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onsemi ESD1L001W1T2G
- Part No.:
- ESD1L001W1T2G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
ESD1L001W1T2G.pdf
- Description:
- TVS DIODE 5VWM 30VC SC70-6
- Quantity:
- Payment:
- Shipping:
Inventory:2,725
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Product details
Overview
ESD1L001W1T2G from onsemi is a low-capacitance unidirectional ESD protection diode array designed for high-speed differential data lines. It provides IEC 61000−4−2 Level 4 (±8 kV contact, ±15 kV air) protection with 0.3 pF typical junction capacitance (I/O to GND), 30 V typical clamping voltage at +16 A TLP, and operates across −55 °C to +125 °C junction temperature. It is used in USB 3.0, HDMI, and LVDS interfaces where signal integrity and ESD robustness are critical.
For engineers reviewing the ESD1L001W1T2G datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance for minimal signal distortion, low clamping voltage for sensitive transceivers, flow-through SC−88 package layout compatibility with differential pair routing, and AEC−Q101 qualification for automotive-grade reliability.
Technical Context
This device integrates four independent ESD protection paths in a single SC−88 (Case 419B) 6-pin package, configured as two matched dual-channel paths optimized for differential signaling. Each channel features a low-leakage silicon diode structure with reverse working voltage of 5 V and breakdown voltage ≥16.5 V at 1 mA.
The ESD1L001W1T2G uses a flow-through pinout (Pin 1→Pin 4, Pin 2→Pin 5) to enable symmetrical PCB trace routing-critical for maintaining impedance balance in USB 3.0 and HDMI differential pairs. Its 5 GHz 3dB bandwidth and <0.5 pF max capacitance ensure minimal insertion loss up to multi-gigabit data rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (I/O to GND) | 0.3 pF typical - preserves signal integrity on 5 Gb/s USB 3.0 and HDMI 1.4+ links |
| Clamping Voltage (TLP, +16 A) | 30 V typical - limits transient overvoltage to protect 3.3 V/1.8 V transceivers |
| ESD Rating (IEC 61000−4−2) | ±8 kV contact / ±15 kV air - meets industrial and automotive system-level ESD requirements |
| Reverse Working Voltage | 5 V - compatible with standard high-speed interface DC bias levels |
| Junction Temperature Range | −55 °C to +125 °C - supports operation in under-hood automotive and industrial environments |
| Package | SC−88 (2.00 × 1.25 × 0.90 mm, 0.65 mm pitch) - enables compact, flow-through PCB layout for matched differential traces |
Pinout & Package
ESD1L001W1T2G is housed in an SC−88 (Case 419B) surface-mount package with flow-through pin configuration optimized for differential pair routing. The 6-pin layout allows direct in-line placement between connector and controller without crossing traces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode of Channel 1 | Input terminal for first protected data line (e.g., USB3_TXP) |
| Pin 2 | Anode of Channel 2 | Input terminal for second protected data line (e.g., USB3_TXN) |
| Pin 3 | GND | Common cathode reference and ESD return path |
| Pin 4 | Cathode of Channel 1 | Output terminal connected to transceiver I/O (e.g., PHY_TXP) |
| Pin 5 | Cathode of Channel 2 | Output terminal connected to transceiver I/O (e.g., PHY_TXN) |
| Pin 6 | No Connect | Unused terminal; left floating per datasheet - no internal connection |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.3 pF typical (I/O to GND) - minimizes signal rise-time degradation and jitter on 5 Gb/s links |
| Differential pair–optimized layout | Flow-through pinout (1→4, 2→5) - enables matched-length routing without vias or crossovers |
| Automotive qualification | AEC−Q101 qualified - validated for temperature cycling, humidity, and mechanical stress in automotive ECUs |
| Short-to-battery survivability | Withstands 16 V DC battery fault conditions - suitable for infotainment and ADAS front-end interfaces |
| Pb-free & RoHS compliant | Meets J-STD-609 Category 1 moisture sensitivity and JEDEC MSL Level 1 - supports lead-free reflow |
Applications
| USB 3.0 Interface Protection | HDMI 1.4/2.0 Differential Lines |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs between USB 3.0 controller and Type-A/B connector against ESD events during hot-plug. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed inline on each differential lane, grounded via shortest possible path to chassis or digital ground. Use Value: Maintains eye diagram integrity at 5 Gb/s (Figure 11) with <0.4 dB insertion loss up to 3 GHz (Figure 12), preventing link training failures. |
Use Scenario: Shielding HDMI 1.4/2.0 TMDS clock and data channels from ESD during cable insertion into displays or source devices. IC Role / Device Role / Timing Role: Low-capacitance clamp on each TMDS+ and TMDS− pair, preserving 100 Ω differential impedance and minimizing skew. Use Value: Enables compliance with HDMI Compliance Test Specification v1.4a by limiting clamping voltage to ≤30 V during ±8 kV contact discharge. |
| LVDS Camera Links (e.g., FPD-Link III) | Automotive Infotainment Data Buses |
Use Scenario: Protecting high-speed camera sensor outputs (e.g., 1.5 Gbps FPD-Link III) routed through vehicle harnesses prone to ESD coupling. IC Role / Device Role / Timing Role: Per-lane ESD shunt placed adjacent to serializer IC input, with GND pin tied directly to local analog ground plane. Use Value: Delivers <5% capacitance-induced timing skew between differential lanes, ensuring pixel clock recovery stability. |
Use Scenario: Safeguarding MIPI D-PHY or DisplayPort AUX channel lines in automotive head units exposed to service technician handling. IC Role / Device Role / Timing Role: Dual-channel protector on bidirectional control bus, leveraging AEC−Q101 qualification for extended temperature operation. Use Value: Guarantees ESD immunity across −40 °C to +85 °C ambient while adding <0.1 mm² footprint vs discrete solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DQAR | 0.5 pF typical capacitance; 4-channel single-package solution; same SC−70-6 package | Higher capacitance reduces usable bandwidth; not flow-through - requires trace crossover for differential routing | Preferred when board space is constrained and differential symmetry is less critical than channel count |
| ESD5Z3.3T5G | Single-channel, 0.45 pF capacitance, SOD-523 package; no integrated dual-channel flow-through layout | Requires two devices per differential pair; increases layout complexity and parasitic inductance | Selected only for cost-sensitive, non-differential applications where 3.3 V VRWM suffices |
Compared with TPD4E001DQAR and ESD5Z3.3T5G, the ESD1L001W1T2G uniquely delivers matched 0.3 pF capacitance per channel in a flow-through SC−88 layout-enabling optimal signal integrity for USB 3.0 and HDMI without trace length mismatch or added component count.
Availability
ESD1L001W1T2G is available at Aetrix Electronics and suitable for USB 3.0 interface protection, HDMI 2.0 differential line safeguarding, and automotive LVDS camera link hardening requiring stable component supply and long-term lifecycle assurance.
Supply support for ESD1L001W1T2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESD1L001W1T2G belongs to onsemi's high-speed ESD protection portfolio, engineered specifically to preserve signal fidelity in multi-gigabit differential interfaces while meeting stringent automotive and industrial reliability standards.
FAQ
What is the exact pin configuration and signal flow direction for ESD1L001W1T2G?
The ESD1L001W1T2G uses a flow-through SC−88 pinout: Pin 1 (Anode 1) → Pin 4 (Cathode 1); Pin 2 (Anode 2) → Pin 5 (Cathode 2); Pin 3 is GND; Pin 6 is NC. This layout allows direct in-line placement between connector and transceiver, minimizing stubs and maintaining differential impedance. The ESD1L001W1T2G must be oriented so that data flows unidirectionally from Anode to Cathode toward the protected IC.
Does ESD1L001W1T2G support bidirectional ESD protection on differential lines?
Yes - the ESD1L001W1T2G provides bidirectional ESD protection per channel via back-to-back diode clamping architecture referenced to GND. During positive transients, current flows from Anode to GND; during negative transients, current flows from GND to Cathode. This ensures full ±8 kV IEC 61000−4−2 protection regardless of signal polarity on USB 3.0 or HDMI lines.
Is ESD1L001W1T2G qualified for automotive applications?
Yes - the ESD1L001W1T2G is AEC−Q101 qualified and PPAP capable, with operating junction temperature range of −55 °C to +125 °C and validation across temperature cycling, mechanical shock, and humidity testing. Its "SZ" prefix variant (SZESD1L001W1T2G) is designated for automotive use, but the ESD1L001W1T2G itself meets the same stress test requirements per onsemi documentation.
What is the maximum recommended trace length between ESD1L001W1T2G and the protected IC?
To maintain effective clamping, the GND connection from Pin 3 of the ESD1L001W1T2G must be routed to a low-inductance ground plane within ≤2 mm. Signal traces from Pin 1/Pin 4 and Pin 2/Pin 5 should be length-matched to within 0.1 mm and kept under 8 mm total length to avoid resonance above 5 GHz. Longer traces degrade the ESD1L001W1T2G's ability to clamp fast-rising ESD pulses below 30 V.
How does ESD1L001W1T2G compare to discrete 0402 TVS diodes in high-speed designs?
The ESD1L001W1T2G offers 0.3 pF typical capacitance - significantly lower than discrete 0402 TVS diodes (typically 0.6–1.2 pF) - reducing signal attenuation and jitter. Its integrated dual-channel flow-through layout eliminates trace mismatches inherent in discrete solutions. Unlike discrete diodes, the ESD1L001W1T2G guarantees matched capacitance (<10% variation) between channels, critical for HDMI and USB 3.0 eye diagram compliance.
ESD1L001W1T2G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 16.5V
- Voltage - Clamping (Max) @ Ipp:
- 30V (Typ)
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-70-6
ESD1L001W1T2G FAQ
1.How can I place an order for ESD1L001W1T2G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD1L001W1T2G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD1L001W1T2G reliable?
The price and inventory of ESD1L001W1T2G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD1L001W1T2G is usually 5 days.
3.What payment methods are accepted for ESD1L001W1T2G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD1L001W1T2G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD1L001W1T2G?
ESD1L001W1T2G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD1L001W1T2G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD1L001W1T2G?
For technical support, including ESD1L001W1T2G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD1L001W1T2G requirements.
6.How does Aetrix verify that ESD1L001W1T2G is sourced from the original manufacturer or authorized distributors?
All ESD1L001W1T2G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD1L001W1T2G meets industry standards.
7.What is the process for return or replacement of ESD1L001W1T2G?
All ESD1L001W1T2G units undergo pre-shipment inspection (PSI). If there is an issue with ESD1L001W1T2G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD1L001W1T2G part is unused and in its original packaging.
Return procedure for ESD1L001W1T2G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD1L001W1T2G Tags
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