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onsemi ESD5004MXTBG
- Part No.:
- ESD5004MXTBG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
ESD5004MXTBG.pdf
- Description:
- TVS DIODE 3.3VWM 9.1VC 4X3DFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,501
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Product details
Overview
ESD5004MXTBG from onsemi is a low-capacitance, quad-channel bidirectional ESD protection diode array designed for I/O line protection in portable electronics. It features 3.3 V reverse working voltage, ≤5.0 pF junction capacitance (I/O-to-GND), ±12 kV contact/±15 kV air IEC 61000−4−2 ESD rating, and clamps to ≤9.1 V at 1 A TLP current. It is used to safeguard high-speed data lines in smartphones and USB interfaces.
For engineers reviewing the ESD5004MXTBG datasheet, pinout, applications, or equivalent options, key selection criteria include I/O-to-GND capacitance ≤5 pF, IEC Level 4 compliance, clamping voltage under 10 V at 16 A TLP, quad-channel integration in X3DFN4 package, and RoHS-compliant Pb-free construction.
Technical Context
The ESD5004MXTBG implements four independent bidirectional TVS structures in a single monolithic silicon die, each configured as a back-to-back Zener pair between I/O and GND. Its low 3.5–5.0 pF capacitance enables use on USB 2.0, HDMI, and audio jack signal paths without signal integrity degradation.
It meets IEC 61000−4−2 Level 4 (±8 kV contact / ±15 kV air) with clamping voltages of 4.5 V (−16 A) and 10 V (+16 A) under TLP testing, and operates across −55°C to +125°C junction temperature range with 3.9 V minimum breakdown voltage per channel.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.3 V - Maximum continuous DC voltage applied to I/O pins without leakage exceeding 1 µA |
| Breakdown Voltage | 3.9 V min - Ensures reliable turn-on before system IC damage threshold in ESD events |
| Junction Capacitance | 3.5–5.0 pF - Enables <1% signal distortion on 480 Mbps USB 2.0 differential pairs |
| ESD Rating | ±12 kV contact / ±15 kV air (IEC 61000−4−2 Level 4) - Validated protection for handheld device touch surfaces and ports |
| Clamping Voltage | ≤9.1 V at 1 A TLP - Limits transient overvoltage seen by downstream PHY or controller during fast ESD pulses |
| Operating Temperature | −55°C to +125°C - Supports deployment in automotive infotainment and industrial handhelds |
Pinout & Package
ESD5004MXTBG is housed in a 5-pin X3DFN4 (Case 714AA) package measuring 0.525 mm × 0.925 mm × 0.3 mm with exposed thermal pad. Pin 1 is marked by a dot; pins 2–5 are I/O terminals; pin 3 is common GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode of Channel 1 | Input/output line 1 connection; bidirectionally clamps to GND during positive/negative transients |
| 2 | Cathode of Channel 1 / Anode of Channel 2 | Shared node between Ch1 and Ch2; connects to GND via internal Zener stack |
| 3 | Ground (GND) | Common reference and return path for all four ESD protection channels |
| 4 | Anode of Channel 3 / Cathode of Channel 4 | Shared node between Ch3 and Ch4; ties to GND through integrated dual-Zener structure |
| 5 | Cathode of Channel 4 | Input/output line 4 connection; completes fourth bidirectional protection path |
Key Features
| Feature | Design Value |
|---|---|
| Quad bidirectional protection | Four independent I/O-to-GND paths in one 0.525×0.925 mm package - saves >70% board area vs. discrete diodes |
| Low 5 pF max capacitance | Preserves signal rise/fall times on 480 Mbps USB 2.0 and 1080p HDMI TMDS lines |
| IEC 61000−4−2 Level 4 compliant | Validated for ±8 kV contact and ±15 kV air discharge - meets smartphone drop-test ESD requirements |
| Pb-free, Halogen-free, RoHS | Complies with IPC-J-STD-020 moisture sensitivity level 1 (MSL1) and JEDEC reflow profile |
Applications
| Smartphone Front Panel Interfaces | USB 2.0 OTG Ports |
|---|---|
Use Scenario: Protecting touchscreen controller I²C lines and front-facing camera data buses from user-hand ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point before ASIC input pins. Use Value: Prevents latch-up or gate oxide damage in PMIC and display driver ICs during ±15 kV air discharge events. | Use Scenario: Shielding D+ and D− lines of micro-USB receptacles in portable power banks and accessories. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp ensuring <100 ps signal delay and no eye diagram degradation at 480 Mbps. Use Value: Maintains USB 2.0 compliance while surviving repeated ±12 kV contact discharges at the mechanical interface. |
| Notebook Audio Jacks | Industrial Handheld Keypads |
Use Scenario: Guarding 3.5 mm TRRS headset jack lines (MIC, L/R, GND) against ESD from headphone insertion/removal. IC Role / Device Role / Timing Role: Four-channel ESD array covering MIC, left, right, and sleeve contacts with shared GND terminal. Use Value: Eliminates pop-noise and audio codec reset caused by 8 kV contact ESD on analog audio paths. | Use Scenario: Securing membrane keypad scan lines and backlight control signals in warehouse scanners operating at −25°C to +70°C ambient. IC Role / Device Role / Timing Role: Quad ESD protector mounted adjacent to keypad connector, leveraging wide −55°C to +125°C operating range. Use Value: Prevents false keypresses and firmware lockup due to ESD-induced logic glitches on 3.3 V GPIO lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DRYR | 4-channel, 1.5 pF typical capacitance, 3.6 V VRWM, ±12 kV IEC contact rating | Lower capacitance suits USB 3.0 SuperSpeed; not rated for ±15 kV air discharge | Prefer when signal bandwidth >1 GHz required and air discharge immunity is secondary |
| SP3204-01UTG | 4-channel, 0.6 pF typical capacitance, 3.3 V VRWM, ±8 kV IEC contact rating only | Ultra-low capacitance ideal for MIPI D-PHY; lacks Level 4 air discharge validation | Choose for high-density mobile camera modules where board space and 1.5 GHz signal fidelity are critical |
Compared with TPD4E001DRYR and SP3204-01UTG, the ESD5004MXTBG delivers balanced performance: higher air discharge immunity (±15 kV) than both alternatives, moderate 5 pF capacitance suitable for USB 2.0/audio, and full Level 4 certification - making it optimal for cost-sensitive consumer port protection where robustness and footprint efficiency are prioritized.
Availability
ESD5004MXTBG is available at Aetrix Electronics and suitable for smartphone front panels, USB 2.0 OTG ports, and notebook audio jacks requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for ESD5004MXTBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The ESD5004MXTBG belongs to onsemi's ESD Protection Diode family, engineered specifically for space-constrained, high-speed interface protection in portable consumer electronics with stringent IEC 61000−4−2 Level 4 compliance requirements.
FAQ
What is the maximum junction capacitance of the ESD5004MXTBG?
The ESD5004MXTBG has a maximum junction capacitance of 5.0 pF measured between each I/O pin and GND at 0 V bias and 1 MHz frequency. This value is specified in the Electrical Characteristics table of the official datasheet (Rev. 4, August 2024) and ensures minimal loading on high-speed signal lines such as USB 2.0 and audio interfaces. The typical capacitance is 3.5 pF, supporting clean signal integrity in compact portable designs.
Does the ESD5004MXTBG meet IEC 61000−4−2 Level 4 ESD immunity?
Yes, the ESD5004MXTBG is fully rated for IEC 61000−4−2 Level 4: ±8 kV contact discharge and ±15 kV air discharge. This is confirmed in the Maximum Ratings table and validated via TLP testing per ANSI/ESD STM5.5.1. The device clamps to ≤10 V at ±16 A TLP current, providing robust protection for sensitive interfaces in smartphones and portable electronics where user-hand ESD exposure is frequent.
What package type does the ESD5004MXTBG use, and what are its dimensions?
The ESD5004MXTBG uses the X3DFN4 package (Case 714AA), a 5-terminal leadless DFN measuring 0.525 mm × 0.925 mm × 0.3 mm with 0.3 mm pitch and an exposed thermal pad. Dimensions are documented in the Package Dimensions section (page 5) of the ESD5004/D datasheet. The package supports MSL1 handling and standard reflow profiles, enabling high-yield assembly in fine-pitch portable PCBs.
How many protected I/O lines does the ESD5004MXTBG support?
The ESD5004MXTBG supports four separate bidirectional I/O lines, each independently protected between its respective pin and the common GND terminal (Pin 3). The internal schematic shows four back-to-back Zener configurations sharing one ground node - enabling full quad-line protection in a single 0.5 mm × 0.9 mm footprint, eliminating the need for four discrete diodes and reducing layout complexity.
Is the ESD5004MXTBG RoHS compliant and halogen-free?
Yes, the ESD5004MXTBG is RoHS compliant, Pb-free, and halogen-free/BFR-free as stated in the Features section of the datasheet. It meets EU Directive 2011/65/EU and satisfies IPC-1752 material declaration requirements. The "M" in the part number denotes Pb-free packaging, and the device is qualified per J-STD-020 MSL1, supporting lead-free reflow soldering without compromising ESD performance or reliability.
ESD5004MXTBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 4-XFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.9V
- Voltage - Clamping (Max) @ Ipp:
- 9.1V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 3.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-X3DFN (0.53x0.93)
ESD5004MXTBG FAQ
1.How can I place an order for ESD5004MXTBG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD5004MXTBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD5004MXTBG reliable?
The price and inventory of ESD5004MXTBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD5004MXTBG is usually 5 days.
3.What payment methods are accepted for ESD5004MXTBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD5004MXTBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD5004MXTBG?
ESD5004MXTBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD5004MXTBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD5004MXTBG?
For technical support, including ESD5004MXTBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD5004MXTBG requirements.
6.How does Aetrix verify that ESD5004MXTBG is sourced from the original manufacturer or authorized distributors?
All ESD5004MXTBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD5004MXTBG meets industry standards.
7.What is the process for return or replacement of ESD5004MXTBG?
All ESD5004MXTBG units undergo pre-shipment inspection (PSI). If there is an issue with ESD5004MXTBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD5004MXTBG part is unused and in its original packaging.
Return procedure for ESD5004MXTBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD5004MXTBG Tags
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