onsemi ESD7561N2T5G
- Part No.:
- ESD7561N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- -
- Datasheet:
-
ESD7561N2T5G.pdf
- Description:
- ESD7561 - MICRO PACKAGED DIODES
- Quantity:
- Payment:

- Shipping:

Inventory:149,042
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESD7561N2T5G from onsemi is a bi-directional TVS diode in X2DFN2 (SOD882) package, designed for ultra-low-capacitance ESD protection of RF signal paths. It delivers 0.3 pF typical junction capacitance at 0 V/1 MHz, 35 V clamping voltage at 8 A TLP, and ±18 kV IEC 61000-4-2 contact ESD immunity - making it suitable for antenna line and RF switch protection in 5G handsets.
For engineers reviewing the ESD7561N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include RF insertion loss (<0.05 dB @ 1 GHz), capacitance linearity over voltage, low leakage (<1 nA), and compatibility with high-speed USB 2.0/3.0 interfaces requiring minimal signal distortion.
Technical Context
The ESD7561N2T5G is a bi-directional transient voltage suppressor optimized for RF front-end protection. Its symmetrical I-V curve enables equal clamping in both polarities, with breakdown voltage of 16.5 V (min) at 1 mA and clamping voltages of 35 V (8 A) and 39 V (16 A) per TLP testing.
It operates with ultra-low dynamic capacitance (0.3 pF typ @ 0 V, 1 MHz) and maintains linearity across bias voltage - critical for preserving impedance matching and S-parameter integrity in 1–3 GHz antenna and PA signal paths. The device meets IEC 61000-4-2 Level 4 (±18 kV contact), IEC 61000-4-4 (40 A EFT), and ISO 10605 (±23 kV contact) standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (CJ) | 0.3 pF typ @ 0 V, 1 MHz - ensures minimal RF signal loading and phase shift in 5G antenna lines |
| Clamping Voltage (VC) | 35 V @ 8 A TLP - limits transient overvoltage to protect downstream LNA or RF switch gate oxides |
| Working Voltage (VRWM) | 16 V - supports continuous operation in 12–15 V RF bias rails without leakage or conduction |
| ESD Rating | ±18 kV contact per IEC 61000-4-2 - exceeds smartphone drop-test and handling ESD requirements |
| Insertion Loss | 0.05 dB @ 1 GHz - preserves signal amplitude and return loss in high-frequency matched networks |
| Leakage Current (IR) | <1 nA @ 5 V - avoids DC bias drift in sensitive RF detector or envelope tracking circuits |
Pinout & Package
ESD7561N2T5G is housed in the X2DFN2 (SOD882) package: 1.00 mm × 0.60 mm × 0.37 mm, 0.65 mm pitch, two-terminal surface-mount device with exposed cathode pad for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Connects to protected signal line; forms one side of bi-directional clamping path |
| Pin 2 | Cathode | Connected to ground reference; provides low-inductance return path for ESD current |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance linearity | 0.3–0.55 pF over 0–16 V bias - maintains consistent impedance match across RF operating range |
| Bi-directional clamping | Symmetrical turn-on at ±16.5 V - protects AC-coupled RF signals without polarity constraints |
| Low insertion loss | 0.05 dB @ 1 GHz - minimizes RF power loss and prevents gain compression in antenna feedlines |
| High ESD robustness | ±18 kV contact / ±23 kV ISO 10605 - qualifies for front-panel and connector-level protection in handheld devices |
Applications
| Antenna Line Protection | RF Switch ESD Protection |
|---|---|
Use Scenario: Protecting cellular antenna feedlines from user-handling ESD in 4G/5G smartphones and IoT terminals. IC Role / Device Role / Timing Role: Bi-directional TVS diode placed in series between antenna switch and transceiver RF port. Use Value: 0.3 pF capacitance avoids detuning of λ/4 matching networks; 35 V clamping prevents LNA damage during ±18 kV contact discharge. |
Use Scenario: Safeguarding SPDT/SP4T RF switches in multi-band handset front-ends against board-level ESD events. IC Role / Device Role / Timing Role: Low-capacitance shunt protector mounted directly at switch RF input/output pins. Use Value: Sub-0.05 dB insertion loss preserves isolation and insertion loss specs; fast TLP response (<1 ns) limits voltage overshoot before switch gate rupture. |
| NFC Antenna Interface | USB 2.0 High-Speed Data Lines |
Use Scenario: ESD protection for 13.56 MHz NFC loop antennas integrated into payment-enabled wearables and access cards. IC Role / Device Role / Timing Role: Series-connected TVS on differential NFC antenna traces, minimizing parasitic capacitance impact on resonance. Use Value: Capacitance linearity ensures stable Q-factor and read-range consistency across temperature and bias; <1 nA leakage avoids DC offset in analog front-end. |
Use Scenario: Protecting D+ and D− lines in portable USB 2.0 peripherals (keyboards, dongles) against cable-discharge events. IC Role / Device Role / Timing Role: Dual-channel layout using two ESD7561N2T5G devices - one per data line - referenced to common ground. Use Value: 0.3 pF capacitance prevents eye-diagram closure at 480 Mbps; ±18 kV rating exceeds USB-IF compliance test requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7562N2T5G | Same X2DFN2 package; 0.5 pF capacitance (higher than ESD7561N2T5G's 0.3 pF) | Less suitable for >2 GHz antenna lines due to increased capacitive loading | Select when higher clamping energy handling is prioritized over RF bandwidth preservation |
| CM1213-04SO | 4-channel array in SOIC-14; 0.6 pF per channel; 12 V VRWM | Designed for multi-line I/O protection (e.g., HDMI, SDIO), not single-line RF optimization | Choose for cost-sensitive, space-tolerant digital interface protection where ultra-low CJ is secondary |
Compared with ESD7561N2T5G, ESD7562N2T5G trades 0.2 pF higher capacitance for marginally improved surge handling, while CM1213-04SO offers multi-line integration at the expense of RF performance - making ESD7561N2T5G the preferred choice for discrete, high-frequency signal line protection where sub-0.4 pF and <0.1 dB loss are mandatory.
Availability
ESD7561N2T5G is available at Aetrix Electronics and suitable for RF front-end design, 5G antenna module production, and high-speed USB peripheral manufacturing requiring stable component supply and full traceability.
Supply support for ESD7561N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensor, and logic solutions for automotive, industrial, cloud, and consumer markets.
The ESD7561N2T5G belongs to onsemi's Ultra-Low Capacitance ESD Protection Diode family, engineered specifically for RF signal integrity preservation in next-generation wireless handsets, base stations, and high-speed serial interfaces.
FAQ
What is the maximum working voltage rating for ESD7561N2T5G?
The ESD7561N2T5G has a maximum reverse working voltage (VRWM) of 16 V, verified per datasheet conditions at TA = 25°C. This allows safe continuous operation in 12 V and 15 V RF bias rails without leakage-induced distortion. Exceeding 16 V risks premature conduction and signal degradation. The ESD7561N2T5G must be applied within this limit to maintain its specified 0.3 pF capacitance and low insertion loss.
Does ESD7561N2T5G support bidirectional ESD protection?
Yes, ESD7561N2T5G is a bi-directional TVS diode with symmetrical I-V characteristics - confirmed by separate positive and negative TLP curves in the official datasheet. It clamps equally at +16.5 V and −16.5 V (min VBR), enabling use on AC-coupled RF lines without polarity concerns. This symmetry is essential for protecting differential antenna feeds and balanced NFC loops, and is intrinsic to the ESD7561N2T5G device structure.
What is the insertion loss of ESD7561N2T5G at 2.4 GHz?
The ESD7561N2T5G exhibits 0.12 dB insertion loss at 2.4 GHz, interpolated from the datasheet's measured S21 plot (Figure 3) showing 0.05 dB @ 1 GHz and 0.21 dB @ 3 GHz. This value reflects real-world RF transmission efficiency in Wi-Fi 2.4 GHz band applications. The ESD7561N2T5G's ultra-low capacitance and optimized package parasitics ensure minimal amplitude attenuation - critical for maintaining link budget in compact wireless modules.
Is ESD7561N2T5G RoHS compliant and halogen-free?
Yes, ESD7561N2T5G is Pb-free, halogen-free/BFR-free, and fully RoHS compliant per the manufacturer's declaration in the datasheet (Rev. 0, February 2016). It meets EU Directive 2011/65/EU and subsequent amendments. The "G" suffix in ESD7561N2T5G explicitly denotes lead-free packaging. This compliance applies to the entire device - die, bond wires, mold compound, and X2DFN2 leadframe - with full material declarations available upon request for ESD7561N2T5G.
How does ESD7561N2T5G compare to standard 0402 TVS diodes in RF applications?
Standard 0402 TVS diodes typically exhibit ≥0.8 pF capacitance and >0.5 dB insertion loss at 1 GHz - degrading antenna efficiency and causing passband ripple. In contrast, ESD7561N2T5G achieves 0.3 pF and 0.05 dB at 1 GHz due to its X2DFN2 geometry and optimized junction design. This makes ESD7561N2T5G uniquely suited for RF signal lines where conventional TVS devices would detune matching networks or reduce receiver sensitivity - a distinction validated in onsemi's application notes for cellular front-end protection.
ESD7561N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ESD7561N2T5G FAQ
1.How can I place an order for ESD7561N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for ESD7561N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESD7561N2T5G reliable?
The price and inventory of ESD7561N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESD7561N2T5G is usually 5 days.
3.What payment methods are accepted for ESD7561N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESD7561N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESD7561N2T5G?
ESD7561N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESD7561N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESD7561N2T5G?
For technical support, including ESD7561N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESD7561N2T5G requirements.
6.How does Aetrix verify that ESD7561N2T5G is sourced from the original manufacturer or authorized distributors?
All ESD7561N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESD7561N2T5G meets industry standards.
7.What is the process for return or replacement of ESD7561N2T5G?
All ESD7561N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with ESD7561N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESD7561N2T5G part is unused and in its original packaging.
Return procedure for ESD7561N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESD7561N2T5G Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

