My Inquiry
My Account
onsemi ESD7504MUTAG
- Part No.:
- ESD7504MUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
ESD7504MUTAG.pdf
- Description:
- TVS DIODE 3.3VWM 10UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,885
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESD7504MUTAG from onsemi is a unidirectional low-capacitance ESD protection diode designed for high-speed differential data lines, featuring 0.55 pF max junction capacitance (I/O to GND), ±15 kV IEC 61000−4−2 contact/air ESD rating, and 3.3 V reverse working voltage - deployed in USB 3.0, eSATA, HDMI, and DisplayPort interfaces to safeguard voltage-sensitive transceivers.
For engineers reviewing the ESD7504MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance for signal integrity, clamping voltage under ±8 kV IEC contact discharge (13.7 V / −8.1 V), UDFN10 package compatibility with high-density PCB layouts, and RoHS-compliant Pb-free construction.
Technical Context
This device implements a unidirectional TVS diode architecture optimized for I/O-to-GND protection on high-speed serial links. It delivers sub-14 V clamping at ±16 A TLP pulse (IEC Level 4 equivalent) and maintains 3.3 V working peak reverse voltage with only 1.0 µA max reverse leakage at VRWM.
The UDFN10 flow-through layout supports matched trace routing for differential pairs - pins 1/2/4/5 serve as independent I/O terminals, while pins 3 and 8 are dedicated GND connections, enabling impedance-consistent placement adjacent to USB 3.0 connectors without stubs or vias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance | 0.55 pF max (I/O to GND @ 1 MHz) - preserves signal integrity on >5 Gbps differential links like USB 3.0. |
| ESD Rating | ±15 kV contact & air per IEC 61000−4−2 Level 4 - meets industrial and consumer system-level ESD immunity requirements. |
| Clamping Voltage | 13.7 V (positive) / −8.1 V (negative) @ ±16 A TLP - limits transient overvoltage during worst-case ESD events. |
| Reverse Working Voltage | 3.3 V - matches standard I/O supply rails in USB 3.0, HDMI, and eSATA PHYs without forward bias risk. |
| Breakdown Voltage | 4.0–5.0 V @ 1 mA - ensures reliable turn-on before IC damage threshold in protected systems. |
| Junction Temp Range | −55 °C to +125 °C - supports operation in automotive cabin, industrial control, and portable computing environments. |
Pinout & Package
ESD7504MUTAG uses the UDFN10 (Case 517BB) 2.5 mm × 1.0 mm, 0.5 mm pitch package with exposed thermal pad. The flow-through configuration enables straight-line routing for differential pairs and minimizes parasitic inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4, 5 | I/O (Input/Output) | Four independent unidirectional ESD protection paths - each connects one high-speed data line (e.g., SSTX+, SSTX−, SSRX+, SSRX−) to GND. |
| 3, 8 | GND | Dedicated ground terminals - minimum one required; dual GND improves current sharing and reduces clamping impedance during multi-pin ESD events. |
| 6, 7, 9, 10 | N/C | No-connect terminals - left floating per design; no internal connection or functionality. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.55 pF max per channel - avoids signal degradation and timing skew on 5+ Gbps differential buses. |
| IEC 61000−4−2 Level 4 compliance | ±15 kV contact/air - satisfies end-equipment ESD immunity certification without external circuitry. |
| Flow-through UDFN10 layout | Pins 1–5 arranged linearly with GND at ends - enables symmetric trace routing and controlled 90 Ω differential impedance. |
| Pb-free & RoHS compliant | Halogen-free/BFR-free construction - meets global environmental regulations and reflow soldering standards (260 °C, 10 s). |
Applications
| USB 3.0 Interface Protection | eSATA 3.0 Data Line Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential lanes (SSTX+/−, SSRX+/−) between host controller and Type-A connector against user-handling ESD. IC Role / Device Role / Timing Role: Unidirectional I/O-to-GND transient voltage suppressor placed immediately after AC coupling capacitors, upstream of PHY. Use Value: Maintains <0.6 dB insertion loss at 2.5 GHz while clamping ±8 kV contact ESD to ≤13.7 V - prevents PHY latch-up or oxide breakdown. |
Use Scenario: Safeguarding eSATA 3.0 (6 Gbps) differential signaling lines from hot-plug ESD events during cable insertion/removal. IC Role / Device Role / Timing Role: Standalone ESD clamp on each data pair (TX+/−, RX+/−), routed in flow-through configuration to preserve 100 Ω differential impedance. Use Value: 0.55 pF capacitance avoids return loss degradation beyond −15 dB up to 3 GHz - ensures SATA compliance without retuning PCB stackup. |
| HDMI 1.4 Source Port Protection | DisplayPort 1.2a Cable Interface |
|
Use Scenario: Shielding HDMI 1.4 TMDS clock and data channels (CLK+, CLK−, DATA0+/−, etc.) on GPU or SoC output ports. IC Role / Device Role / Timing Role: Per-channel unidirectional ESD suppressor mounted at edge connector, referenced to local digital ground plane. Use Value: Clamps ±15 kV air discharge transients within 1 ns while adding <0.02 UI jitter - preserves pixel clock stability and video frame sync. |
Use Scenario: Securing DisplayPort 1.2a main link lanes (AUX CH, HPD, and four data lanes) against ESD during docking station attachment. IC Role / Device Role / Timing Role: Multi-channel ESD array protecting all DP differential pairs and sideband signals with shared GND return path. Use Value: Dual GND pins (3 & 8) reduce common-impedance coupling between lanes - prevents cross-talk induced by simultaneous multi-lane ESD strikes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7504DMUTAG | Same electrical specs but dual-directional configuration - symmetrical clamping for bidirectional data lines. | Suitable for legacy USB 2.0 or I²C where signal polarity reversal occurs; not recommended for USB 3.0's strictly unidirectional lanes. | Select ESD7504MUTAG for unidirectional high-speed links requiring lowest possible capacitance; choose ESD7504DMUTAG only if bidirectional clamping is mandated. |
| TPD4E05U06DQAR | 0.5 pF typical capacitance, ±12 kV IEC 61000−4−2, 3.6 V VRWM - slightly higher voltage rating but lower ESD robustness. | Better suited for 3.3 V/3.6 V mixed-signal SoCs with tighter voltage margins; lacks Level 4 air discharge margin of ESD7504MUTAG. | Prefer ESD7504MUTAG when full ±15 kV air discharge compliance is required; use TPD4E05U06DQAR where board space allows larger 1.0 mm × 1.0 mm DQA package and 3.6 V rail dominates. |
Compared with ESD7504DMUTAG and TPD4E05U06DQAR, ESD7504MUTAG uniquely balances Level 4 ESD immunity, 0.55 pF capacitance, and UDFN10 footprint - making it optimal for space-constrained USB 3.0 and DisplayPort 1.2a designs demanding both signal fidelity and system-level pass/fail certification.
Availability
ESD7504MUTAG is available at Aetrix Electronics and suitable for USB 3.0 interface protection, HDMI 1.4 source port hardening, and DisplayPort 1.2a cable interface designs requiring stable component supply across production ramps and long-life industrial programs.
Supply support for ESD7504MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
ESD7504MUTAG belongs to onsemi's ESD protection diode product line, engineered specifically for high-speed serial interface hardening - emphasizing ultra-low capacitance, precise clamping, and compact flow-through packaging for next-generation connectivity standards.
FAQ
What is the primary function of the ESD7504MUTAG in a USB 3.0 design?
The ESD7504MUTAG serves as a unidirectional I/O-to-GND ESD protection diode on USB 3.0 SuperSpeed differential lanes. It clamps transient voltages from ±15 kV IEC 61000−4−2 events to ≤13.7 V while adding only 0.55 pF capacitance - preserving signal integrity and preventing PHY damage. Its UDFN10 flow-through layout enables matched trace routing critical for maintaining 90 Ω differential impedance in ESD7504MUTAG-based USB 3.0 implementations.
Does ESD7504MUTAG support bidirectional data protocols like USB 2.0?
No - ESD7504MUTAG is explicitly unidirectional, optimized for protocols with fixed signal polarity such as USB 3.0 TX/RX lanes. For bidirectional interfaces like USB 2.0 D+/D− or I²C, onsemi offers the pin-compatible ESD7504DMUTAG variant. Using ESD7504MUTAG on bidirectional lines risks incomplete clamping during negative transients, as confirmed in the ESD7504MUTAG datasheet's electrical characteristics table under VC polarity conditions.
What is the significance of the dual GND pins (3 and 8) on ESD7504MUTAG?
Pins 3 and 8 are dedicated GND terminals that provide low-inductance return paths for ESD current from multiple I/O channels. This dual-GND structure reduces common-impedance coupling during multi-pin discharge events - a key advantage verified in ESD7504MUTAG's layout guidelines for USB 3.0. At least one GND must be connected; using both improves clamping consistency and thermal dissipation, especially under repeated ±16 A TLP stress.
Can ESD7504MUTAG be used in HDMI 2.0 or higher interfaces?
ESD7504MUTAG is validated for HDMI 1.3/1.4 (up to 3.4 Gbps) per its original application notes and layout guidance. While its 0.55 pF capacitance remains beneficial, HDMI 2.0+ (6–18 Gbps) demands stricter return loss and crosstalk control - requiring evaluation against channel simulations and physical layer testing. The ESD7504MUTAG datasheet does not specify performance above 3 GHz, so direct use in HDMI 2.0+ requires validation per system-level ESD and signal integrity requirements.
What reflow profile should be used for ESD7504MUTAG's UDFN10 package?
ESD7504MUTAG's UDFN10 (Case 517BB) package is rated for lead solder temperature up to 260 °C for 10 seconds, consistent with IPC/JEDEC J-STD-020 moisture sensitivity level 1. Reflow must follow onsemi's Soldering and Mounting Techniques Reference Manual (SOLDERRM/D), including preheat (125–150 °C), soak (150–200 °C), and peak (235–260 °C) zones. The exposed Cu pad requires appropriate stencil aperture and solder paste volume to ensure mechanical reliability and thermal conduction in ESD7504MUTAG assemblies.
ESD7504MUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 4V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- 0.55pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (2.5x1)
ESD7504MUTAG FAQ
1.How can I place an order for ESD7504MUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD7504MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD7504MUTAG reliable?
The price and inventory of ESD7504MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD7504MUTAG is usually 5 days.
3.What payment methods are accepted for ESD7504MUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD7504MUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD7504MUTAG?
ESD7504MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD7504MUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD7504MUTAG?
For technical support, including ESD7504MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD7504MUTAG requirements.
6.How does Aetrix verify that ESD7504MUTAG is sourced from the original manufacturer or authorized distributors?
All ESD7504MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD7504MUTAG meets industry standards.
7.What is the process for return or replacement of ESD7504MUTAG?
All ESD7504MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with ESD7504MUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD7504MUTAG part is unused and in its original packaging.
Return procedure for ESD7504MUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD7504MUTAG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
