My Inquiry
My Account
Texas Instruments ESD341DPLR
- Part No.:
- ESD341DPLR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESD341DPLR.pdf
- Description:
- 0.66-PF, 3.6-V, 30-KV ESD PROTEC
- Quantity:
- Payment:
- Shipping:
Inventory:12,719
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESD341DPLR from Texas Instruments is a bidirectional TVS ESD protection diode in a 2-pin X2SON (DPL) package, designed for ultra-high-speed signal line protection. It delivers ±30 kV IEC 61000-4-2 contact/air-gap ESD immunity, 0.66 pF typical IO capacitance, ±6.2 V DC breakdown voltage, and clamps to 10.2 V at 16 A TLP - enabling robust HDMI 1.4/2.0 and USB 3.0 interface protection in space-constrained portable electronics.
For engineers reviewing the ESD341DPLR datasheet, ESD341DPLR pinout, ESD341DPLR application, or ESD341DPLR equivalent, this page provides verified electrical specifications, validated 2-pin X2SON layout guidance, real-world high-speed interface compatibility (up to 3.4 Gbps), thermal performance data (RθJA = 356.8°C/W), and direct alternative comparisons for ESD-hardened board design.
Technical Context
The ESD341DPLR operates as a passive, bidirectional clamping device triggered above ±6.2 V DC breakdown, with dynamic resistance of 0.25 Ω and holding voltage of 6.2 V. Its ultra-low 0.66 pF capacitance ensures minimal signal distortion on TMDS, USB, and DisplayPort lines up to 3.4 Gbps.
It meets IEC 61000-4-2 Level 4 (±30 kV) and IEC 61000-4-5 surge (5.4 A, 8/20 µs), diverting transients to ground via low-clamp-voltage diode architecture. The device functions across –40°C to +125°C and supports 3.6 V signal rails without biasing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±30 kV contact & air-gap (IEC 61000-4-2 Level 4) - protects against worst-case human-body ESD events at connector interfaces. |
| Surge Rating | 5.4 A (8/20 µs, IEC 61000-4-5) - handles lightning-induced or inductive-switching surges on exposed ports. |
| IO Capacitance | 0.66 pF (typical at 1 MHz, 0 V bias) - preserves signal integrity for HDMI 2.0 (6 Gbps) and USB 3.0 (5 Gbps) eye diagrams. |
| Clamp Voltage | 10.2 V at 16 A TLP - limits transient voltage seen by downstream ICs to safe levels during ESD strikes. |
| Breakdown Voltage | ±6.2 V (typical, ±1 mA) - ensures reliable triggering before damage to 3.3 V/3.6 V logic interfaces. |
| Leakage Current | 100 nA max at ±3.6 V - prevents DC loading or battery drain in always-on wearable and portable systems. |
| Package | X2SON (DPL), 0.6 mm × 0.3 mm × 0.3 mm - fits 0201 footprint for ultra-dense PCB layouts in laptops, wearables, and docking stations. |
Pinout & Package
ESD341DPLR uses a 2-pin X2SON (DPL) package - industry-standard 0201 footprint (0.6 mm × 0.3 mm) with bottom-side thermal pad and no exposed leads. Pin 1 and Pin 2 are symmetrical bidirectional I/O terminals; either pin connects to protected signal line, the other to system ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O (bidirectional) | Connects to high-speed signal line (e.g., HDMI TMDS+, USB D+); clamps transients to ground when voltage exceeds ±6.2 V. |
| Pin 2 | I/O (bidirectional) | Connects to system ground reference; completes low-inductance path for ESD current dissipation during clamping. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.66 pF enables >3.4 Gbps data rates without measurable insertion loss up to 5 GHz (–3 dB bandwidth). |
| Bidirectional clamping | Symmetrical ±6.2 V breakdown allows single-device protection of AC-coupled differential pairs (e.g., HDMI, LVDS) without polarity constraints. |
| Low dynamic resistance | 0.25 Ω minimizes voltage overshoot during fast ESD transients, reducing stress on downstream receivers. |
| Industrial temperature range | –40°C to +125°C operation supports deployment in automotive infotainment head units and industrial displays. |
| Space-optimized packaging | 0201 (DPL) footprint reduces PCB area by >50% vs. 0402 alternatives while maintaining full IEC Level 4 compliance. |
Applications
| HDMI 1.4/2.0 Interface Protection | USB 3.0 High-Speed Data Line |
|---|---|
Use Scenario: Protecting TMDS differential pairs in consumer TVs, monitors, and docking stations against hot-plug ESD and cable discharge events. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed between HDMI connector and controller IC to clamp transients before they reach sensitive SerDes circuitry. Use Value: 0.66 pF capacitance preserves 1.7 GHz fundamental frequency and 3.4 Gbps eye opening; ±30 kV rating exceeds IEC 61000-4-2 Level 4 requirements. |
Use Scenario: Shielding USB 3.0 SuperSpeed differential lanes (SSTX+/SSTX−, SSRX+/SSRX−) in laptops and portable SSD enclosures. IC Role / Device Role / Timing Role: Signal-line ESD suppressor mounted directly at USB Type-A/B/Type-C receptacle to minimize trace inductance and ground loop impedance. Use Value: 10.2 V clamping at 16 A TLP prevents receiver latch-up; 5.4 A surge rating guards against power-bus coupling during system-level surge tests. |
| Wearable Device Sensor Interface | Automotive Rear Seat Entertainment |
Use Scenario: Safeguarding I²C or MIPI D-PHY lines connecting motion sensors or camera modules in smartwatches and hearables. IC Role / Device Role / Timing Role: Low-leakage (100 nA max) ESD shunt protecting bidirectional data buses operating at 3.3 V with tight power budgets. Use Value: –40°C to +125°C rating ensures reliability during thermal cycling; 0201 size enables placement within <1 mm of sensor flex connectors. |
Use Scenario: Hardening HDMI and DisplayPort links in vehicle rear-seat screens exposed to repeated passenger contact and environmental humidity. IC Role / Device Role / Timing Role: Transient voltage suppressor integrated into display module PCB to meet ISO 10605 automotive ESD requirements (±25 kV contact). Use Value: 30 kV IEC rating exceeds ISO 10605 margin; RθJB = 136.2°C/W supports thermal stability under sealed enclosure conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E05U06DPYR | 0.5 pF capacitance, ±5.5 V breakdown, 12 V clamp at 16 A TLP, same 2-pin X2SON (DPY) package. | Optimized for 1.8 V/2.5 V I/O rails; lower breakdown better suited for low-voltage mobile SoCs than 3.6 V HDMI lines. | Select when protecting sub-3 V interfaces where tighter voltage margin is required; not recommended for 3.3 V–3.6 V TMDS. |
| ESD324DPYR | 0.35 pF capacitance, ±3.6 V breakdown, 7.5 V clamp at 16 A TLP, 4-channel array in same 0201 footprint. | Multi-channel solution for compact multi-signal protection (e.g., HDMI DDC + CEC + HPD); higher channel density but fixed unidirectional configuration per channel. | Choose for space-constrained designs needing simultaneous protection of ≥3 signals; requires separate ground routing per channel vs. ESD341DPLR's shared ground. |
Compared with TPD1E05U06DPYR and ESD324DPYR, ESD341DPLR offers superior voltage headroom (±6.2 V) and higher surge current handling (5.4 A) for 3.6 V HDMI/USB interfaces, while maintaining ultra-low capacitance - making it the preferred choice for high-bandwidth, high-voltage signal line protection where single-channel optimization is critical.
Availability
ESD341DPLR is available at Aetrix Electronics and suitable for HDMI 2.0 port hardening, USB 3.0 embedded host designs, and wearable sensor interface protection requiring stable component supply across automotive, industrial, and consumer production programs.
Supply support for ESD341DPLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and high-reliability power management solutions, with over 90 years of innovation in precision electronics.
The ESD341DPLR belongs to TI's ESD protection diode product line, engineered specifically for ultra-high-speed digital interfaces - balancing sub-1 pF capacitance, ±30 kV ESD immunity, and industrial-grade thermal performance in 0201 packaging.
FAQ
What is the maximum data rate supported by ESD341DPLR?
ESD341DPLR supports data rates up to 3.4 Gbps, validated for HDMI 1.4b and USB 3.0 applications. Its 0.66 pF typical capacitance and 5 GHz –3 dB bandwidth ensure minimal signal degradation, preserving eye diagram integrity at full protocol speeds. This performance is confirmed by TI's application curves showing clean >3.4 Gbps eye diagrams with ESD341DPLR installed.
Does ESD341DPLR require external biasing or power supply?
No, ESD341DPLR is a passive TVS diode and requires no external power or biasing. It operates solely on transient overvoltage events, clamping only when signal voltage exceeds ±6.2 V. The device draws zero quiescent current and maintains 100 nA maximum leakage at ±3.6 V - ideal for battery-powered wearables and always-on interfaces.
Can ESD341DPLR be used for HDMI 2.0 protection?
Yes, ESD341DPLR is explicitly qualified for HDMI 2.0 protection. Its 0.66 pF capacitance, 3.4 Gbps capability, and ±30 kV ESD rating meet HDMI 2.0's electrical requirements for TMDS lanes. TI's typical application diagram shows eight ESD341DPLR devices deployed across all HDMI 1.4/2.0 differential pairs, including clock and data channels.
What is the thermal resistance of ESD341DPLR, and how does it affect PCB layout?
ESD341DPLR has a junction-to-board thermal resistance (RθJB) of 136.2°C/W and junction-to-ambient (RθJA) of 356.8°C/W. To maintain reliability under repeated surge events, TI recommends placing the device within 2 mm of the connector with a short, wide ground trace - minimizing thermal impedance and preventing localized heating that could degrade clamping consistency over time.
Is ESD341DPLR RoHS-compliant and lead-free?
Yes, ESD341DPLR is RoHS-compliant and features NiPdAu (NIPDAU) lead finish. Per TI's packaging addendum, it carries MSL Level-1 rating (unlimited floor life at ≤30°C/60% RH) and is qualified for peak reflow temperatures up to 260°C - fully compatible with standard lead-free PCB assembly processes.
ESD341DPLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 5V, 7.2V
- Voltage - Clamping (Max) @ Ipp:
- 8.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5.4A (8/20µs)
- Power - Peak Pulse:
- 54W
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.66pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2SON (0.6x0.3)
ESD341DPLR FAQ
1.How can I place an order for ESD341DPLR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD341DPLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD341DPLR reliable?
The price and inventory of ESD341DPLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD341DPLR is usually 5 days.
3.What payment methods are accepted for ESD341DPLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD341DPLR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD341DPLR?
ESD341DPLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD341DPLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD341DPLR?
For technical support, including ESD341DPLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD341DPLR requirements.
6.How does Aetrix verify that ESD341DPLR is sourced from the original manufacturer or authorized distributors?
All ESD341DPLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD341DPLR meets industry standards.
7.What is the process for return or replacement of ESD341DPLR?
All ESD341DPLR units undergo pre-shipment inspection (PSI). If there is an issue with ESD341DPLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD341DPLR part is unused and in its original packaging.
Return procedure for ESD341DPLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD341DPLR Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
