onsemi ESD5484FCT5G
- Part No.:
- ESD5484FCT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XFBGA, WLCSP
- Datasheet:
-
ESD5484FCT5G.pdf
- Description:
- TVS DIODE 5VWM 11.5VC 2WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:7,625
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Product details
Overview
ESD5484FCT5G from onsemi is a bidirectional ESD protection diode in a WLCSP2 package, designed for I/O line protection in portable electronics. It features a 5.0 V stand-off voltage, clamping voltage of 10.3 V at 3 A (IEC61000−4−2), <1 ns response time, and 35 pF typical capacitance - enabling robust electrostatic discharge suppression in space-constrained interfaces such as USB 2.0 and audio jacks.
For engineers reviewing the ESD5484FCT5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping performance under ±30 kV contact ESD, low leakage (<0.1 µA @ 5.0 V), IEC61000−4−2 Level 4 compliance, and compatibility with fine-pitch 0.36 mm pitch PCB layouts.
Technical Context
The ESD5484FCT5G implements a bidirectional silicon avalanche diode structure optimized for fast transient suppression without parasitic turn-on in normal operation. Its low 35 pF capacitance and sub-1 ns response ensure signal integrity preservation on high-speed data lines up to 480 Mbps.
Designed for placement directly at connector-level I/O pins, it operates within −55°C to +150°C junction temperature range and meets MSL 1 reflow requirements (260°C peak). The device delivers 30 kV air/30 kV contact ESD immunity per IEC61000−4−2 Level 4 while maintaining <0.1 µA reverse leakage at rated VRWM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 5.0 V - Maximum continuous operating voltage before conduction begins; ensures no interference with 5 V logic or USB signaling. |
| Clamping Voltage | 10.3 V @ 3 A - Peak voltage seen by protected IC during 8 kV contact ESD event; limits stress on downstream transceivers. |
| Capacitance | 35 pF - Low enough to avoid signal degradation on USB 2.0 and audio paths; measured at 1 MHz, 0 V bias. |
| Response Time | <1 ns - Enables suppression before ESD pulse energy couples into sensitive circuitry. |
| ESD Rating | ±30 kV contact / ±30 kV air - Full IEC61000−4−2 Level 4 compliance; exceeds system-level pass thresholds. |
| Leakage Current | 0.1 µA @ 5.0 V - Minimizes standby power loss and avoids false triggering in battery-powered devices. |
| Package Size | 0.60 mm × 0.30 mm × 0.30 mm - Ultra-compact WLCSP2 footprint ideal for mobile front-panel interfaces. |
Pinout & Package
ESD5484FCT5G uses the WLCSP2 (Wafer-Level Chip-Scale Package) with two terminals: anode and cathode. The package has no leads; solder balls are located on the bottom surface aligned to a 0.36 mm pitch. Marking "B" identifies the device variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | ESD current sink terminal | Connected to ground plane; conducts transient current away from protected line during positive ESD events. |
| 2 (Anode) | ESD current source terminal | Connected to I/O line; provides low-impedance path to ground for negative ESD transients via bidirectional avalanche action. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or differential lines (e.g., USB D+/D−, audio stereo) without polarity constraints. |
| 0.6 mm × 0.3 mm footprint | Reduces PCB area by >50% vs. 0201 discrete diodes; fits within tight spacing near micro-USB or SIM card connectors. |
| IEC61000−4−4 Level 4 EFT immunity | Withstands 40 A surge pulses (5/50 ns) - protects against electrical fast transients induced by relay switching or motor commutation. |
| Pb-free, Halogen-free, RoHS-compliant | Meets global environmental regulations and supports lead-free reflow profiles up to 260°C peak temperature. |
| MSL 1 rating | Allows unlimited floor life and eliminates bake-out requirements prior to assembly - reduces manufacturing overhead. |
Applications
| USB 2.0 Interface Protection | Smartphone Audio Jack Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of micro-USB ports in smartphones against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed within 2 mm of connector, clamping surges before they reach USB PHY IC. Use Value: Prevents latch-up or gate oxide damage in USB transceivers while maintaining <480 Mbps data integrity via 35 pF capacitance. | Use Scenario: Shielding 3.5 mm TRRS audio jack contacts from user-hand ESD during headset insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance shunt diode across left/right/ground/mic lines to divert ±8 kV contact discharges. Use Value: Eliminates audible pop/crackle in audio playback and prevents analog-to-digital converter corruption during ESD events. |
| Digital Camera Button Interface | Wearable Device Touch Sensor Lines |
Use Scenario: Guarding mechanical button traces on compact digital camera bodies exposed to frequent handling ESD. IC Role / Device Role / Timing Role: Standoff-rated (5.0 V) clamp on GPIO input lines tied to tactile switches, activated only during ESD transients. Use Value: Maintains clean logic thresholds during normal operation (<0.1 µA leakage) while suppressing >30 kV contact discharges. | Use Scenario: Securing capacitive touch sensor traces on wrist-worn fitness trackers from finger-tip ESD. IC Role / Device Role / Timing Role: Ultra-small-footprint protector mounted directly at flex connector entry point to preserve signal-to-noise ratio. Use Value: Enables reliable touch detection with no false triggers or baseline drift due to ESD-induced charge injection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.65 mm × 0.35 mm DFN-2 package; 12 V clamping @ 3 A; 12 pF capacitance | Lower capacitance suits USB 3.0/MIPI D-PHY; higher clamping voltage increases protected IC stress margin | Select when lower capacitance is critical and system can tolerate higher clamping voltage |
| ESD9X5.0ST5G | SOD-523 package (1.2 mm × 0.8 mm); 12.5 V clamping @ 3 A; 45 pF capacitance | Larger footprint eases manual rework but limits ultra-dense layouts; higher leakage (1 µA) | Choose for prototyping or cost-sensitive designs where board space is less constrained |
Compared with TPD2E001DRYR and ESD9X5.0ST5G, the ESD5484FCT5G offers the smallest footprint (0.6 × 0.3 mm) and lowest clamping voltage (10.3 V) among these three, making it optimal for production-grade mobile I/O protection where PCB real estate and voltage headroom are simultaneously constrained.
Availability
ESD5484FCT5G is available at Aetrix Electronics and suitable for smartphone USB interfaces, wearable audio subsystems, and compact camera control panels requiring stable component supply and full IEC61000−4−2 Level 4 compliance.
Supply support for ESD5484FCT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The ESD5484FCT5G belongs to onsemi's Micro-Packaged Diodes for ESD Protection product line, engineered specifically for ultra-compact, high-reliability transient suppression in portable and wearables platforms.
FAQ
What is the maximum working voltage supported by ESD5484FCT5G?
The ESD5484FCT5G has a working peak reverse voltage (VRWM) of 5.0 V, meaning it can safely operate on DC or signal lines with continuous voltages up to this level without conducting. This makes ESD5484FCT5G suitable for protecting 3.3 V and 5 V I/O rails, including USB 2.0 data lines and audio codec interfaces, while remaining non-intrusive during normal operation.
Does ESD5484FCT5G require external biasing or control signals?
No, ESD5484FCT5G is a passive bidirectional avalanche diode and requires no external power, biasing, or control signals. It functions solely through its intrinsic PN junction characteristics - conducting only during overvoltage transients exceeding its breakdown threshold. This passive behavior ensures zero design overhead and full transparency to signal integrity in ESD5484FCT5G deployments.
Can ESD5484FCT5G be used for both positive and negative ESD events?
Yes, ESD5484FCT5G is explicitly designed as a bidirectional ESD protection device. Its symmetrical avalanche structure allows it to clamp both positive and negative ESD transients equally - verified by identical ±30 kV contact/air ratings per IEC61000−4−2. This enables single-device protection of AC-coupled or differential lines without polarity concerns in ESD5484FCT5G implementations.
What is the thermal resistance of ESD5484FCT5G and how does it affect reliability?
The ESD5484FCT5G has a junction-to-ambient thermal resistance (RJA) of 400°C/W on FR-5 board. While ESD events are nanosecond-scale and thermally insignificant, this RJA value supports safe operation under continuous conditions - especially important if the device experiences sustained leakage or fault currents. Its 150°C max junction temperature and MSL 1 rating further ensure long-term reliability in ESD5484FCT5G-equipped consumer electronics.
Is ESD5484FCT5G compatible with standard SMT reflow processes?
Yes, ESD5484FCT5G is qualified for Pb-free reflow with a maximum solder temperature of 260°C (10-second duration) and meets MSL 1 requirements - meaning it can be stored indefinitely at ambient conditions without baking. Its WLCSP2 package is compatible with Type 4 solder paste and 0.1 mm stencil thickness, supporting high-yield assembly in automated SMT lines using ESD5484FCT5G.
ESD5484FCT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 11.5V
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-WLCSP (0.6x0.3)
ESD5484FCT5G FAQ
1.How can I place an order for ESD5484FCT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD5484FCT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD5484FCT5G reliable?
The price and inventory of ESD5484FCT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD5484FCT5G is usually 5 days.
3.What payment methods are accepted for ESD5484FCT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD5484FCT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD5484FCT5G?
ESD5484FCT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD5484FCT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD5484FCT5G?
For technical support, including ESD5484FCT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD5484FCT5G requirements.
6.How does Aetrix verify that ESD5484FCT5G is sourced from the original manufacturer or authorized distributors?
All ESD5484FCT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD5484FCT5G meets industry standards.
7.What is the process for return or replacement of ESD5484FCT5G?
All ESD5484FCT5G units undergo pre-shipment inspection (PSI). If there is an issue with ESD5484FCT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD5484FCT5G part is unused and in its original packaging.
Return procedure for ESD5484FCT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD5484FCT5G Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
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