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onsemi ESD7383NCTBG
- Part No.:
- ESD7383NCTBG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 4-UFBGA, WLCSP
- Datasheet:
-
ESD7383NCTBG.pdf
- Description:
- TVS DIODE 3VWM 10VC 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:11,837
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Product details
Overview
ESD7383NCTBG from onsemi is a 3-line, ultra-low-capacitance ESD protection diode in WLCSP4 (0.4 mm pitch, 0.8×0.8 mm) package, compliant with IEC 61000-4-2 ±8 kV contact discharge, featuring 1.5 pF typical channel capacitance, 10 V positive clamp voltage at 1 A, and 0.6 Ω dynamic resistance - deployed for high-speed USB 2.0 (480 Mb/s) interface protection.
For engineers reviewing the ESD7383NCTBG datasheet, pinout, applications, or equivalent options, key selection criteria include sub-2 pF channel capacitance matching, ±8 kV IEC 61000-4-2 rating, low clamping voltage under 10 V, and WLCSP4 footprint compatibility with space-constrained USB OTG and mobile port designs.
Technical Context
The ESD7383NCTBG integrates three independent bidirectional ESD protection channels in a single 4-bump wafer-level chip-scale package, each channel configured as a low-capacitance TVS diode pair between I/O and GND. Its design targets signal integrity preservation in high-frequency digital interfaces.
It operates within −40°C to +85°C junction temperature range, supports 3.0–5.5 V supply rail compatibility, and delivers matched channel capacitance (±0.02 pF variation), enabling uniform transient response across all three protected lines without skew-induced timing distortion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IEC 61000-4-2 Rating | ±8 kV contact discharge - meets highest system-level ESD immunity requirement for portable USB devices |
| Channel Capacitance (CIN) | 1.5 pF typical at 1 MHz - preserves signal integrity up to 480 Mb/s USB 2.0 high-speed data rates |
| Clamp Voltage (VCL) | +10 V / −1.5 V at 1 A, 8/20 µs - limits transient overvoltage to safe levels for downstream PHY transceivers |
| Dynamic Resistance (RDYN) | 0.6 Ω (positive) / 0.5 Ω (negative) - ensures rapid energy shunting with minimal voltage overshoot |
| Breakdown Voltage (VBR) | 6 V minimum at 8 mA - provides robust margin above 5.5 V max operating supply while avoiding false triggering |
| Leakage Current (IR) | 100 nA max at 3 V reverse bias - prevents measurable DC loading on sensitive analog or reference lines |
Pinout & Package
Package: WLCSP4 (0.8 mm × 0.8 mm, 0.4 mm pitch), Case 567CB, RoHS II compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD Channel 1 I/O | Protected signal line 1 - connects directly to USB D+ or other high-speed data line |
| A2 | Ground (GND) | Common return path for all three ESD channels - must be low-inductance connection to system ground plane |
| B1 | ESD Channel 2 I/O | Protected signal line 2 - connects directly to USB D− or second high-speed interface line |
| B2 | ESD Channel 3 I/O | Protected signal line 3 - supports auxiliary line such as USB ID, VBUS sense, or OTG control |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance matching | 0.02 pF max inter-channel CIN mismatch - eliminates differential skew in high-speed differential pairs |
| Triple-channel integration | Single WLCSP4 die protects three independent lines - reduces PCB area vs. discrete diodes by >60% |
| Low dynamic resistance | Sub-0.6 Ω turn-on impedance - minimizes VCL rise during fast ESD transients (tr < 1 ns) |
| IEC 61000-4-2 certified | Tested to ±8 kV contact per standard - qualifies for CE/UL/CCC certification without additional system-level retesting |
Applications
| USB 2.0 High-Speed Port | Mobile Device OTG Interface |
|---|---|
Use Scenario: Protecting D+/D− and ID lines of a smartphone or tablet USB port against repeated electrostatic discharges during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and USB PHY, operating transparently during normal 480 Mb/s signaling. Use Value: 1.5 pF capacitance avoids signal degradation; ±8 kV rating ensures compliance with IEC 61000-4-2 Level 4 without derating. | Use Scenario: Enabling reliable host/peripheral role switching in dual-role USB ports where ID line sensing must remain noise-immune. IC Role / Device Role / Timing Role: Low-leakage (100 nA) ESD clamp on ID pin - maintains accurate voltage threshold detection while blocking ESD energy. Use Value: 6 V breakdown voltage provides sufficient margin above ID logic thresholds (typically 0.5–1.2 V), preventing false role detection. |
| Industrial USB-C Docking Station | Automotive Infotainment USB Hub |
Use Scenario: Shielding upstream/downstream USB data lanes in multi-port docking stations exposed to frequent human handling in office environments. IC Role / Device Role / Timing Role: Three-channel ESD guard for D+, D−, and VBUS sense - co-located near connector to minimize stub length and inductance. Use Value: 0.6 Ω dynamic resistance ensures clamp voltage stays below 10 V even at peak 2.5 A pulse current, protecting hub controller I/O. | Use Scenario: Hardening USB ports in automotive head units against ESD events generated by passengers in low-humidity cabin conditions. IC Role / Device Role / Timing Role: ESD front-end for USB 2.0 links connecting to touchscreens, media players, or smartphone projection modules. Use Value: −40°C to +85°C operating range matches automotive cabin thermal profile; RoHS II compliance satisfies EU ELV directive. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 2-channel, 1.0 pF typical CIN, ±12 kV IEC 61000-4-2, SOT-5X3 package (1.0×1.0 mm) | Supports only two lines; larger footprint; higher ESD rating but no third channel | Choose when only D+/D− protection is needed and board space allows SOT-5X3 |
| ESD7381NCTBG | Single-channel variant of same family, identical 1.5 pF CIN, ±8 kV rating, same WLCSP4 package | Requires three separate placements for full 3-line protection - increases assembly cost and layout complexity | Choose only if channel isolation requirements mandate discrete placement per line |
Compared with TPD2E001DRYR and ESD7381NCTBG, the ESD7383NCTBG uniquely delivers triple-channel protection in the smallest possible footprint (0.8×0.8 mm), with matched capacitance and guaranteed 480 Mb/s USB 2.0 compliance - making it optimal for miniaturized, high-density USB interface designs.
Availability
ESD7383NCTBG is available at Aetrix Electronics and suitable for USB 2.0 high-speed ports, mobile OTG interfaces, and automotive infotainment systems requiring stable component supply and long-term lifecycle support.
Supply support for ESD7383NCTBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient power management, analog, sensors, and connectivity solutions.
The ESD7383NCTBG belongs to onsemi's ESD7xxx ultra-low-capacitance protection portfolio, engineered specifically for high-speed serial interfaces including USB 2.0, HDMI, and MIPI where sub-2 pF loading is mandatory.
FAQ
What is the maximum operating voltage supported by the ESD7383NCTBG?
The ESD7383NCTBG supports an input operating supply voltage range of 3.0 V to 5.5 V, as specified in its electrical characteristics table. This makes it compatible with standard USB 2.0 VBUS (5 V), I/O rails of 3.3 V microcontrollers, and mixed-voltage interface domains. The 6 V minimum breakdown voltage ensures safe operation with margin across this range without false triggering during normal signal swings.
Does the ESD7383NCTBG require external components for basic ESD protection?
No, the ESD7383NCTBG is a fully integrated, standalone ESD protection device requiring no external capacitors, resistors, or inductors. Its internal bidirectional TVS structure connects each I/O pin directly to ground through low-capacitance junctions. Layout best practice mandates short, low-inductance traces from each protected line to its corresponding pin (A1, B1, B2) and a solid, low-impedance connection from A2 (GND) to the system ground plane.
How does the ESD7383NCTBG achieve 480 Mb/s USB 2.0 compliance?
The ESD7383NCTBG achieves 480 Mb/s USB 2.0 compliance primarily through its 1.5 pF typical channel capacitance - low enough to avoid significant signal attenuation or rise-time degradation at 240 MHz fundamental frequency. Its matched capacitance (±0.02 pF) prevents differential skew, and its 10 V clamp voltage at 1 A ensures downstream PHY receivers remain within absolute maximum ratings during ESD events, as verified in Figure 10 of the official datasheet.
Is the ESD7383NCTBG suitable for automotive applications?
Yes, the ESD7383NCTBG is suitable for automotive infotainment and telematics applications due to its −40°C to +85°C operating junction temperature range, RoHS II compliance, and qualification to IEC 61000-4-2 ±8 kV contact discharge - a requirement for many OEM ESD test plans. It is not AEC-Q200 qualified, so for safety-critical powertrain or ADAS subsystems, additional validation per customer requirements is necessary.
What is the meaning of "WLCSP4" in the ESD7383NCTBG package description?
WLCSP4 denotes a 4-bump Wafer-Level Chip-Scale Package with dimensions of 0.8 mm × 0.8 mm and 0.4 mm pitch, per Case 567CB mechanical outline. Each bump serves as a solderable terminal: A1, A2 (GND), B1, and B2. This ultra-compact, bottom-terminal package enables direct die attachment to PCBs with minimal parasitic inductance - critical for preserving high-frequency ESD response and minimizing layout area in space-constrained mobile and portable designs.
ESD7383NCTBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 4-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 10V
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- Yes
- Applications:
- USB OTG
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.8x0.8)
ESD7383NCTBG FAQ
1.How can I place an order for ESD7383NCTBG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD7383NCTBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD7383NCTBG reliable?
The price and inventory of ESD7383NCTBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD7383NCTBG is usually 5 days.
3.What payment methods are accepted for ESD7383NCTBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD7383NCTBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD7383NCTBG?
ESD7383NCTBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD7383NCTBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD7383NCTBG?
For technical support, including ESD7383NCTBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD7383NCTBG requirements.
6.How does Aetrix verify that ESD7383NCTBG is sourced from the original manufacturer or authorized distributors?
All ESD7383NCTBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD7383NCTBG meets industry standards.
7.What is the process for return or replacement of ESD7383NCTBG?
All ESD7383NCTBG units undergo pre-shipment inspection (PSI). If there is an issue with ESD7383NCTBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD7383NCTBG part is unused and in its original packaging.
Return procedure for ESD7383NCTBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD7383NCTBG Tags
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onsemi
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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