Texas Instruments ESD752DCKR

Overview

ESD752DCKR from Texas Instruments is a bidirectional 2-channel ESD protection diode designed for CAN bus interface protection in automotive and industrial networks. It provides ±30 kV IEC 61000-4-2 Level 4 ESD immunity, 24 V working voltage (VRWM), 37 V clamping voltage (VCLAMP at max Ipp), and 3 pF typical I/O capacitance - enabling robust transient suppression while supporting up to 20 Mbps data rates in CAN, CAN FD, and CAN-XL systems.

For engineers reviewing the ESD752DCKR datasheet, ESD752DCKR pinout, ESD752DCKR application, or ESD752DCKR equivalent, this device delivers verified dual-line ESD protection with low dynamic resistance (0.35 Ω), minimal leakage (<50 nA at ±24 V), and SOT-SC70 (DCK) package compatibility for space-constrained CANH/CANL routing near connectors.

Technical Context

The ESD752DCKR implements a symmetric bidirectional TVS structure across two independent I/O channels referenced to a common GND terminal, enabling simultaneous protection of differential CANH and CANL lines against contact and air-gap ESD events. Its snapback-triggered breakdown (VBRF/VBRR = ±25.5–35.5 V) ensures fast response with low clamping during 8/20 µs surges.

Thermal design is supported by RθJA = 283.0 °C/W (DCK package) and junction-to-board thermal resistance of 105.1 °C/W, allowing reliable operation from –55 °C to +150 °C. The 3 pF line capacitance per channel is measured at 1 MHz with 30 mVpp bias and remains stable across ±24 V DC bias, preserving signal integrity in high-speed CAN variants.

Key Specifications

Pinout & Package

SOT-SC70 (DCK) package: 3-pin surface-mount, 2.00 mm × 1.25 mm body size, 1.1 mm max height, moisture sensitivity level 3 (260 °C peak reflow, 168 hr floor life).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESD752DCKR, ESD752DBZR offers superior thermal dissipation in thermally demanding locations, while ESD752DXAR delivers the smallest PCB footprint - all three share identical VRWM, VCLAMP, capacitance, and ESD ratings, enabling direct functional substitution with only mechanical layout adaptation.

Availability

ESD752DCKR is available at Aetrix Electronics and suitable for automotive ECU designs, industrial CANopen nodes, 4–20 mA loop interfaces, and precision ADC input protection requiring stable component supply across production lifecycles.

Supply support for ESD752DCKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components for automotive, industrial, and communications markets.

The ESD752 series belongs to TI's automotive-grade ESD protection portfolio, engineered specifically for robust differential bus protection in safety-critical CAN, LIN, and FlexRay networks with stringent AEC-Q101 qualification requirements.

FAQ

What is the maximum data rate supported by ESD752DCKR without signal degradation?

ESD752DCKR supports data rates up to 20 Mbps due to its 3 pF typical I/O capacitance and low dynamic resistance (0.35 Ω), which preserve signal edge integrity in CAN FD and CAN-XL protocols. Measured capacitance remains stable across ±24 V bias, ensuring consistent timing margins in high-speed differential signaling - a key requirement validated in TI's ESD752DCKR characterization reports.

Does ESD752DCKR meet automotive ESD standards such as ISO 10605?

Yes, ESD752DCKR exceeds ISO 10605 requirements with ±30 kV contact and air-gap discharge capability per IEC 61000-4-2 Level 4, and is qualified to AEC-Q101 for automotive use. Its 24 V VRWM withstands battery reverse-connection events, and its 37 V clamping voltage ensures protected CAN transceivers remain within their 58 V absolute maximum rating during full-system ESD testing - confirmed in TI's production test data for ESD752DCKR.

How does the SOT-SC70 (DCK) package of ESD752DCKR compare thermally to other variants?

The ESD752DCKR in SOT-SC70 has RθJA = 283.0 °C/W and RθJB = 105.1 °C/W, offering better board-level heat transfer than the SOT-23 variant (RθJB = 131.1 °C/W) but slightly lower than the DFN1110 (RθJB = 127.4 °C/W). This makes ESD752DCKR well-suited for moderate-power-density automotive modules where footprint and thermal performance must be balanced - a specification confirmed in TI's SLVSJ54A thermal metrics table for ESD752DCKR.

Can ESD752DCKR protect both CANH and CANL lines simultaneously with a single device?

Yes, ESD752DCKR integrates two independent bidirectional TVS channels (Pins 1 and 2) sharing a common GND (Pin 3), enabling complete differential CAN bus protection with one component. Its pinout matches standard CANH/CANL routing, and its symmetrical ±25.5–35.5 V breakdown ensures equal clamping on both polarities - a configuration explicitly shown in TI's ESD752DCKR typical application diagram and verified in functional testing.

What is the leakage current of ESD752DCKR at its maximum working voltage?

ESD752DCKR exhibits ±50 nA maximum leakage current at ±24 V DC (VRWM), measured per channel with IO-to-GND bias. This ultra-low leakage avoids loading effects on precision 4–20 mA loops or high-impedance ADC inputs, and remains stable across temperature (≤1 nA at –55 °C and 25 °C), as documented in TI's SLVSJ54A Electrical Characteristics table for ESD752DCKR.