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Texas Instruments ESD122DMYR

Part No.:
ESD122DMYR
Manufacturer:
Texas Instruments
Category:
TVS Diodes
Package:
3-XFDFN
Datasheet:
AetrixESD122DMYR.pdf
Description:
TVS DIODE 3.6VWM 8.4VC 3X2SON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:32,959

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Product details

Overview

ESD122DMYR from Texas Instruments is a bidirectional 2-channel TVS ESD protection diode array designed for USB Type-C and HDMI 2.0 differential signal lines. It delivers ±17-kV IEC 61000-4-2 contact/air-gap ESD protection, 0.2 pF typical IO-to-GND capacitance, 5.1 V minimum DC breakdown voltage, and 8.4 V clamping voltage at 5-A TLP - enabling robust protection of 10-Gbps SuperSpeed+ interfaces without signal integrity degradation.

For engineers reviewing the ESD122DMYR datasheet, ESD122DMYR pinout, ESD122DMYR application, or ESD122DMYR equivalent, key selection criteria include ultra-low capacitance matching for USB 3.1 Gen 2/HDMI 2.0 differential pairs, symmetric flow-through X2SON package routing, industrial temperature operation (–40°C to +125°C), and verified 10,000-strike ESD endurance per IEC Level 4.

Technical Context

The ESD122DMYR implements a passive bidirectional clamping architecture using silicon avalanche diodes, triggering above ±5.1 V DC breakdown and clamping transients to ≤8.4 V at 5-A TLP. Its symmetrical 3-pin X2SON (DMY) layout places GND between two identical IO channels - optimized for differential high-speed routing with matched trace lengths and minimal via count in USB Type-C layouts.

It meets IEC 61000-4-2 Level 4 (±17 kV), IEC 61000-4-4 (80 A EFT), and IEC 61000-4-5 (2.5 A surge) standards while maintaining ≤0.27 pF max IO-to-GND capacitance and ≤0.14 pF channel-to-channel capacitance - critical for preserving 5-GHz signal integrity on SSTX/SSRX lanes.

Key Specifications

Parameter Value and Actual Design Meaning
ESD Rating (IEC 61000-4-2) ±17-kV contact & air-gap discharge - meets highest system-level ESD immunity requirement for consumer/industrial USB-C ports.
IO-to-GND Capacitance 0.2 pF typical - enables clean 10-Gbps eye diagrams on USB 3.1 Gen 2 and HDMI 2.0 differential pairs.
DC Breakdown Voltage 5.1 V minimum - ensures protection activation before damage to 3.3-V/3.6-V interface receivers.
Clamping Voltage 8.4 V at 5-A TLP - limits transient overvoltage seen by downstream PHY ICs during ESD events.
Leakage Current 10 nA maximum at ±2.5 V - prevents DC loading or bias shift on high-impedance signal lines.
Operating Temperature –40°C to +125°C - supports deployment in automotive infotainment, industrial docking stations, and server backplanes.
Surge Rating (IEC 61000-4-5) 2.5 A (8/20 µs) - provides secondary protection against longer-duration power-line-induced transients.

Pinout & Package

ESD122DMYR uses a 3-pin X2SON (DMY) package measuring 0.60 mm × 1.32 mm with 0.5-mm pitch and bottom-side thermal pad. The flow-through layout minimizes trace discontinuities and supports symmetric routing of differential pairs without vias.

Pin/Terminal Circuit Role Design Meaning
GND Ground reference terminal Low-inductance return path for ESD current; placed centrally to balance coupling to both IO channels.
IO1 ESD-protected input/output channel 1 Connects to one side of differential pair (e.g., SSTX1P or TMDS_D0+); bidirectionally clamps to GND.
IO2 ESD-protected input/output channel 2 Connects to complementary side of same differential pair (e.g., SSTX1N or TMDS_D0−); matched electrical characteristics to IO1.

Key Features

Feature Design Value
Two-channel symmetric protection Identical IO1/IO2 channels with matched capacitance (ΔCL ≤ 0.01 pF) - preserves differential signal skew and common-mode rejection.
Flow-through X2SON package DMY variant (0.6 × 1.32 mm, 0.5-mm pitch) enables straight PCB trace routing across device - eliminates vias in high-speed lanes.
10,000-strike ESD endurance Retains full specification after ≥10,000 ±17-kV contact discharges - ensures long-term reliability in field-deployed USB-C ports.
Ultra-low dynamic resistance 0.5 Ω - minimizes clamping voltage overshoot and improves energy dissipation efficiency during fast transients.
Industrial temperature range –40°C to +125°C operation - qualified for use in thermally demanding environments including automotive cabins and enclosed servers.

Applications

USB 3.1 Gen 2 Type-C Port HDMI 2.0 Interface

Use Scenario: Protecting SSTX1P/SSTX1N and SSRX1P/SSRX1N differential lanes on a laptop or dock USB-C port exposed to user-handling ESD.

IC Role / Device Role / Timing Role: Passive bidirectional TVS clamp placed directly at connector, diverting ESD current to chassis ground before reaching USB 3.1 PHY.

Use Value: Maintains 10-Gbps signal integrity (≤0.27 pF) while surviving repeated ±17-kV contact discharges - eliminating need for vias and reducing board layer count.

Use Scenario: Shielding TMDS clock and data differential pairs (e.g., TMDS_D0+/D0−, CLK+/CLK−) on a 4K monitor or set-top box HDMI 2.0 port.

IC Role / Device Role / Timing Role: Low-capacitance ESD shunt on each high-speed lane, triggered only during transients to avoid DC loading of 3.3-V TMDS drivers.

Use Value: Enables 6-Gbps HDMI 2.0 operation with <0.5 dB insertion loss up to 3 GHz - validated via eye diagram comparison with/without device.

Thunderbolt 2 Interface PCIe 3.0 Add-in Card Edge Connector

Use Scenario: Safeguarding differential SerDes lanes in Thunderbolt 2 host controllers or peripherals where ESD exposure occurs at the external Mini DisplayPort connector.

IC Role / Device Role / Timing Role: Two-channel ESD suppressor per differential pair (e.g., CH0+, CH0−), placed within 3 mm of connector per layout guidelines.

Use Value: Supports 20-Gbps aggregate bandwidth (10 Gbps per direction) with sub-0.3 pF loading - preventing jitter accumulation and bit-error-rate degradation.

Use Scenario: Adding discrete ESD protection to PCIe 3.0 x4 or x16 edge connectors on industrial GPU or FPGA carrier boards where integrated protection is insufficient.

IC Role / Device Role / Timing Role: Channel-matched TVS array protecting individual TX/RX differential lanes (e.g., PERST#, REFCLK+, REFCLK−) against handling and cable-discharge events.

Use Value: Delivers 8.4-V clamping at 5-A TLP while adding <0.02 UI jitter - meeting PCIe 3.0 compliance margin for 8 GT/s signaling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ESD122DMXR Same die, smaller 0.6 × 1.0 mm X2SON (DMX) package with 0.34-mm pitch - higher density but tighter routing constraints. Better suited for space-constrained mobile PCBs; requires finer-pitch layout and may increase trace impedance discontinuity. Select ESD122DMXR when board area is premium and layout supports 0.34-mm pitch; ESD122DMYR preferred for manufacturability and thermal performance.
TPD4E05U06 4-channel device in X2SON-10 package; 0.5 pF typical IO-to-GND capacitance - higher than ESD122DMYR's 0.2 pF. Designed for lower-speed lines (CC, SBU, DP/DM) in USB-C; not suitable for 10-Gbps SSTX/SSRX due to capacitance penalty. Use TPD4E05U06 for auxiliary USB-C lines; ESD122DMYR remains optimal for primary SuperSpeed+ differential pairs requiring ultra-low capacitance.

Compared with ESD122DMXR, ESD122DMYR offers relaxed 0.5-mm pitch and larger thermal pad for improved heat dissipation in high-reliability systems; compared with TPD4E05U06, it delivers half the capacitance required for Gen 2 data rates - making ESD122DMYR the only viable choice for USB 3.1 Gen 2 and HDMI 2.0 differential lane protection.

Availability

ESD122DMYR is available at Aetrix Electronics and suitable for USB Type-C docking stations, HDMI 2.0 monitors, and Thunderbolt 2 peripherals requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for ESD122DMYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and high-speed interface protection technologies.

The ESD122 product line was developed specifically for ultra-high-speed digital interface protection - targeting USB Type-C, HDMI 2.0, and PCIe 3.0 applications where sub-0.3 pF capacitance and ±17-kV ESD immunity are mandatory.

FAQ

What is the exact package type and dimensions of ESD122DMYR?

ESD122DMYR uses the X2SON (DMY) package: 3-pin, 0.60 mm × 1.32 mm body size, 0.5-mm pitch, and exposed thermal pad. This flow-through configuration allows direct in-line routing of differential signals without vias - critical for maintaining impedance control on USB 3.1 Gen 2 SSTX/SSRX traces. The DMY variant is distinct from the smaller DMX package used in ESD122DMXR.

Does ESD122DMYR support USB 3.1 Gen 2 (10 Gbps) operation?

Yes, ESD122DMYR supports USB 3.1 Gen 2 operation with verified performance: 0.2 pF typical IO-to-GND capacitance and ≤0.14 pF channel-to-channel capacitance preserve signal integrity up to 5 GHz. TI's application note SLVSDP5A includes measured 10-Gbps eye diagrams showing negligible degradation - confirming suitability for SuperSpeed+ differential lanes in Type-C implementations.

What is the clamping voltage behavior of ESD122DMYR under real ESD stress?

ESD122DMYR clamps to 8.4 V at 5-A TLP (transmission line pulse) current, with dynamic resistance of 0.5 Ω. This low clamping level - combined with fast response (<1 ns) - limits voltage overshoot seen by protected PHY ICs during ±17-kV IEC 61000-4-2 contact discharges. The device maintains this performance across –40°C to +125°C and after ≥10,000 ESD strikes.

Can ESD122DMYR be used on HDMI 2.0 TMDS differential pairs?

Yes, ESD122DMYR is explicitly qualified for HDMI 2.0: its 0.27 pF max IO-to-GND capacitance supports 6-Gbps data rates with sufficient margin, and its ±5.1 V DC breakdown safely protects 3.3-V TMDS drivers. TI's SLVSDP5A datasheet includes HDMI 2.0 schematic examples and 6-Gbps eye diagrams validating signal fidelity with ESD122DMYR installed on all four TMDS data pairs and clock pair.

How does ESD122DMYR differ from single-channel ESD protection devices?

ESD122DMYR integrates two matched, independent ESD protection channels in one X2SON package - enabling simultaneous protection of differential signal pairs (e.g., SSTX1P/SSTX1N) with identical electrical characteristics. This eliminates channel-to-channel capacitance mismatch (ΔCL ≤ 0.01 pF), preserves common-mode noise rejection, and avoids the layout complexity of placing two separate single-channel devices near a high-speed connector.

ESD122DMYR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
3-XFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
2
Voltage - Reverse Standoff (Typ):
3.6V (Max)
Voltage - Breakdown (Min):
5.1V
Voltage - Clamping (Max) @ Ipp:
8.4V (Typ)
Current - Peak Pulse (10/1000µs):
2.5A (8/20µs)
Power - Peak Pulse:
20W
Power Line Protection:
No
Applications:
HDMI, USB
Capacitance @ Frequency:
0.2pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
3-X2SON (1.3x0.6)

ESD122DMYR FAQ

1.How can I place an order for ESD122DMYR through Aetrix?

Please submit a Request for Quotation (RFQ) for ESD122DMYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ESD122DMYR reliable?

The price and inventory of ESD122DMYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD122DMYR is usually 5 days.

3.What payment methods are accepted for ESD122DMYR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD122DMYR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ESD122DMYR?

ESD122DMYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ESD122DMYR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ESD122DMYR?

For technical support, including ESD122DMYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD122DMYR requirements.

6.How does Aetrix verify that ESD122DMYR is sourced from the original manufacturer or authorized distributors?

All ESD122DMYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD122DMYR meets industry standards.

7.What is the process for return or replacement of ESD122DMYR?

All ESD122DMYR units undergo pre-shipment inspection (PSI). If there is an issue with ESD122DMYR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ESD122DMYR part is unused and in its original packaging.

Return procedure for ESD122DMYR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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