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Texas Instruments ESD451DPLR
- Part No.:
- ESD451DPLR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
ESD451DPLR.pdf
- Description:
- TVS DIODE 5.5VWM 9.5VC 2-X2SON
- Quantity:
- Payment:
- Shipping:
Inventory:9,506
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Product details
Overview
ESD451DPLR from Texas Instruments is a 1-channel bidirectional ESD protection diode in a 0.6 mm × 0.3 mm X2SON (DPL) package, rated for ±30 kV IEC 61000-4-2 contact/air-gap discharge, 6 A (8/20 µs) surge current, and 0.5 pF typical IO capacitance - enabling robust, low-distortion protection of high-speed USB 3.0 and HDMI 2.0 data lines in space-constrained portable electronics.
For engineers reviewing the ESD451DPLR datasheet, ESD451DPLR pinout, ESD451DPLR application, or ESD451DPLR equivalent, this page delivers verified electrical parameters, thermal metrics, clamping behavior at 16 A TLP, dynamic resistance (0.19 Ω), and layout-critical package dimensions - all essential for signal integrity validation and PCB-level ESD hardening.
Technical Context
The ESD451DPLR operates as a bidirectional TVS diode with symmetrical breakdown (±8 V typ) and ultra-low dynamic resistance (0.19 Ω), enabling rapid clamping to ≤10.4 V at 16 A TLP while maintaining sub-0.5 pF capacitance across DC–6 GHz. Its DPL package integrates an exposed thermal pad optimized for board-level heat dissipation (RθJB = 136.4 °C/W).
Designed for parallel placement on I/O lines, it shunts transient energy directly to GND without series impedance - supporting system-level ESD immunity per IEC 61000-4-2 Level 4 and surge resilience per IEC 61000-4-5 (6 A, 8/20 µs). It functions within –55°C to +150°C ambient, with leakage <50 nA at 5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±30 kV contact & air-gap discharge - meets Level 4 immunity for handheld and wearable end equipment. |
| Surge Current (IEC 61000-4-5) | 6 A (8/20 µs) - protects against lightning-induced transients on 5.5 V data/power rails. |
| IO Capacitance | 0.5 pF typical - preserves signal integrity up to 6 Gbps (e.g., USB 3.0 Gen 1, HDMI 2.0). |
| Clamping Voltage (TLP) | 10.4 V at 16 A - limits voltage seen by protected IC to safe levels during worst-case ESD events. |
| Dynamic Resistance | 0.19 Ω - ensures minimal voltage overshoot and fast response under high-current transients. |
| Operating Temperature | –55°C to +150°C - supports industrial and automotive-adjacent applications including vacuum robots and docking stations. |
| Leakage Current | ≤50 nA at 5.5 V - avoids loading of low-power sensor or RF front-end circuits. |
Pinout & Package
X2SON (DPL) package: 2-pin, 0.6 mm × 0.3 mm footprint, 0.45 mm max height, exposed thermal pad, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (IO) | I/O terminal | Bidirectional ESD channel - connects to protected signal line (e.g., USB D+, HDMI TMDS+); must be routed with controlled impedance and minimal stub length. |
| Pin 2 (GND) | GND terminal | Low-inductance path to system ground plane - requires direct connection to solid ground via multiple vias under exposed pad for optimal clamping performance. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential signals (e.g., USB 3.0, DisplayPort) without polarity constraints. |
| 0.5 pF capacitance | Minimizes insertion loss (< –3 dB at 3.5 GHz) and preserves eye diagram integrity in >5 Gbps interfaces. |
| 0.19 Ω dynamic resistance | Reduces clamping voltage overshoot and improves energy-handling margin versus higher-RDYN alternatives. |
| –55°C to +150°C operation | Supports deployment in thermally aggressive environments such as retail kiosks, smart speakers, and industrial docking stations. |
| 0201-compatible footprint | Enables drop-in replacement in legacy 0201 layouts while delivering superior ESD performance over generic MLV solutions. |
Applications
| USB 3.0 Interface Protection | HDMI 2.0 Data Line Protection |
|---|---|
Use Scenario: Protecting SuperSpeed USB 3.0 differential pairs in portable SSD enclosures and mobile docking stations against user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed inline between connector and USB controller PHY, clamping transients before they reach silicon. Use Value: 0.5 pF capacitance prevents signal degradation at 5 Gbps; ±30 kV rating exceeds IEC 61000-4-2 Level 4 requirements for consumer-facing ports. |
Use Scenario: Safeguarding HDMI 2.0 TMDS channels in compact monitors and streaming sticks where board space limits discrete protection options. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each TMDS+/- pair, referenced to chassis ground to suppress common-mode surges. Use Value: 10.4 V clamping at 16 A TLP ensures downstream SerDes remains below absolute maximum ratings during 8-kV IEC waveform events. |
| Wearable Sensor Hub Protection | Vacuum Robot Control Interface |
Use Scenario: Shielding I²C/SPI lines connecting motion sensors and battery fuel gauges in fitness trackers and hearables from assembly-line ESD. IC Role / Device Role / Timing Role: Ultra-low-leakage (≤50 nA) bidirectional clamp on low-voltage (1.8–3.3 V) digital buses, minimizing standby power impact. Use Value: 0.6 mm × 0.3 mm DPL footprint fits within tight keep-out zones near MEMS packages; –55°C to +150°C range accommodates reflow and operational extremes. |
Use Scenario: Hardening RS-485 or CAN FD communication lines in semiconductor manufacturing vacuum robots exposed to repetitive static discharge in dry N₂ environments. IC Role / Device Role / Timing Role: Robust surge protector on isolated data lines, leveraging 6 A (8/20 µs) rating to survive repeated electrostatic discharges in cleanroom automation. Use Value: 136.4 °C/W junction-to-board thermal resistance enables reliable operation without heatsinking in sealed, convection-limited enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD451DPYR | Larger X1SON (DPY) package (1.0 mm × 0.6 mm); higher clamping (11.5 V @ 16 A TLP); 0.24 Ω RDYN; 0.5 pF capacitance retained. | Better thermal dissipation (RθJB = 121.4 °C/W) but requires larger PCB area - preferred for higher-power or thermally constrained designs. | Select ESD451DPYR when board layout allows 0402 footprint and thermal budget demands lower junction temperature rise. |
| SMA6J33A-Q | Unidirectional 33 V standoff; 600 W peak pulse power; 100 pF capacitance; DO-214AC package - not suitable for high-speed data lines. | Intended for 12–24 V power rail protection only; incompatible with USB/HDMI due to excessive capacitance and unidirectional architecture. | Choose SMA6J33A-Q only for DC power input protection where speed and capacitance are irrelevant - not a functional substitute for ESD451DPLR. |
Compared with ESD451DPYR, ESD451DPLR offers superior space efficiency and marginally lower clamping voltage, making it optimal for ultra-dense portable designs; compared with SMA6J33A-Q, it delivers 200× lower capacitance and bidirectional symmetry - essential for modern high-speed serial interfaces.
Availability
ESD451DPLR is available at Aetrix Electronics and suitable for USB 3.0 interface protection, HDMI 2.0 data line hardening, and wearable sensor hub ESD mitigation requiring stable component supply and long-term production continuity.
Supply support for ESD451DPLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ESD protection device physics and system-level transient modeling.
The ESD451 family targets high-speed interface protection in miniaturized consumer and industrial electronics - engineered to balance ultra-low capacitance, sub-11 V clamping, and industry-standard 0201/0402 footprints for seamless integration into next-generation portable platforms.
FAQ
What is the maximum clamping voltage of ESD451DPLR under a 16 A TLP stress condition?
The ESD451DPLR clamps to 10.4 V at 16 A TLP (transmission line pulse), measured IO-to-GND. This value is specified in the Electrical Characteristics table (Section 5.6) of the TI SLVSH27B datasheet and reflects worst-case voltage presented to protected circuitry during an ESD event. The low dynamic resistance (0.19 Ω) directly contributes to this tightly controlled clamping performance.
Can ESD451DPLR be used to protect a 3.3 V I²C bus in a wearable device?
Yes, ESD451DPLR is suitable for 3.3 V I²C bus protection: its ±8 V DC breakdown voltage provides ample margin above the 3.3 V rail, leakage remains ≤50 nA at 5.5 V, and 0.5 pF capacitance avoids signal rise-time degradation on standard 400 kHz or 1 MHz I²C lines. Layout best practices - short traces, direct GND vias - are critical to maintain performance.
Does ESD451DPLR meet IEC 61000-4-5 surge immunity requirements?
Yes, ESD451DPLR is rated for 6 A (8/20 µs) per IEC 61000-4-5, with clamping voltage of 9.5 V under that surge condition. This rating applies to both IO-to-GND and GND-to-IO directions and is validated in Section 5.6 of the TI datasheet. It is intended for secondary-level surge protection in conjunction with primary suppressors in full-system designs.
What is the thermal resistance from junction to board (RθJB) for ESD451DPLR?
The junction-to-board thermal resistance (RθJB) for ESD451DPLR is 136.4 °C/W, as specified in Table 5-5 (Thermal Information) of the TI SLVSH27B datasheet. This value assumes proper PCB layout with the exposed thermal pad soldered to a minimum 10 mm² copper area and ≥4 thermal vias - essential for sustaining repeated ESD events without thermal runaway.
Is ESD451DPLR compatible with lead-free reflow profiles?
Yes, ESD451DPLR has an MSL Level-1 rating with peak reflow temperature of 260°C (unlimited floor life), fully compliant with IPC/JEDEC J-STD-020. Its NiPdAu lead finish and X2SON package support standard lead-free reflow profiles, including ramp-to-spike and soak profiles, provided board thermal mass and oven profiling align with TI's recommended guidelines in the packaging addendum.
ESD451DPLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 7V
- Voltage - Clamping (Max) @ Ipp:
- 9.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 6A (8/20µs)
- Power - Peak Pulse:
- 57W
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2SON (0.6x0.3)
ESD451DPLR FAQ
1.How can I place an order for ESD451DPLR through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD451DPLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD451DPLR reliable?
The price and inventory of ESD451DPLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD451DPLR is usually 5 days.
3.What payment methods are accepted for ESD451DPLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD451DPLR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD451DPLR?
ESD451DPLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD451DPLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD451DPLR?
For technical support, including ESD451DPLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD451DPLR requirements.
6.How does Aetrix verify that ESD451DPLR is sourced from the original manufacturer or authorized distributors?
All ESD451DPLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD451DPLR meets industry standards.
7.What is the process for return or replacement of ESD451DPLR?
All ESD451DPLR units undergo pre-shipment inspection (PSI). If there is an issue with ESD451DPLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD451DPLR part is unused and in its original packaging.
Return procedure for ESD451DPLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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