with lower-speed interfaces (≤100 Mbps) | Select when board real estate allows larger footprint and USB 2.0 signal integrity margin is >20% |
| USBLC6-2SC6 | Dual-line configuration; optimized for USB-specific D+/D− only; 0.8 pF typ capacitance | Limited to 2-line protection; lacks VCC clamp and MIPI/SMIA validation | Choose only for dedicated USB 2.0 ports where 4-line coverage is unnecessary and layout space is extremely tight |
Compared with DSILC6-4P6 and USBLC6-2SC6, DSILC6-4F2 uniquely balances 4-line protection, Flip-Chip miniaturization, and MIPI/SMIA compliance-making it the sole option for space-constrained camera/display modules requiring simultaneous high-speed, low-capacitance, and multi-standard interoperability.
Availability
DSILC6-4F2 is available at Aetrix Electronics and suitable for mobile camera modules, USB 2.0 peripheral ports, and LVDS video interfaces requiring stable component supply, consistent Flip-Chip assembly yield, and long-term ESD reliability certification.
Supply support for DSILC6-4F2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and control solutions across automotive, industrial, and consumer markets.
The DSILC6-4F2 belongs to ST's ECOPACK®-qualified ESD protection portfolio, engineered specifically for high-speed digital interfaces in portable electronics where board space, signal fidelity, and IEC 61000-4-2 compliance are co-constrained design priorities.
FAQ
What is the maximum operating temperature for DSILC6-4F2?
The DSILC6-4F2 has a maximum junction temperature (Tj) of 125 °C and a storage temperature range of −55 °C to +150 °C. Thermal performance is validated under reflow conditions up to 260 °C for 10 seconds, matching standard lead-free soldering profiles used in Flip-Chip assembly.
Does DSILC6-4F2 require external bias or control signals?
No. DSILC6-4F2 operates passively with no external bias, enable pins, or control logic. It functions solely as a voltage-triggered clamp: conduction begins at ~6 V (breakdown), limiting transient voltages to ≤12 V at 7 A peak current without power supply connection beyond VCC and GND rails.
How does DSILC6-4F2 compare to TVS diodes in USB 2.0 protection?
Unlike general-purpose TVS diodes, DSILC6-4F2 offers 1.5–2.0 pF I/O-to-GND capacitance (vs. typical 5–15 pF), preserving USB 2.0 eye opening and reducing bit error rates. Its monolithic 4-channel architecture also eliminates inter-channel skew and simplifies layout versus discrete dual-TVS solutions.
Can DSILC6-4F2 be used on MIPI C-PHY lanes?
No. DSILC6-4F2 is characterized and validated for MIPI D-PHY (2-level differential signaling), not C-PHY (3-level ternary). Its clamping behavior and capacitance profile meet D-PHY timing requirements (tskew, tsettle) but have not been tested against C-PHY's 1.5–2.5 V swing and multi-phase encoding.
DSILC6-4F2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 6-UFBGA, FCBGA
- Series:
- DSI
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 120W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 2.5pF @ 1MHz
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-FlipChip (1.57x1.1)
DSILC6-4F2 FAQ
1.How can I place an order for DSILC6-4F2 through Aetrix?
Please submit a Request for Quotation (RFQ) for DSILC6-4F2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DSILC6-4F2 reliable?
The price and inventory of DSILC6-4F2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSILC6-4F2 is usually 5 days.
3.What payment methods are accepted for DSILC6-4F2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DSILC6-4F2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DSILC6-4F2?
DSILC6-4F2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DSILC6-4F2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DSILC6-4F2?
For technical support, including DSILC6-4F2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DSILC6-4F2 requirements.
6.How does Aetrix verify that DSILC6-4F2 is sourced from the original manufacturer or authorized distributors?
All DSILC6-4F2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSILC6-4F2 meets industry standards.
7.What is the process for return or replacement of DSILC6-4F2?
All DSILC6-4F2 units undergo pre-shipment inspection (PSI). If there is an issue with DSILC6-4F2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DSILC6-4F2 part is unused and in its original packaging.
Return procedure for DSILC6-4F2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DSILC6-4F2 Tags
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