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onsemi ESD1014MUTAG
- Part No.:
- ESD1014MUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UFDFN Exposed Pad
- Datasheet:
-
ESD1014MUTAG.pdf
- Description:
- TVS DIODE 3.3VWM 11VC 10UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,194
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Product details
Overview
ESD1014MUTAG from onsemi is a low-capacitance (max 5.0 pF I/O-to-GND), bidirectional ESD protection diode array in UDFN10 package, rated for 30 kV IEC 61000−4−2 contact discharge and 8 kV HBM, designed to safeguard high-speed USB 2.0, DVI, and Gigabit Ethernet data lines against transient surges.
For engineers reviewing the ESD1014MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage ≤11 V at 25 A, VRWM = 3.3 V, junction temperature range of −40°C to +125°C, and Pb-free UDFN10 (2.6×2.6 mm) packaging with exposed thermal pad.
Technical Context
This device implements a monolithic silicon avalanche diode array optimized for high-speed signal integrity: all I/O pins feature matched low capacitance (3.8–5.0 pF at 1 MHz, 0 V bias) and symmetric bidirectional clamping to GND, enabling protection without signal distortion on differential or single-ended lines.
It meets IEC 61000−4−2 Level 4 (30 kV contact), IEC 61000−4−4 (EFT), and IEC 61000−4−5 surge immunity standards, with a peak pulse current rating of 30 A (8/20 µs waveform) and clamping voltage of 7.5 V (I/O-to-GND, IPP = 1 A) rising to 11 V at 25 A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 3.3 V - Maximum continuous reverse operating voltage; ensures no leakage or conduction during normal 3.3 V data line operation. |
| VBR (min) | 5.0 V - Breakdown threshold at 1 mA test current; guarantees reliable turn-on before system-level damage occurs. |
| CJ (max, I/O–GND) | 5.0 pF - Low capacitance preserves signal rise/fall times and minimizes bit error rate in USB 2.0 and Gigabit Ethernet links. |
| VC (I/O–GND, IPP = 10 A) | 9.0 V - Clamping voltage limits transient overvoltage seen by downstream PHY or controller under realistic surge conditions. |
| IPP (max) | 30 A - Peak pulse current handling per IEC 61000−4−2 8/20 µs waveform; supports robust multi-event surge resilience. |
| TJ Range | −40°C to +125°C - Full automotive-grade junction temperature range enables deployment in industrial and infotainment systems. |
Pinout & Package
ESD1014MUTAG is housed in a Pb-free UDFN10 (Case 517AN) package measuring 2.6 mm × 2.6 mm × 0.55 mm with 0.5 mm pitch and an exposed thermal pad on the bottom for enhanced power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9 | I/O | Four independent protected signal lines; each internally connected to GND via bidirectional avalanche diodes. |
| 2, 4, 6, 8, 10 | N/C | No-connect terminals - electrically isolated; must remain unconnected per datasheet layout guidance. |
| 5 | VP | Power rail clamp node - connects to local 3.3 V supply to enable dual-directional clamping between I/O and VP/GND. |
| Bottom Pad | GND | Exposed thermal and electrical ground plane - requires soldered connection to PCB ground pour for thermal performance and ESD return path. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional I/O clamping | Enables protection of AC-coupled or differential signals (e.g., USB D+/D−) without polarity constraints. |
| IEC 61000−4−2 Level 4 compliance | Guarantees survivability against 30 kV contact ESD events - exceeds industrial and automotive EMC requirements. |
| AEC−Q101 qualification | Validated for automotive electronics use including infotainment, ADAS camera links, and telematics modules. |
| Low I/O-to-GND capacitance (typ. 3.8 pF) | Maintains signal integrity up to 480 Mbps (USB 2.0) and 1.25 Gbps (Gigabit Ethernet) without measurable jitter penalty. |
Applications
| USB 2.0 Interface Protection | DVI/HDMI Data Lane Protection |
|---|---|
Use Scenario: Protecting upstream/downstream USB 2.0 ports on laptops, docking stations, and peripherals from user-handling ESD events. IC Role / Device Role / Timing Role: Standoff diode array placed directly at connector, clamping transients before they reach USB transceiver PHY. Use Value: Prevents lockup or damage to USB controllers while maintaining <1% signal attenuation at 480 MHz due to 5.0 pF max capacitance. | Use Scenario: Shielding TMDS clock and data channels in flat-panel display interfaces against factory handling and cable hot-plug surges. IC Role / Device Role / Timing Role: Per-lane ESD suppressor mounted adjacent to DVI/HDMI receptacle, with matched trace routing to preserve differential impedance. Use Value: Ensures compliance with IEC 61000−4−2 Level 4 without degrading eye diagram margin - verified at 165 MHz pixel clock. |
| Gigabit Ethernet PHY Protection | Industrial T1/E1 Line Interface |
Use Scenario: Safeguarding RJ-45 magnetics secondary side and PHY pins in enterprise switches and PoE-powered devices. IC Role / Device Role / Timing Role: Point-of-entry protection on MDI-X pairs, coordinated with common-mode chokes to divert common-mode surges. Use Value: Limits clamped voltage to ≤11 V at 25 A, preventing PHY latch-up while preserving 1000BASE-T signal fidelity up to 125 MHz. | Use Scenario: Transient suppression on T1/E1 balanced line drivers and receivers in telecom access equipment and base station backhaul. IC Role / Device Role / Timing Role: Bidirectional shunt protector on each tip/ring pair, referenced to local logic ground with low-inductance layout. Use Value: Withstands repeated 30 kV ESD strikes without parameter shift - validated over 1000+ events per IEC 61000−4−2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | Lower max capacitance (0.5 pF I/O–I/O), but only 12 kV IEC 61000−4−2 contact rating; 6-pin SON vs. 10-pin UDFN. | Better suited for ultra-high-speed SerDes (e.g., PCIe Gen4), less robust for industrial 30 kV environments. | Select when signal bandwidth >5 GHz dominates over ESD severity requirements. |
| SZESD7371MUTAG | Same UDFN10 package and AEC−Q101 qualification; lower VRWM (2.8 V) and higher clamping (12.5 V at 10 A). | Optimized for 2.5 V I/O rails (e.g., MIPI D-PHY), not drop-in compatible with 3.3 V USB/DVI designs. | Choose only if system operates at ≤2.8 V and requires tighter VRWM margin. |
Compared with TPD4E05U06DQAR and SZESD7371MUTAG, ESD1014MUTAG uniquely balances 30 kV IEC robustness, 3.3 V VRWM compatibility, and 5.0 pF I/O–GND capacitance - making it the preferred choice for USB 2.0, DVI, and Gigabit Ethernet where both speed and surge immunity are non-negotiable.
Availability
ESD1014MUTAG is available at Aetrix Electronics and suitable for USB 2.0 interface protection, DVI/HDMI data lane hardening, and Gigabit Ethernet PHY safeguarding requiring stable component supply across production lifecycles.
Supply support for ESD1014MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, and intelligent edge applications.
ESD1014MUTAG belongs to onsemi's low-capacitance ESD protection diode array product line, engineered specifically for high-speed serial interface protection where signal integrity and IEC 61000−4−2 Level 4 compliance are co-primary requirements.
FAQ
What is the maximum clamping voltage of ESD1014MUTAG at 25 A?
The ESD1014MUTAG exhibits a maximum clamping voltage of 11 V when subjected to a 25 A, 8/20 µs surge pulse between any I/O pin and GND. This value is measured per IEC 61000−4−2 test conditions and ensures downstream ICs such as USB transceivers remain within safe operating voltage limits during worst-case ESD events. The clamping behavior is consistent across all four I/O channels in the ESD1014MUTAG array.
Is ESD1014MUTAG qualified for automotive applications?
Yes, ESD1014MUTAG is AEC−Q101 qualified and PPAP capable, with the "SZ" prefix indicating automotive-grade manufacturing control. It operates across −40°C to +125°C junction temperature and meets stringent automotive EMC requirements including IEC 61000−4−2 Level 4 (30 kV contact). The ESD1014MUTAG is deployed in infotainment head units, rear-seat display interfaces, and ADAS camera data links.
Does ESD1014MUTAG require external bias or control signals?
No, ESD1014MUTAG is a passive, always-active silicon avalanche diode array with no external bias, enable pins, or control logic. It functions autonomously based on voltage threshold - conducting only during overvoltage transients above ~5 V (VBR min). The VP pin (Pin 5) connects to the local 3.3 V rail to establish the clamping reference, but no active drive or timing is required for ESD1014MUTAG operation.
What is the recommended PCB layout for ESD1014MUTAG's exposed thermal pad?
The exposed bottom pad of ESD1014MUTAG must be soldered to a solid, low-impedance PCB ground plane using ≥4 thermal vias (0.3 mm diameter, spaced evenly). This ensures effective heat dissipation during surge events and provides a low-inductance return path for ESD current. Per onsemi's layout guidelines, avoid splitting the ground pour beneath ESD1014MUTAG and maintain ≥0.2 mm solder mask opening around the pad edge for reliable wetting.
Can ESD1014MUTAG protect both power and signal lines simultaneously?
ESD1014MUTAG is optimized for signal-line protection (e.g., USB D+/D−, DVI TMDS) and is not intended for primary power rail clamping. While Pin 5 (VP) connects to a 3.3 V supply to enable bidirectional clamping, the device lacks the energy-handling capability for sustained overvoltage on power rails. For combined power/signal protection, ESD1014MUTAG should be used alongside dedicated TVS diodes like SMAJ3.3A on the 3.3 V rail - a configuration validated in onsemi reference designs for USB 2.0 ports.
ESD1014MUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- 11V
- Current - Peak Pulse (10/1000µs):
- 30A (8/20µs)
- Power - Peak Pulse:
- 450W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 3.8pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (2.6x2.6)
ESD1014MUTAG FAQ
1.How can I place an order for ESD1014MUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD1014MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD1014MUTAG reliable?
The price and inventory of ESD1014MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD1014MUTAG is usually 5 days.
3.What payment methods are accepted for ESD1014MUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD1014MUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD1014MUTAG?
ESD1014MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD1014MUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD1014MUTAG?
For technical support, including ESD1014MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD1014MUTAG requirements.
6.How does Aetrix verify that ESD1014MUTAG is sourced from the original manufacturer or authorized distributors?
All ESD1014MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD1014MUTAG meets industry standards.
7.What is the process for return or replacement of ESD1014MUTAG?
All ESD1014MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with ESD1014MUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD1014MUTAG part is unused and in its original packaging.
Return procedure for ESD1014MUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD1014MUTAG Tags
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