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onsemi ESD6100
- Part No.:
- ESD6100
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 4-UFBGA, WLCSP
- Datasheet:
-
ESD6100.pdf
- Description:
- TVS DIODE 3VWM 9.8VC 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:8,848
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Product details
Overview
ESD6100 from onsemi is a 2-channel, 4-bump wafer-level chip-scale package (WLCSP4) ESD protection device with 1.5 pF typical channel input capacitance, ±8 kV contact/±15 kV air IEC 61000-4-2 compliance, and 9.8 V positive clamp voltage at 1 A transient current-designed for high-speed data lines in mobile audio interfaces and USB 2.0 ports.
For engineers reviewing the ESD6100 datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance matching (≤0.02 pF), dual-channel symmetry, ground-referenced bidirectional clamping, and WLCSP4 footprint compatibility with space-constrained portable PCB layouts.
Technical Context
The ESD6100 implements a dual-channel, ground-referenced TVS diode architecture with matched capacitive coupling to preserve signal integrity on differential or parallel high-speed lines. Each channel features independent breakdown at 6 V (IF = 1 mA) and dynamic resistance of 0.7 Ω (positive) / 0.5 Ω (negative) under 8/20 µs transients.
It operates across –40°C to +85°C and supports 3.0–5.5 V supply rails while maintaining ≤100 nA leakage at 3 V. Its 0.8 mm × 0.8 mm WLCSP4 package uses solder bumps with 0.4 mm pitch and coplanarity controlled to 0.05 mm per ASME Y14.5M.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 2 independent ESD channels with matched capacitance and clamping |
| Input Capacitance | 1.5 pF typical per channel at 1 MHz - preserves signal rise time on >100 Mbps interfaces |
| Capacitance Matching | ≤0.02 pF max mismatch - ensures balanced performance on differential pairs |
| ESD Rating | ±8 kV contact / ±15 kV air per IEC 61000-4-2 - meets industrial and mobile end-equipment immunity requirements |
| Clamp Voltage | +9.8 V / −1.5 V at 1 A, 8/20 µs - protects downstream 3.3 V or 5 V logic without overstress |
| Leakage Current | ≤100 nA at 3 V - avoids DC loading on sensitive analog or RF bias networks |
| Package | WLCSP4, 0.8 mm × 0.8 mm, 0.4 mm pitch - enables placement adjacent to connectors or IC pads |
Pinout & Package
ESD6100 is housed in a 4-bump WLCSP4 (Case 567CB) package measuring 0.8 mm × 0.8 mm with 0.4 mm bump pitch and coplanarity ≤0.05 mm. Bumps are arranged in a 2×2 grid: A1 and A2 serve as protected I/O channels; B1 and B2 are tied internally to device ground and must be connected to system ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD Channel 1 Anode | Protected I/O node for first high-speed line (e.g., USB D+) |
| A2 | ESD Channel 2 Anode | Protected I/O node for second high-speed line (e.g., USB D−) |
| B1 | Device Ground | Low-inductance ground return path - requires direct connection to solid ground plane |
| B2 | Device Ground | Redundant ground terminal to minimize ground loop impedance and improve clamping symmetry |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel matched capacitance | 1.5 pF typical per channel with ≤0.02 pF inter-channel mismatch - maintains signal skew <1 ps on matched traces |
| Ultra-low leakage | ≤100 nA at 3 V - prevents battery drain and offset errors in always-on sensor interfaces |
| IEC 61000-4-2 certified | ±8 kV contact / ±15 kV air rating - qualifies for EN 61000-6-2/6-4 and IEC 61000-4-5 system-level testing |
| Ground-referenced bidirectional clamping | Clamps both positive and negative transients to GND - eliminates need for separate pull-up/pull-down biasing |
| WLCSP4 footprint | 0.8 mm × 0.8 mm, 0.4 mm pitch - fits within 0.3 mm clearance around micro-B USB or MIPI D-PHY connector pads |
Applications
| USB 2.0 Data Lines | Mobile Audio Jacks |
|---|---|
Use Scenario: Protecting D+ and D− pins of micro-USB or USB-C receptacles against user-handling ESD events during plug insertion/removal. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point, before series resistors or EMI filters. Use Value: 1.5 pF capacitance avoids signal degradation at 480 Mbps; ±8 kV contact rating exceeds IEC 61000-4-2 Level 4 requirement. | Use Scenario: Shielding stereo headset jack contacts (Tip/Ring/Sleeve) from ESD during cable plugging into smartphones or tablets. IC Role / Device Role / Timing Role: Dual-channel clamp protecting left/right audio paths and microphone bias line simultaneously. Use Value: Matched 1.5 pF capacitance prevents crosstalk imbalance; low leakage avoids DC bias shift in electret microphone circuits. |
| MIPI D-PHY Interfaces | Industrial Sensor I/O |
Use Scenario: Safeguarding high-speed camera module data lanes (CLK/LP/HS) in automotive ADAS or smartphone imaging subsystems. IC Role / Device Role / Timing Role: Low-capacitance ESD shunt placed at image sensor flex-cable interface to prevent latch-up during board handling. Use Value: 0.02 pF capacitance matching minimizes differential skew on 1–2 Gbps D-PHY lanes; WLCSP4 size allows co-location with connector. | Use Scenario: Protecting analog outputs (e.g., 4–20 mA transmitter lines) or digital I/O (RS-485, CAN FD stubs) in factory automation modules exposed to maintenance personnel. IC Role / Device Role / Timing Role: Ground-referenced transient suppressor on field-side signal lines, rated for industrial ambient temperature range (–40°C to +85°C). Use Value: 9.8 V clamp voltage safely limits stress on 12 V or 24 V interface ICs; RoHS II compliance supports EU industrial equipment directives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel low-capacitance ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 1.0 pF typical capacitance, single-supply rail clamp, 0.65 mm × 0.65 mm DRY package | Optimized for lower-capacitance USB 3.0/PCIe Gen1; lacks dual-ground terminals | Prefer when layout space is tighter and 1.0 pF is required; verify ground inductance impact on clamping symmetry |
| ESD7504MUTAG | 2.5 pF typical capacitance, 4-channel, SOT-563 package, higher leakage (≤500 nA) | Suited for multi-line protection where footprint density outweighs capacitance penalty | Select when protecting >2 lines on same net or when rework-friendly SMT package is mandatory over WLCSP |
Compared with TPD2E001DRYR and ESD7504MUTAG, the ESD6100 delivers tighter capacitance matching (0.02 pF vs. unspecified), dual ground terminals for lower transient impedance, and optimized WLCSP4 mechanical robustness for flex-cable-mounted applications-making it preferred for miniaturized, high-reliability mobile interfaces.
Availability
ESD6100 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, mobile audio jack hardening, and MIPI D-PHY lane safeguarding requiring stable component supply across consumer electronics, automotive infotainment, and industrial IoT production programs.
Supply support for ESD6100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and mobile markets.
The ESD6100 belongs to onsemi's ultra-low-capacitance ESD protection product line, engineered specifically for preserving signal fidelity on high-speed serial interfaces while meeting stringent IEC 61000-4-2 system-level immunity requirements.
FAQ
What is the maximum operating temperature range for the ESD6100?
The ESD6100 is specified to operate reliably from –40°C to +85°C. This range aligns with commercial and extended industrial ambient conditions and is validated per JEDEC JESD22-A104 thermal cycling standards. The device maintains its 1.5 pF capacitance and ±8 kV ESD rating across this full range. Thermal derating is not required, and the ESD6100 remains fully functional up to its storage limit of +150°C - though sustained operation above +85°C is not guaranteed per datasheet specifications.
Does the ESD6100 require external biasing or control signals?
No, the ESD6100 is a passive, diode-based transient voltage suppressor with no external bias or enable requirements. It functions autonomously whenever a voltage transient exceeds its 6 V breakdown threshold. The device draws zero static current except for its inherent leakage (≤100 nA at 3 V), and no PCB traces for VCC or EN are needed. All functionality is embedded in its dual-channel TVS structure - making ESD6100 integration simple and footprint-efficient in signal path designs.
How does the dual-ground configuration (B1 and B2) improve ESD performance in the ESD6100?
The dual-ground terminals B1 and B2 reduce total ground path inductance by providing parallel low-impedance return paths to the PCB ground plane. This lowers dynamic resistance during fast ESD transients (e.g., 8/20 µs pulses), resulting in tighter clamp voltage control (+9.8 V / −1.5 V at 1 A). Measured data shows ≤0.5 Ω negative dynamic resistance - critical for protecting sensitive 3.3 V receivers. Layout best practice requires connecting both B1 and B2 directly to a solid ground plane with minimal trace length.
Can the ESD6100 be used on differential high-speed lines like HDMI or DisplayPort?
The ESD6100 is not recommended for HDMI or DisplayPort due to its 1.5 pF per-channel capacitance - exceeding the ≤0.5 pF typical requirement for 5+ Gbps differential signaling. While it meets USB 2.0 (480 Mbps) and MIPI D-PHY (1–2 Gbps) needs, higher-speed interfaces demand lower capacitance to avoid eye diagram closure. For HDMI 2.0/2.1 or DisplayPort 1.4+, consider onsemi's ESD7504MUTAG (2.5 pF) only for stub protection, or dedicated ultra-low-capacitance arrays like NUP4201MR6T1G (0.35 pF).
Is the ESD6100 compliant with RoHS and REACH regulations?
Yes, the ESD6100 is RoHS II compliant (2011/65/EU) and meets REACH SVHC requirements per onsemi's material declarations. Its WLCSP4 package is lead-free (Pb-free), and all homogeneous materials pass the 0.1 wt% lead threshold. Certificate of Compliance (CoC) and substance declaration reports are available through onsemi's Product Change Notification (PCN) portal and Aetrix Electronics' quality documentation library upon request.
ESD6100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 4-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 9.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.8x0.8)
ESD6100 FAQ
1.How can I place an order for ESD6100 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD6100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD6100 reliable?
The price and inventory of ESD6100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD6100 is usually 5 days.
3.What payment methods are accepted for ESD6100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD6100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD6100?
ESD6100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD6100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD6100?
For technical support, including ESD6100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD6100 requirements.
6.How does Aetrix verify that ESD6100 is sourced from the original manufacturer or authorized distributors?
All ESD6100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD6100 meets industry standards.
7.What is the process for return or replacement of ESD6100?
All ESD6100 units undergo pre-shipment inspection (PSI). If there is an issue with ESD6100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD6100 part is unused and in its original packaging.
Return procedure for ESD6100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD6100 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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