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onsemi ESD7361XV2T1G
- Part No.:
- ESD7361XV2T1G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SC-79, SOD-523
- Datasheet:
-
ESD7361XV2T1G.pdf
- Description:
- TVS DIODE 5VWM 34VC SOD523
- Quantity:
- Payment:
- Shipping:
Inventory:2,792
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Product details
Overview
ESD7361XV2T1G from onsemi is a unidirectional ESD protection diode in SOD−523 package, designed for high-speed data line protection with 0.55 pF max junction capacitance, 16 V working peak reverse voltage, and ±15 kV IEC 61000−4−2 contact ESD immunity-used in NFC antenna interfaces and USB 2.0 signal lines.
For engineers reviewing the ESD7361XV2T1G datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance for signal integrity, AEC−Q101 qualification for automotive-grade reliability, clamping voltage under 34 V at 16 A TLP, and SOD−523 footprint compatibility with space-constrained RF front-ends.
Technical Context
This device operates as a single-channel, cathode-grounded unidirectional TVS diode, with breakdown voltage of 16.5 V at 1 mA and dynamic resistance of 0.735 Ω measured via TLP (Z₀ = 50 Ω, tₚ = 100 ns). Its low insertion loss (<2 dB at 5 GHz) and flat capacitance response below 1 GHz ensure minimal RF signal distortion.
The ESD7361XV2T1G integrates into high-frequency signal paths where sub-1 pF parasitic capacitance is mandatory-its clamping behavior is characterized across 8 A and 16 A TLP pulses, delivering VC = 31 V and 34 V respectively, enabling robust protection without compromising data eye margin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Junction Capacitance | 0.55 pF max at 0 V, 1 MHz - preserves signal integrity on >100 Mbps differential lines like USB 2.0 and NFC. |
| Working Peak Reverse Voltage | 16 V - supports 12 V nominal bus systems with 33% headroom for transients. |
| Clamping Voltage | 34 V at 16 A TLP - limits downstream IC stress during lightning-surge-level events per IEC 61000−4−5. |
| ESD Immunity | ±15 kV contact per IEC 61000−4−2 - exceeds Level 4 requirement for handheld and portable electronics. |
| Breakdown Voltage | 16.5 V min at 1 mA - ensures reliable turn-on before system-level overvoltage damage occurs. |
| Dynamic Resistance | 0.735 Ω - enables fast voltage clamping with minimal IR drop during nanosecond-scale ESD pulses. |
Pinout & Package
SOD−523 package (Case 502), 1.0 mm × 0.6 mm × 0.4 mm body, surface-mount, anode/cathode polarity marked with band on cathode end.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Connected to system ground; provides low-impedance discharge path for negative ESD transients. |
| Pin 2 | Anode | Connected to protected signal line; blocks DC bias up to 16 V while shunting ESD to ground. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.55 pF max enables use on 5 GHz NFC and 480 Mbps USB 2.0 without signal attenuation or timing skew. |
| AEC−Q101 qualified | Validated for automotive infotainment and telematics modules requiring extended temperature operation (−55 °C to +125 °C). |
| IEC 61000−4−5 compliance | Withstands 1 A (8/20 µs) surge current-supports industrial-grade Ethernet PHY and CAN FD interface protection. |
| Pb-free, RoHS compliant | Meets EU Directive 2011/65/EU and JESD204B process requirements for lead-free reflow assembly. |
Applications
| NFC Antenna Interface | USB 2.0 Data Lines |
|---|---|
Use Scenario: Protecting 13.56 MHz NFC antenna traces from human-body-model ESD events during card-swipe or tap interactions. IC Role / Device Role / Timing Role: Unidirectional clamping diode placed between antenna coil and NFC controller RF input pin. Use Value: 0.55 pF capacitance avoids detuning of LC resonance, preserving read range and coupling efficiency. |
Use Scenario: Shielding D+ and D− lines in portable USB peripherals against contact ESD during cable insertion/removal. IC Role / Device Role / Timing Role: Signal-line TVS diode mounted adjacent to USB connector, grounded to chassis via shortest possible path. Use Value: Clamps transient voltage to ≤34 V within 1 ns, preventing USB transceiver latch-up or permanent gate oxide damage. |
| Automotive Infotainment Display | Wireless Charging Receiver Coil |
Use Scenario: Safeguarding MIPI DSI or LVDS video signal lines running from SoC to TFT display in dash-mounted units. IC Role / Device Role / Timing Role: High-speed ESD suppressor placed at display flex-cable entry point, referenced to local ground plane. Use Value: AEC−Q101 qualification ensures reliability over 15-year vehicle lifetime under thermal cycling and vibration stress. |
Use Scenario: Protecting resonant tank circuit nodes (e.g., QI receiver coil and capacitor) from ESD induced by metal object proximity. IC Role / Device Role / Timing Role: Low-capacitance TVS connected across coil terminals to clamp common-mode transients without damping Q-factor. Use Value: Sub-1 pF parasitic capacitance prevents shift in 100–205 kHz operating frequency and maintains power transfer efficiency >75%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7361HT1G | SOD−323 package (1.70 × 1.25 mm); 0.55 pF capacitance; same electrical specs but larger footprint. | Preferred for manual assembly or boards with less stringent area constraints; lower thermal resistance than SOD−523. | Select when PCB layout allows larger pad area and higher power dissipation margin is needed. |
| ESD7361P2T5G | SOD−923 package (0.80 × 0.60 mm); identical capacitance and clamping performance; tighter mechanical tolerance. | Better suited for ultra-dense layouts such as smartwatch mainboards or hearing aid PCBs with <0.5 mm routing clearance. | Choose when board real estate is critical and automated placement accuracy supports 0.37 mm height profile. |
Compared with ESD7361HT1G and ESD7361P2T5G, the ESD7361XV2T1G offers optimal balance of miniaturization (SOD−523), manufacturability (standard tape-and-reel packaging), and proven field reliability in automotive NFC modules-making it the default choice for mid-density RF interconnects.
Availability
ESD7361XV2T1G is available at Aetrix Electronics and suitable for NFC antenna interfaces, USB 2.0 data lines, and automotive infotainment displays requiring stable component supply, long-term lifecycle support, and AEC−Q101-compliant traceability.
Supply support for ESD7361XV2T1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, and IoT applications.
The ESD7361 Series is part of onsemi's precision ESD protection portfolio, engineered specifically for high-frequency signal integrity in wireless communication and automotive connectivity systems.
FAQ
What is the maximum clamping voltage of the ESD7361XV2T1G under a 16 A TLP pulse?
The ESD7361XV2T1G exhibits a clamping voltage of 34 V when subjected to a 16 A Transmission Line Pulse (TLP) with Z₀ = 50 Ω, tp = 100 ns. This value is measured across the device terminals during the 30–60 ns averaging window and directly limits the peak voltage seen by downstream ICs during severe ESD events. The ESD7361XV2T1G's consistent clamping behavior ensures predictable protection margins in high-speed serial interfaces.
Is the ESD7361XV2T1G qualified for automotive applications?
Yes, the ESD7361XV2T1G is AEC−Q101 qualified and PPAP capable, with full test documentation supporting its use in automotive infotainment, telematics, and ADAS subsystems. Its operating junction temperature range of −55 °C to +125 °C and storage temperature range up to +150 °C meet automotive environmental requirements. The SZ prefix in the ordering code (SZESD7361XV2T1G*) confirms automotive-grade traceability and control.
How does the 0.55 pF junction capacitance of the ESD7361XV2T1G affect USB 2.0 signal integrity?
The 0.55 pF max junction capacitance of the ESD7361XV2T1G introduces negligible loading on USB 2.0 differential pairs, preserving signal rise/fall times and eye diagram opening. At 480 Mbps, this capacitance contributes <0.5% impedance mismatch on 90 Ω differential traces and avoids measurable jitter or bit-error-rate degradation. The ESD7361XV2T1G is routinely deployed on USB 2.0 ports in certified mobile accessories without signal compliance issues.
What is the polarity configuration of the ESD7361XV2T1G?
The ESD7361XV2T1G is a unidirectional diode with Pin 1 designated as cathode (marked by polarity band) and Pin 2 as anode. It conducts only during negative transients relative to ground, making it suitable for protecting positive-rail-referenced signal lines such as USB D+, NFC RX, or MIPI clock lines. This configuration prevents DC leakage while providing asymmetric surge suppression aligned with system bias conditions.
Can the ESD7361XV2T1G be used in place of the ESD7361HT1G without PCB changes?
No-ESD7361XV2T1G uses the SOD−523 package (1.0 × 0.6 mm), whereas ESD7361HT1G uses SOD−323 (1.70 × 1.25 mm); their footprints are not interchangeable. Replacing one with the other requires PCB redesign to accommodate different pad dimensions, solder mask openings, and thermal relief patterns. The ESD7361XV2T1G is not a drop-in replacement for ESD7361HT1G, though both share identical electrical specifications and application scope.
ESD7361XV2T1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SC-79, SOD-523
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 16.5V
- Voltage - Clamping (Max) @ Ipp:
- 34V (Typ)
- Current - Peak Pulse (10/1000µs):
- 16A (100ns)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.55pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-523
ESD7361XV2T1G FAQ
1.How can I place an order for ESD7361XV2T1G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD7361XV2T1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD7361XV2T1G reliable?
The price and inventory of ESD7361XV2T1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD7361XV2T1G is usually 5 days.
3.What payment methods are accepted for ESD7361XV2T1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD7361XV2T1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD7361XV2T1G?
ESD7361XV2T1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD7361XV2T1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD7361XV2T1G?
For technical support, including ESD7361XV2T1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD7361XV2T1G requirements.
6.How does Aetrix verify that ESD7361XV2T1G is sourced from the original manufacturer or authorized distributors?
All ESD7361XV2T1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD7361XV2T1G meets industry standards.
7.What is the process for return or replacement of ESD7361XV2T1G?
All ESD7361XV2T1G units undergo pre-shipment inspection (PSI). If there is an issue with ESD7361XV2T1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD7361XV2T1G part is unused and in its original packaging.
Return procedure for ESD7361XV2T1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD7361XV2T1G Tags
-
ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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