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Texas Instruments ESD122DMXR
- Part No.:
- ESD122DMXR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 3-XFDFN
- Datasheet:
-
ESD122DMXR.pdf
- Description:
- TVS DIODE 3.6VWM 8.4VC 3X2SON
- Quantity:
- Payment:
- Shipping:
Inventory:27,943
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Product details
Overview
ESD122DMXR from Texas Instruments is a bidirectional 2-channel TVS diode array designed for ESD and surge protection of high-speed differential signal lines in USB Type-C and HDMI 2.0 interfaces. It delivers ±17-kV IEC 61000-4-2 contact/air-gap ESD protection, 0.2 pF typical IO-to-GND capacitance, 5.1-V minimum DC breakdown voltage, and 8.4-V clamping voltage at 5-A TLP - enabling robust protection without signal integrity degradation in 10-Gbps applications.
For engineers reviewing the ESD122DMXR datasheet, ESD122DMXR pinout, ESD122DMXR application, or ESD122DMXR equivalent, this device is selected specifically for symmetric flow-through routing of SuperSpeed+ (SSRX/SSTX) and TMDS differential pairs where ultra-low capacitance, matched channel performance, and industrial temperature operation (–40°C to +125°C) are mandatory.
Technical Context
The ESD122DMXR implements a dual-channel, bidirectional TVS structure with symmetrical I/O-to-GND clamping paths and a dedicated ground terminal. Its X2SON (DMX) package enables direct in-line placement on differential traces without vias, preserving impedance continuity for USB 3.1 Gen 2 and HDMI 2.0 signals up to 5 GHz.
Each channel features identical electrical characteristics: 0.1 pF typical channel-to-channel capacitance, ≤10 nA leakage at ±2.5 V, and dynamic resistance of 0.5 Ω - ensuring balanced transient response and minimal skew between differential pairs during ESD events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±17 kV contact & air-gap - meets Level 4 immunity without performance degradation after ≥10,000 strikes |
| IO-to-GND Capacitance | 0.2 pF typical - preserves signal integrity for 10-Gbps USB 3.1 Gen 2 and 6-Gbps HDMI 2.0 eye diagrams |
| DC Breakdown Voltage | 5.1 V min (IO→GND), –7.9 V max (GND→IO) - safely clamps transients above ±3.6-V signal range |
| Clamping Voltage | 8.4 V at 5-A TLP - limits voltage seen by protected PHY to safe level during fast ESD discharge |
| Leakage Current | 10 nA max at ±2.5 V - avoids DC loading on high-impedance receiver inputs |
| Surge Rating (IEC 61000-4-5) | 2.5 A (8/20 µs) - withstands system-level lightning-induced surges on exposed ports |
| Operating Temperature | –40°C to +125°C - supports deployment in automotive infotainment, industrial docking stations, and server backplanes |
Pinout & Package
X2SON (DMX) 3-pin package: 0.6 mm × 1.0 mm body, 0.34-mm pitch, single-row flow-through layout optimized for differential pair routing without vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Common reference terminal | Low-inductance return path for both ESD clamp diodes; placed centrally to minimize loop area for differential channels |
| IO1 | First protected I/O channel | Connects to one leg of differential pair (e.g., SSTX1P or TMDS_D0+); bidirectionally clamped to GND |
| IO2 | Second protected I/O channel | Connects to complementary leg (e.g., SSTX1N or TMDS_D0−); matched capacitance and clamping to IO1 ensures signal symmetry |
Key Features
| Feature | Design Value |
|---|---|
| Type-C–optimized flow-through routing | Eliminates vias on SuperSpeed+ lanes, reducing insertion loss and crosstalk in USB 3.1 Gen 2 layouts |
| Symmetric differential pinout | GND pin centered between IO1/IO2 ensures equal trace length matching and common-mode noise rejection |
| 0.1-pF channel-to-channel capacitance | Minimizes inter-pair coupling that could distort differential eye opening at 10 Gbps |
| 0.5-Ω dynamic resistance | Enables rapid clamping with low residual voltage, protecting sensitive SerDes receivers from latch-up |
| 10,000-strike endurance | Guarantees long-term reliability in high-touch consumer devices like laptops and tablets without derating |
Applications
| USB 3.1 Gen 2 Type-C Port | HDMI 2.0 Interface |
|---|---|
Use Scenario: Protecting SSTX1P/SSTX1N and SSRX1P/SSRX1N differential lanes on a laptop USB-C port supporting DisplayPort Alt Mode and 10-Gbps data. IC Role / Device Role / Timing Role: Bidirectional TVS clamp placed immediately adjacent to the connector to shunt ESD current to chassis ground before reaching the USB controller PHY. Use Value: Maintains >24 dB return loss and <0.3 UI jitter at 5 GHz while surviving repeated ±17-kV contact discharges per IEC 61000-4-2. |
Use Scenario: Shielding TMDS clock and data pairs (CLK+/−, D0+/−, D1+/−, D2+/−) in a 4K60 monitor's HDMI 2.0 input stage. IC Role / Device Role / Timing Role: Dual-channel ESD suppressor per differential pair, leveraging symmetrical pinout to preserve 100-Ω differential impedance. Use Value: Enables full 6-Gbps bandwidth with <0.25 pF total loading per line - verified via eye diagram compliance pre- and post-ESD stress testing. |
| Thunderbolt 2 Docking Station | Industrial Embedded Display Module |
Use Scenario: Securing high-speed differential lanes in a Thunderbolt 2 host controller interface where signal integrity must coexist with ruggedized ESD requirements. IC Role / Device Role / Timing Role: Two-channel transient suppressor deployed on DP++ lanes carrying DisplayPort 1.3 signals alongside PCIe Gen 2 data. Use Value: Delivers 8.4-V clamping at 5-A TLP while adding only 0.01-pF capacitance mismatch between channels - critical for skew-sensitive timing budgets. |
Use Scenario: Protecting HDMI 2.0 outputs in an industrial HMIs operating in extended temperature environments (–40°C to +125°C). IC Role / Device Role / Timing Role: Robust ESD guard for TMDS outputs exposed to field maintenance personnel and electrostatic-prone factory floors. Use Value: Sustains rated performance across full industrial temperature range with no derating - validated per JEDEC JESD22-A108 thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06 | 4-channel, 0.5-pF typical IO-to-GND capacitance, ±5.5-V working voltage - higher capacitance limits use to sub-5-Gbps interfaces | Targeted at CC/SBU/DP/DM auxiliary lines in USB-C, not SuperSpeed+ lanes | Select ESD122DMXR for differential high-speed lanes; use TPD4E05U06 only for low-frequency control lines |
| ESD124DMYR | 4-channel variant in larger DMY package (0.6 mm × 1.32 mm); same electrical specs but different pinout and routing footprint | Requires PCB redesign due to non-flow-through 4-pin layout - unsuitable for existing ESD122DMXR layouts | Choose ESD122DMXR for space-constrained USB-C port designs needing minimal board area and via-free routing |
Compared with TPD4E05U06 and ESD124DMYR, the ESD122DMXR uniquely combines 2-channel flow-through routing, 0.2-pF capacitance, and 3-pin X2SON packaging - making it the only option for compact, high-fidelity protection of USB 3.1 Gen 2 and HDMI 2.0 differential pairs without compromising signal integrity or requiring layout rework.
Availability
ESD122DMXR is available at Aetrix Electronics and suitable for USB Type-C docking stations, HDMI 2.0 monitors, and Thunderbolt 2 embedded systems requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for ESD122DMXR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and high-speed interface solutions.
The ESD122 product line is engineered for ultra-low-capacitance transient protection of next-generation high-speed digital interfaces - specifically addressing ESD vulnerability in USB Type-C, HDMI 2.0, and DisplayPort 1.3 physical layers.
FAQ
What is the maximum data rate supported by ESD122DMXR without signal degradation?
The ESD122DMXR supports interfaces up to 10 Gbps, including USB 3.1 Gen 2 and HDMI 2.0, due to its 0.2 pF typical IO-to-GND capacitance and 0.1 pF channel-to-channel capacitance. Eye diagram validation confirms <0.3 UI jitter at 5 GHz, and insertion loss remains below –0.5 dB up to 10 GHz - ensuring no measurable degradation in high-speed signal fidelity when properly routed.
Does ESD122DMXR require external biasing or power supply connections?
No, the ESD122DMXR is a passive TVS diode array with no power pins or bias requirements. It operates solely through avalanche breakdown triggered by overvoltage transients. The device must be placed within the recommended operating voltage range (–3.6 V to +3.6 V on IO pins) to avoid unintended conduction, but no external supply or control signals are needed for functional operation.
How does the pinout of ESD122DMXR simplify USB Type-C PCB layout?
The ESD122DMXR uses a 3-pin X2SON (DMX) flow-through configuration - GND centered between IO1 and IO2 - allowing direct in-line placement on differential pairs like SSTX1P/SSTX1N without vias. This eliminates stubs, reduces parasitic inductance, maintains 100-Ω differential impedance, and cuts routing complexity versus 4-channel alternatives that force layer transitions and degrade signal integrity.
Can ESD122DMXR be used for HDMI 2.0 TMDS clock lane protection?
Yes, ESD122DMXR is explicitly validated for HDMI 2.0 TMDS clock and data lanes, supporting 3-GHz operation with 6-Gbps data rates. Its 0.27-pF maximum IO-to-GND capacitance provides sufficient margin against signal distortion, and layout examples in the official datasheet (Figure 16) confirm successful integration on TMDS_CLK+/− pairs with no eye closure or jitter increase post-ESD stress.
What is the moisture sensitivity level (MSL) and reflow profile for ESD122DMXR?
The ESD122DMXR carries an MSL rating of Level-1 at 260°C unlimited - meaning it is not moisture-sensitive and may be stored indefinitely at ambient conditions without baking prior to reflow. Its NIPDAU lead finish is compatible with standard Pb-free reflow profiles, and thermal resistance values (RθJA = 617.8°C/W) confirm suitability for high-density layouts without active thermal management.
ESD122DMXR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 3-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 5.1V
- Voltage - Clamping (Max) @ Ipp:
- 8.4V (Typ)
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 20W
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.2pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 3-X2SON (1x0.6)
ESD122DMXR FAQ
1.How can I place an order for ESD122DMXR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD122DMXR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD122DMXR reliable?
The price and inventory of ESD122DMXR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD122DMXR is usually 5 days.
3.What payment methods are accepted for ESD122DMXR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD122DMXR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD122DMXR?
ESD122DMXR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD122DMXR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD122DMXR?
For technical support, including ESD122DMXR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD122DMXR requirements.
6.How does Aetrix verify that ESD122DMXR is sourced from the original manufacturer or authorized distributors?
All ESD122DMXR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD122DMXR meets industry standards.
7.What is the process for return or replacement of ESD122DMXR?
All ESD122DMXR units undergo pre-shipment inspection (PSI). If there is an issue with ESD122DMXR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD122DMXR part is unused and in its original packaging.
Return procedure for ESD122DMXR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD122DMXR Tags
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Toshiba Semiconductor and Storage
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