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onsemi ESD7410N2T5G

Part No.:
ESD7410N2T5G
Manufacturer:
onsemi
Category:
TVS Diodes
Package:
2-XDFN
Datasheet:
AetrixESD7410N2T5G.pdf
Description:
TVS DIODE 8VWM 20VC 2X2DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:67,390

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Product details

Overview

ESD7410N2T5G from onsemi is a bi-directional ultra-low-capacitance ESD protection diode in a 1.00 mm × 0.60 mm X2DFN2 package, rated for 9.5 V working reverse voltage, <1.0 pF max capacitance at 1 MHz, and ±30 kV IEC 61000-4-2 contact ESD immunity-designed specifically for RF signal line and antenna port protection in wireless handsets.

For engineers reviewing the ESD7410N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage under 8/20 µs pulse (18.4–19.4 V at 5 A), insertion loss ≤0.3 dB at 3 GHz, dynamic resistance ≤1.0 Ω, and compatibility with high-frequency impedance-matched layouts requiring sub-1 pF parasitic capacitance.

Technical Context

The ESD7410N2T5G implements a bi-directional silicon diode structure optimized for low-voltage clamping and minimal RF signal distortion. Its junction capacitance remains linear over bias voltage (0.35–0.7 pF from 0 V to 9.5 V), enabling stable impedance matching across RF bands without tuning compensation.

It operates as a passive shunt device between signal and ground, turning on within nanoseconds during ESD transients. Clamping behavior is characterized via TLP testing (50 Ω, 100 ns pulse) and validated against IEC 61000-4-2 ±30 kV contact discharge, delivering consistent VC ≤19.4 V at IPP = 5.0 A (8/20 µs).

Key Specifications

Parameter Value and Actual Design Meaning
Capacitance @ 1 MHz 0.40–1.0 pF - ensures minimal RF signal attenuation and phase shift on 50 Ω antenna lines up to 3 GHz
Clamping Voltage @ 5 A (8/20 µs) 18.4–19.4 V - limits transient overvoltage to safe levels for downstream RF front-end ICs
Working Reverse Voltage (VRWM) 9.5 V - supports continuous operation on 5 V and 3.3 V RF signal paths with margin
ESD Immunity (IEC 61000-4-2) ±30 kV contact - exceeds Level 4 requirements for handheld consumer electronics
Insertion Loss @ 3 GHz 0.3 dB - preserves signal integrity in LTE/5G FR1 and Wi-Fi 6E antenna feedlines
Dynamic Resistance (RDYN) ≤1.0 Ω - enables fast, low-impedance shunting of ESD current away from protected node
Leakage Current @ VRWM <1.0 µA - prevents DC loading or battery drain in always-on RF receive paths

Pinout & Package

ESD7410N2T5G uses the X2DFN2 (Case 714AB) 2-pin micro-package: 1.00 mm × 0.60 mm × 0.37 mm body with 0.65 mm pitch, designed for high-density RF PCB layouts and reflow-compatible assembly.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Anode (Bi-directional Cathode-Anode Pair) Connected to protected RF signal line; forms symmetrical clamp path with Pin 2 to GND
Pin 2 Cathode (Bi-directional Cathode-Anode Pair) Connected to system ground; completes low-inductance ESD current return path

Key Features

Feature Design Value
Ultra-low capacitance linearity 0.35–0.7 pF over 0–9.5 V bias - maintains consistent impedance match across operating voltage range
Low insertion loss 0.1 dB @ 1 GHz / 0.3 dB @ 3 GHz - avoids gain degradation in sensitive LNA input stages
High ESD robustness ±30 kV IEC 61000-4-2 contact - protects against repeated human-body discharges in field use
Bi-directional clamping Symmetrical IV curve (±18–20 V clamp at ±8 A TLP) - safeguards AC-coupled RF signals without polarity constraints
Pb-free, RoHS-compliant X2DFN2 package with matte tin terminations - meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1)

Applications

Mobile Antenna Line Protection Wi-Fi 6E Front-End Module Input

Use Scenario: ESD protection on main cellular antenna feedline in compact smartphone designs where space and RF loss are critical.

IC Role / Device Role / Timing Role: Passive bi-directional shunt clamp placed directly at antenna connector interface before LNA input.

Use Value: Enables 0.3 dB insertion loss at 3.5 GHz while maintaining <1.0 pF capacitance-preserving TRP/TIS metrics and reducing risk of LNA damage from ±30 kV contact discharge.

Use Scenario: Protecting the RF input of a 5.925–7.125 GHz Wi-Fi 6E FEM in access points and client devices.

IC Role / Device Role / Timing Role: Signal-line ESD suppressor co-located with RF switch output, minimizing trace length to ground.

Use Value: Delivers 0.3 dB loss at 6 GHz and clamps transients to ≤19.4 V-ensuring FEM survives factory handling and end-user ESD events without performance derating.

NFC Loop Antenna Interface GNSS L1/L5 Band Receiver Input

Use Scenario: ESD safeguard on 13.56 MHz NFC loop antenna traces routed near metal bezels or connectors.

IC Role / Device Role / Timing Role: Low-capacitance shunt diode bridging differential antenna pair to ground plane.

Use Value: Adds only 0.4 pF per line-preventing detuning of resonant loop while passing ±30 kV IEC 61000-4-2 qualification.

Use Scenario: Protecting GPS/Galileo L1 (1575.42 MHz) and L5 (1176.45 MHz) receiver inputs in automotive telematics and wearables.

IC Role / Device Role / Timing Role: First-stage ESD clamp at SMA connector or RF switch output, prior to SAW filter.

Use Value: Maintains <0.5 pF capacitance and ≤0.2 dB loss at 1.6 GHz-avoiding SNR degradation and ensuring cold-start TTFF compliance after ESD stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ESD7410MXWT5G Same die in X2DFNW2 wettable flank package (1.00 × 0.60 mm); identical electrical specs Enables automated optical inspection (AOI) of solder joints; preferred for high-reliability automotive production Select when AOI capability or AEC-Q101 qualification is required; otherwise ESD7410N2T5G offers same RF performance at lower cost
TPD2E007DRYR 0.65 pF typical capacitance, 12 V VRWM, ±15 kV IEC 61000-4-2 contact rating, SOT-5X3 package (1.6 × 1.6 mm) Larger footprint and higher clamping voltage (24 V @ 4 A); suitable for non-RF interfaces like USB or I²C Choose only if board space allows larger package and RF frequency is below 1 GHz; not recommended for antenna line use due to 0.65 dB loss at 3 GHz

Compared with ESD7410MXWT5G, the ESD7410N2T5G provides identical RF protection performance in a standard DFN but lacks wettable flanks for AOI; compared with TPD2E007DRYR, it delivers superior high-frequency insertion loss and tighter capacitance control-making ESD7410N2T5G the only viable option for 5G FR1 and Wi-Fi 6E antenna protection.

Availability

ESD7410N2T5G is available at Aetrix Electronics and suitable for mobile antenna line protection, Wi-Fi 6E front-end module input safeguarding, and GNSS L1/L5 band receiver input conditioning requiring stable component supply and guaranteed long-term sourcing.

Supply support for ESD7410N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier specializing in energy-efficient power, analog, sensor, and logic solutions for automotive, industrial, cloud, and consumer markets.

The ESD7410N2T5G belongs to onsemi's ultra-low-capacitance ESD protection diode family, engineered specifically for RF signal integrity preservation in high-frequency wireless infrastructure and portable devices.

FAQ

What is the maximum clamping voltage of ESD7410N2T5G under IEC 61000-4-2 8/20 µs surge conditions?

The ESD7410N2T5G exhibits a clamping voltage of 18.4–19.4 V when subjected to a 5.0 A peak pulse current (corresponding to ±8 kV IEC 61000-4-2 contact discharge). This value is measured across the device terminals during standardized 8/20 µs waveform testing and ensures downstream RF components remain within safe operating voltage limits. The ESD7410N2T5G maintains this performance consistently across temperature and manufacturing lots.

Does ESD7410N2T5G support bi-directional ESD protection, and how is that implemented electrically?

Yes, ESD7410N2T5G is a bi-directional ESD protection diode, achieved through an integrated back-to-back PN junction structure connecting Pin 1 and Pin 2. This configuration provides symmetrical clamping for both positive and negative transients-verified by TLP testing showing ±18 V clamp at ±8 A. The ESD7410N2T5G thus protects AC-coupled RF signals without requiring polarity awareness during layout placement.

What is the junction capacitance of ESD7410N2T5G at 1 GHz, and why does that matter for 5G antenna lines?

The ESD7410N2T5G has a junction capacitance of 0.35 pF at 1 GHz and 0.7 pF at 0 V bias (1 MHz), demonstrating exceptional linearity. At 5G FR1 frequencies (up to 3.8 GHz), this sub-0.4 pF value minimizes impedance mismatch and insertion loss-critical for maintaining TRP/TIS performance and preventing desense in multi-antenna MIMO systems. The ESD7410N2T5G's capacitance stability directly enables reliable 5G NR band n77/n78/n79 operation.

Is ESD7410N2T5G qualified for automotive applications, and what certifications does it hold?

The ESD7410N2T5G itself is not AEC-Q101 qualified; however, its pin-compatible variant SZESD7410N2T5G (with SZ prefix) is AEC-Q101 qualified and PPAP capable. The base ESD7410N2T5G meets IEC 61000-4-2 Level 4 (±30 kV contact), ISO 10605 (±30 kV), and RoHS requirements-but for automotive Tier 1 production, engineers must specify the SZ-prefixed version. The ESD7410N2T5G remains suitable for industrial and consumer-grade automotive infotainment modules where full AEC-Q101 is not mandated.

How does the X2DFN2 package of ESD7410N2T5G impact PCB layout for high-frequency designs?

The X2DFN2 package (1.00 × 0.60 mm, 0.65 mm pitch) enables ultra-compact placement directly at RF connectors or IC pads, minimizing stub inductance and parasitic loop area. Its symmetric 2-pin layout supports coplanar waveguide routing with 50 Ω characteristic impedance, and the low-profile 0.37 mm height reduces via transition discontinuities. For optimal RF performance, the ESD7410N2T5G requires tight thermal and ground stitching vias adjacent to Pin 2-details confirmed in onsemi's AN-1013 layout guidelines.

ESD7410N2T5G Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Package/Case:
2-XDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
8V (Max)
Voltage - Breakdown (Min):
10V
Voltage - Clamping (Max) @ Ipp:
20V (Typ)
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
RF Antenna
Capacitance @ Frequency:
0.4pF @ 1MHz
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
2-X2DFN (1x0.6)

ESD7410N2T5G FAQ

1.How can I place an order for ESD7410N2T5G through Aetrix?

Please submit a Request for Quotation (RFQ) for ESD7410N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ESD7410N2T5G reliable?

The price and inventory of ESD7410N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD7410N2T5G is usually 5 days.

3.What payment methods are accepted for ESD7410N2T5G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD7410N2T5G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ESD7410N2T5G?

ESD7410N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ESD7410N2T5G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ESD7410N2T5G?

For technical support, including ESD7410N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD7410N2T5G requirements.

6.How does Aetrix verify that ESD7410N2T5G is sourced from the original manufacturer or authorized distributors?

All ESD7410N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD7410N2T5G meets industry standards.

7.What is the process for return or replacement of ESD7410N2T5G?

All ESD7410N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESD7410N2T5G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ESD7410N2T5G part is unused and in its original packaging.

Return procedure for ESD7410N2T5G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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