STMicroelectronics ESD051-1BF4
- Part No.:
- ESD051-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESD051-1BF4.pdf
- Description:
- TVS DIODE 5VWM 11VC ST0201
- Quantity:
- Payment:

- Shipping:

Inventory:34,114
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Product details
Overview
ESD051-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode in ST0201 package (0.6 mm × 0.3 mm, 0.3 mm height) designed for ESD protection of 5 V power lines. It delivers 11 V clamping voltage at 30 ns under IEC 61000-4-2 contact discharge, 45 pF line capacitance at 1 MHz, and 70 nA leakage at 5 V - enabling compact, low-distortion protection in high-density portable electronics.
For engineers reviewing the ESD051-1BF4 datasheet, ESD051-1BF4 pinout, ESD051-1BF4 application, or ESD051-1BF4 equivalent, key selection criteria include clamping voltage stability under ±30 kV air/contact ESD stress, dynamic resistance (0.145 Ω), junction temperature range (–55 to 150 °C), and ST0201 footprint compatibility with fine-pitch PCB assembly.
Technical Context
This device operates as a low-capacitance, bidirectional transient voltage suppressor optimized for I/O and power rail protection in space-constrained mobile platforms. Its silicon avalanche structure enables sub-11 V clamping at 30 ns with <70 nA leakage at VRM = 5 V and 0.145 Ω dynamic resistance during 8/20 μs transients.
The ST0201 package supports automated placement with 0.14 mm nominal terminal width and 0.6 mm body length, requiring precise stencil aperture (75 µm thickness) and reflow profile adherence (peak 240–245 °C) to ensure solder joint integrity without shorting or tombstoning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clamping Voltage (VCL) | 11 V at 30 ns (IEC 61000-4-2 contact discharge) - limits downstream IC voltage stress during ESD events |
| Reverse Working Voltage (VRM) | 5 V - matches standard USB/VBUS and logic supply rails without leakage penalty |
| Leakage Current (IR) | 70 nA at 5 V - minimizes standby power loss in battery-powered devices |
| Line Capacitance (CLINE) | 45 pF at 1 MHz - preserves signal integrity on high-speed interfaces like USB 2.0 or MIPI D-PHY |
| Peak Pulse Power (PPP) | 110 W (8/20 μs) - sustains multiple ESD strikes without degradation |
| Dynamic Resistance (RD) | 0.145 Ω - ensures rapid voltage collapse during fast transients, reducing energy dissipation in protected circuitry |
| ESD Rating | ±30 kV air & contact discharge (IEC 61000-4-2 Level 4 exceeded) - meets industrial and consumer immunity requirements |
Pinout & Package
ESD051-1BF4 uses the ST0201 ultra-miniature surface-mount package (0.60 mm × 0.30 mm × 0.30 mm), optimized for high-density PCB layouts and automated assembly. The two-terminal device has no polarity marking requirement due to bidirectional symmetry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Common connection point for protected line - interchangeable with Pin 2 due to symmetrical avalanche structure |
| Pin 2 | Anode/Cathode (bidirectional) | Second terminal forming the TVS junction - identical electrical role to Pin 1; orientation agnostic in layout |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD suppression | Enables single-device protection of AC-coupled or dual-polarity lines (e.g., USB D+/D−, audio jack rings) without polarity concerns |
| Ultra-low clamping voltage | 11 V peak at 30 ns ensures protected ICs (e.g., PMICs, baseband processors) remain within absolute maximum ratings during ±30 kV ESD events |
| ST0201 footprint compatibility | 0.6 mm × 0.3 mm body allows placement in <0.8 mm pitch routing zones - critical for smartphone camera modules and SIM card slots |
| 45 pF line capacitance | Preserves rise/fall times on 480 Mbps USB 2.0 signals (<1% distortion) while maintaining robust ESD margin |
| –55 °C to 150 °C operating range | Supports operation in automotive infotainment displays and industrial handhelds exposed to extended thermal cycling |
Applications
| Smartphone Power Rail Protection | USB 2.0 Data Line Protection |
|---|---|
Use Scenario: Protecting VBUS and charging IC inputs against user-handling ESD in slim-profile smartphones. IC Role / Device Role / Timing Role: Bidirectional TVS placed directly at USB-C connector, clamping transients before reaching PMIC overvoltage protection circuitry. Use Value: 11 V clamping prevents latch-up in 5 V tolerant USB power switches while 45 pF avoids signal integrity degradation on 480 Mbps data paths. | Use Scenario: Shielding differential USB 2.0 D+ and D− lines from cable-discharge events in tablets and accessories. IC Role / Device Role / Timing Role: One ESD051-1BF4 per line (D+, D−) mounted adjacent to connector, leveraging bidirectional symmetry to handle both positive/negative transients. Use Value: 70 nA leakage preserves battery life in always-on USB suspend states; 0.145 Ω RD ensures <1 ns response to 1 kV/μs ESD edges. |
| Digital Camera Image Sensor Interface | Portable Audio Jack ESD Guard |
Use Scenario: Safeguarding MIPI CSI-2 clock and data lanes in compact digital cameras exposed to frequent handling. IC Role / Device Role / Timing Role: Low-capacitance TVS placed inline between image sensor and SoC, minimizing added jitter on 1 GHz+ clock signals. Use Value: 45 pF capacitance maintains <0.5 ps RMS jitter increase on 1.5 GHz MIPI clocks, verified per JEDEC JESD22-A114E test conditions. | Use Scenario: Preventing pop-noise and amplifier damage from ESD on 3.5 mm TRRS headphone jacks in wireless earbuds and portable speakers. IC Role / Device Role / Timing Role: Bidirectional clamp across tip/ring contacts, absorbing ±8 kV contact discharges before reaching audio codec input stages. Use Value: 11 V clamping protects 3.3 V tolerant audio amplifiers; ST0201 size fits within 1.2 mm board edge clearance constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor SZ1.5SMC5.0AT3G | DO-214AB package (4.5 mm × 3.9 mm), 13.3 V clamping, 100 pF capacitance | Requires >10× more board area; suitable only where space is unconstrained and higher capacitance acceptable | Select only when ST0201 footprint is incompatible and clamping voltage margin >2.3 V is available |
| Vishay ESDBLE5.0D1W | 0402 package (1.0 mm × 0.5 mm), 12.5 V clamping, 30 pF capacitance, 100 nA leakage | Lower capacitance but higher leakage and clamping; requires revised layout for larger pad geometry | Prefer for ultra-low-capacitance needs (e.g., USB 3.0 Gen1), accepting trade-off in leakage and ESD margin |
Compared with SZ1.5SMC5.0AT3G and ESDBLE5.0D1W, ESD051-1BF4 uniquely balances ultra-small ST0201 size, 11 V clamping, and 45 pF capacitance - making it optimal for next-gen mobile power rail and high-speed interface protection where board area and signal fidelity are co-constrained.
Availability
ESD051-1BF4 is available at Aetrix Electronics and suitable for smartphone power rail protection, USB 2.0 data line hardening, digital camera image sensor interfaces, and portable audio jack ESD guard applications requiring stable component supply and consistent STMicroelectronics manufacturing traceability.
Supply support for ESD051-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
ESD051-1BF4 belongs to ST's ECOPACK®-qualified ESD protection portfolio, engineered specifically for ultra-compact, high-reliability transient suppression in portable electronics with stringent space and signal-integrity constraints.
FAQ
What is the maximum continuous reverse working voltage for ESD051-1BF4?
The maximum continuous reverse working voltage (VRM) is 5 V, verified per DS12643 Rev 4 Table 2. This rating defines the highest DC or RMS voltage the device can withstand without significant leakage current - critical for compatibility with standard 5 V USB power rails and logic interfaces.
Does ESD051-1BF4 require orientation-specific placement on PCB?
No - ESD051-1BF4 is fully bidirectional with symmetric I-V characteristics. Pin 1 and Pin 2 are electrically interchangeable, and marking rotation (0°, 90°, or 180°) is permitted per Figure 9 to accommodate assembly location differentiation without functional impact.
How does the 45 pF line capacitance affect USB 2.0 signal integrity?
At 45 pF, ESD051-1BF4 introduces <0.5% rise-time degradation on 480 Mbps USB 2.0 signals (200 ps edge), confirmed by S21 attenuation data in Figure 7 (–0.8 dB at 240 MHz). This meets USB-IF eye diagram mask requirements when placed within 3 mm of the connector.
What reflow profile parameters are mandatory for ST0201 assembly?
Per DS12643 Rev 4 Section 3.6, peak reflow temperature must be 240–245 °C for 60–90 seconds, with ramp rates ≤3 °C/s pre-peak and ≤2 °C/s cooling. Exceeding 245 °C risks die attach delamination; violating ramp rates causes solder paste slump or voiding in the 0.14 mm terminals.
ESD051-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 0201 (0603 Metric)
- Series:
- ESD
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 5.8V
- Voltage - Clamping (Max) @ Ipp:
- 11V (Typ)
- Current - Peak Pulse (10/1000µs):
- 10A (8/20µs)
- Power - Peak Pulse:
- 110W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 45pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- ST0201
ESD051-1BF4 FAQ
1.How can I place an order for ESD051-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD051-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD051-1BF4 reliable?
The price and inventory of ESD051-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD051-1BF4 is usually 5 days.
3.What payment methods are accepted for ESD051-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD051-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD051-1BF4?
ESD051-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD051-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD051-1BF4?
For technical support, including ESD051-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD051-1BF4 requirements.
6.How does Aetrix verify that ESD051-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESD051-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD051-1BF4 meets industry standards.
7.What is the process for return or replacement of ESD051-1BF4?
All ESD051-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESD051-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD051-1BF4 part is unused and in its original packaging.
Return procedure for ESD051-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD051-1BF4 Tags

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Diodes Incorporated

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Nexperia USA Inc.

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Toshiba Semiconductor and Storage

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Diodes Incorporated
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